EPF6024ABI256-2
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Altera EPF6024ABI256-2

Part Number:
EPF6024ABI256-2
Manufacturer:
Altera
Ventron No:
3134218-EPF6024ABI256-2
Description:
IC FPGA 218 I/O 256BGA
ECAD Model:
Datasheet:
FLEX 6000 Device Family Data Sheet
Payment:
Payment
Delivery:
Delivery

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Reference Price ( In US Dollars )

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Unit Price

Ext Price

  • 1

    $24.7293

    $24.73

  • 200

    $9.5696

    $1913.92

  • 500

    $9.2347

    $4617.35

  • 1000

    $9.0681

    $9068.10

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Part Overview
Description
The FLEX 6000 family of programmable logic devices (PLDs) offers a low-cost, programmable alternative to high-volume gate array applications. With its register-rich, look-up table (LUT)-based architecture, the FLEX 6000 provides typical gates ranging from 5,000 to 24,000. The OptiFLEX architecture increases device area efficiency, while the built-in low-skew clock distribution tree ensures reliable performance.

Features
Register-rich, LUT-based architecture
OptiFLEX architecture for increased device area efficiency
Typical gates ranging from 5,000 to 24,000
Built-in low-skew clock distribution tree
100% functional testing of all devices
In-circuit reconfigurability (ICR)
5.0-V devices compliant with PCI Local Bus Specification, Revision 2.2
Built-in JTAG boundary-scan test (BST) circuitry
MultiVolt I/O interface operation
Low power consumption (typical specification less than 0.5 mA in standby mode)
3.3-V devices support hot-socketing

Applications
The FLEX 6000 family is ideal for a wide range of applications, including:
Prototyping and design testing
Low-volume production
Bridging between systems operating at different voltages
Applications requiring in-circuit reconfigurability
Specifications
Altera EPF6024ABI256-2 technical specifications, attributes, parameters and parts with similar specifications to Altera EPF6024ABI256-2.
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    256-BBGA
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~100°C TJ
  • Packaging
    Tray
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    FLEX 6000
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    3 (168 Hours)
  • Voltage - Supply
    3V~3.6V
  • Base Part Number
    EPF6024
  • Number of I/O
    218
  • Number of Logic Elements/Cells
    1960
  • Number of Gates
    24000
  • Number of LABs/CLBs

    Number of Labs/Clbs (Number of Laboratories/Clubs) is a parameter that specifies the number of laboratories or clubs that are associated with a particular electronic component. This parameter is typically used to indicate the level of support that is available for the component, as well as the number of people who are familiar with its use. A higher number of labs/clubs indicates that the component is more widely used and supported, which can be beneficial for users who need assistance with its implementation or troubleshooting.

    196
  • RoHS Status
    Non-RoHS Compliant
Product Comparison
The three parts on the right have similar specifications to EPF6024ABI256-2.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Operating Temperature
    Packaging
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Voltage - Supply
    Base Part Number
    Number of I/O
    Number of Logic Elements/Cells
    Number of Gates
    Number of LABs/CLBs
    RoHS Status
    Surface Mount
    JESD-609 Code
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Power Supplies
    Clock Frequency
    Number of Inputs
    Programmable Logic Type
    Output Function
    Number of Dedicated Inputs
    Length
    Height Seated (Max)
    Width
    Reach Compliance Code
    Reflow Temperature-Max (s)
    Additional Feature
    View Compare
  • EPF6024ABI256-2
    EPF6024ABI256-2
    Surface Mount
    256-BBGA
    -40°C~100°C TJ
    Tray
    FLEX 6000
    Obsolete
    3 (168 Hours)
    3V~3.6V
    EPF6024
    218
    1960
    24000
    196
    Non-RoHS Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • EPF6024ABC256-1
    Surface Mount
    256-BBGA
    0°C~85°C TJ
    Tray
    FLEX 6000
    Obsolete
    3 (168 Hours)
    3V~3.6V
    EPF6024
    218
    1960
    24000
    196
    Non-RoHS Compliant
    YES
    e0
    256
    3A991
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    220
    3.3V
    1.27mm
    30
    S-PBGA-B256
    218
    Not Qualified
    2.5/3.33.3V
    172MHz
    218
    LOADABLE PLD
    MACROCELL
    4
    27mm
    2.3mm
    27mm
    -
    -
    -
  • EPF6010ATC100-1N
    Surface Mount
    100-TQFP
    0°C~85°C TJ
    Tray
    FLEX 6000
    Obsolete
    3 (168 Hours)
    3V~3.6V
    EPF6010
    71
    880
    10000
    88
    RoHS Compliant
    YES
    e3
    100
    EAR99
    Matte Tin (Sn)
    8542.39.00.01
    -
    -
    QUAD
    GULL WING
    260
    3.3V
    0.5mm
    -
    S-PQFP-G100
    -
    Not Qualified
    -
    172MHz
    -
    LOADABLE PLD
    MACROCELL
    4
    14mm
    1.27mm
    14mm
    compliant
    40
    -
  • EPF6016ATI100-2N
    Surface Mount
    100-TQFP
    -40°C~100°C TJ
    Tray
    FLEX 6000
    Obsolete
    3 (168 Hours)
    3V~3.6V
    EPF6016
    81
    1320
    16000
    132
    RoHS Compliant
    YES
    e3
    100
    EAR99
    Matte Tin (Sn)
    8542.39.00.01
    -
    -
    QUAD
    GULL WING
    260
    3.3V
    0.5mm
    -
    S-PQFP-G100
    -
    Not Qualified
    -
    153MHz
    -
    LOADABLE PLD
    MACROCELL
    4
    14mm
    1.27mm
    14mm
    compliant
    40
    ALSO CONFIGURABLE WITH 5V VCC
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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