EPF10K10AQI208-3
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Altera EPF10K10AQI208-3

Part Number:
EPF10K10AQI208-3
Manufacturer:
Altera
Ventron No:
3134219-EPF10K10AQI208-3
Description:
IC FPGA 134 I/O 208QFP
ECAD Model:
Datasheet:
FLEX 10K
Payment:
Payment
Delivery:
Delivery

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Reference Price ( In US Dollars )

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Unit Price

Ext Price

  • 1

    $13.7772

    $13.78

  • 200

    $5.3326

    $1066.52

  • 500

    $5.1443

    $2572.15

  • 1000

    $5.0517

    $5051.70

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Part Overview
Description
The FLEX 10K and FLEX 10KA families are the industry's first embedded programmable logic devices (PLDs), providing System-on-a-Programmable-Chip (SOPC) integration. They feature an embedded array for implementing megafunctions, such as efficient memory and specialized logic functions, as well as a logic array for general logic functions.

Features
High density: 10,000 to 250,000 typical gates
Up to 40,960 RAM bits; 2,048 bits per embedded array block (EAB), all of which can be used without reducing logic capacity
MultiVolt I/O interface support:
5.0-V tolerant input pins in FLEX 10KA devices
Support for PCI Local Bus Specification, Revision 2.2
Pull-up clamping diode in FLEX 10KA devices for 3.3-V PCI compliance
Support for 5.0-V PCI buses with eight or fewer loads
Low power consumption: typical specification less than 0.5 mA in standby mode for most devices
Built-in JTAG boundary-scan test (BST) circuitry compliant with IEEE Std. 1149.1-1990, available without consuming any device logic

Applications
The FLEX 10K and FLEX 10KA families are ideal for a wide range of applications, including:
System-on-a-chip (SoC) designs
Embedded control systems
Industrial automation
Telecommunications
Networking
Consumer electronics
Specifications
Altera EPF10K10AQI208-3 technical specifications, attributes, parameters and parts with similar specifications to Altera EPF10K10AQI208-3.
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    208-BFQFP
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C TA
  • Packaging
    Tray
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    FLEX-10KA®
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    3 (168 Hours)
  • Voltage - Supply
    3V~3.6V
  • Base Part Number
    EPF10K10
  • Number of I/O
    134
  • Number of Logic Elements/Cells
    576
  • Total RAM Bits

    Total Ram Bits is a parameter that specifies the total number of bits that can be stored in a random access memory (RAM) chip. It is typically expressed in megabits (Mb) or gigabits (Gb). The higher the Total Ram Bits, the more data the RAM chip can store. This parameter is important for determining the amount of memory that is available to a computer system.

    6144
  • Number of Gates
    31000
  • Number of LABs/CLBs

    Number of Labs/Clbs (Number of Laboratories/Clubs) is a parameter that specifies the number of laboratories or clubs that are associated with a particular electronic component. This parameter is typically used to indicate the level of support that is available for the component, as well as the number of people who are familiar with its use. A higher number of labs/clubs indicates that the component is more widely used and supported, which can be beneficial for users who need assistance with its implementation or troubleshooting.

    72
  • RoHS Status
    Non-RoHS Compliant
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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