Altera EP4SGX180FF35I3N

EP4SGX180FF35I3N Overview
The package or case for this particular electronic component is a 1152-BBGA or FCBGA, which stands for Ball Grid Array and Flip Chip Ball Grid Array, respectively. This means that the component has a large number of pins or balls on the bottom of the package, making it suitable for high-density applications. It is also surface mountable, meaning it can be directly mounted onto a circuit board without the need for through-hole soldering. The packaging for this component is in the form of a tray, which is a common method for transporting and storing electronic components. The ECCN code for this component is 3A001.A.7.A, indicating that it is subject to export controls due to its advanced technology. Speaking of technology, this component uses CMOS technology, which is known for its low power consumption and high speed. The maximum reflow temperature for this component is 40 seconds, as specified by the JESD-30 code S-PBGA-B1152. It has a total of 564 outputs, making it suitable for complex and high-performance applications. The power supplies required for this component are 0.91.2/31.52.5V, meaning it can operate with a range of voltages. Finally, this component has an impressive number of logic elements or cells, with a total of 175750. This makes it a powerful and versatile component for a wide range of electronic devices.

EP4SGX180FF35I3N Features
564 I/Os
Up to 13954048 RAM bits

EP4SGX180FF35I3N Applications
There are a lot of Intel EP4SGX180FF35I3N FPGAs applications.

Software-defined radio
Embedded Vision
ASIC prototyping
Radar and Sensors
Electronic Warfare
Voice recognition
Secure Communication
Medical imaging
Industrial IoT
Security systems