EP2C20F256I8

Altera EP2C20F256I8

Part Number:
EP2C20F256I8
Manufacturer:
Altera
Ventron No:
3638637-EP2C20F256I8
Description:
IC FPGA 152 I/O 256FBGA
ECAD Model:
Datasheet:
EP2C20F256I8

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Specifications
Altera EP2C20F256I8 technical specifications, attributes, parameters and parts with similar specifications to Altera EP2C20F256I8.
  • Factory Lead Time
    8 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    256-LBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Series
    Cyclone® II
  • JESD-609 Code
    e0
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    256
  • ECCN Code
    3A991
  • Terminal Finish
    TIN LEAD
  • Additional Feature
    ALSO REQUIRES 3.3 SUPPLY
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    1.15V~1.25V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    220
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    20
  • Base Part Number
    EP2C20
  • JESD-30 Code
    S-PBGA-B256
  • Number of Outputs
    136
  • Qualification Status
    Not Qualified
  • Power Supplies
    1.21.5/3.33.3V
  • Number of I/O
    152
  • Clock Frequency
    402.5MHz
  • Number of Inputs
    152
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    18752
  • Total RAM Bits
    239616
  • Number of LABs/CLBs
    1172
  • Height Seated (Max)
    1.55mm
  • Length
    17mm
  • Width
    17mm
  • RoHS Status
    Non-RoHS Compliant
Description
EP2C20F256I8 Overview
The Altera brand is responsible for producing this particular part. It is a type of chip known as an Embedded - FPGAs (Field Programmable Gate Array), which falls under the category of Embedded - FPGAs (Field Programmable Gate Array). This specific part is designed to be mounted on a surface. It has a wide operating temperature range of -40°C to 100°C TJ, making it suitable for use in various environments. The number of terminations on this chip is 256, and the terminal finish is made of TIN LEAD. An additional feature of this part is that it requires a 3.3 supply. The voltage supply for this chip ranges from 1.15V to 1.25V, with a specific supply voltage of 1.2V. It is categorized as a FIELD PROGRAMMABLE GATE ARRAY, meaning it can be programmed to perform various functions. The total amount of RAM bits on this chip is 239616. This part is not compliant with RoHS standards.

EP2C20F256I8 Features
152 I/Os
Up to 239616 RAM bits

EP2C20F256I8 Applications
There are a lot of Intel EP2C20F256I8 FPGAs applications.

ASIC prototyping
Medical Electronics
Industrial,Medical and Scientific Instruments
Telecommunication
Device controllers
Cryptography
Server Applications
Data center hardware accelerators
Wired Communications
Automation
EP2C20F256I8 More Descriptions
FPGA Cyclone« II Family 18752 Cells 402.58MHz 90nm Technology 1.2 Volt 256-Pin FBGA
Field Programmable Gate Array, 1172 CLBs, 402.5MHz, 18752-Cell, CMOS, PBGA256
Contains Lead CMOS 2008 RoHS Compliant FPGA 100C 29.3kB 402.58MHz 1.25V
; Logic Type:EP2C20; Logic Base Number:2; No. of I/O Pins:152; Termination Type:SMD; Package/Case:256-FBGA; No. of Pins:256; IC Generic Number:; Leaded Process Compatible:No; Operating Temp. Max:100°C; Operating Temp. Min:-40°C ;RoHS Compliant: No
FPGA, CYCLONE II, 20K ELEMENTS, FBGA256; No. of Macrocells: 18752; No. of Pins: 256Pins; MSL: -; SVHC: No SVHC (17-Dec-2015); Base Number: 2; Frequency: 155.5MHz; I/O Interface Standard: HSTL-15, HSTL-18, LVCMOS, LVTTL, SSTL-18, SSTL-2; IC Generic Number: 2C20F256; IC Temperature Range: Industrial; Logic Function Number: 2C20F256; Logic IC Base Number: 2; Logic IC Function: EP2C20; Operating Temperature Max: 100°C; Operating Temperature Min: -40°C; Operating Temperature Range: -40°C to 100°C; Programmable Logic Type: FPGA; Supply Voltage: 1.2V; Supply Voltage Max: 1.89V; Supply Voltage Min: 1.71V; Termination Type: Surface Mount Device
Product Comparison
The three parts on the right have similar specifications to EP2C20F256I8.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    Additional Feature
    HTS Code
    Subcategory
    Technology
    Voltage - Supply
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Base Part Number
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Power Supplies
    Number of I/O
    Clock Frequency
    Number of Inputs
    Programmable Logic Type
    Number of Logic Elements/Cells
    Total RAM Bits
    Number of LABs/CLBs
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Published
    View Compare
  • EP2C20F256I8
    EP2C20F256I8
    8 Weeks
    Surface Mount
    256-LBGA
    YES
    -40°C~100°C TJ
    Tray
    Cyclone® II
    e0
    Active
    3 (168 Hours)
    256
    3A991
    TIN LEAD
    ALSO REQUIRES 3.3 SUPPLY
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    1.15V~1.25V
    BOTTOM
    BALL
    220
    1.2V
    1mm
    20
    EP2C20
    S-PBGA-B256
    136
    Not Qualified
    1.21.5/3.33.3V
    152
    402.5MHz
    152
    FIELD PROGRAMMABLE GATE ARRAY
    18752
    239616
    1172
    1.55mm
    17mm
    17mm
    Non-RoHS Compliant
    -
    -
  • EP2C20F484I8
    8 Weeks
    Surface Mount
    484-BGA
    YES
    -40°C~100°C TJ
    Tray
    Cyclone® II
    -
    Active
    3 (168 Hours)
    484
    3A991
    -
    ALSO REQUIRES 3.3 SUPPLY
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    1.15V~1.25V
    BOTTOM
    BALL
    NOT SPECIFIED
    1.2V
    1mm
    NOT SPECIFIED
    EP2C20
    S-PBGA-B484
    299
    Not Qualified
    1.21.5/3.33.3V
    315
    402.5MHz
    315
    FIELD PROGRAMMABLE GATE ARRAY
    18752
    239616
    1172
    2.6mm
    23mm
    23mm
    Non-RoHS Compliant
    2008
  • EP2C35U484C7
    8 Weeks
    Surface Mount
    484-FBGA
    YES
    0°C~85°C TJ
    Tray
    Cyclone® II
    e0
    Active
    3 (168 Hours)
    484
    3A991
    Tin/Lead (Sn/Pb)
    ALSO REQUIRES 3.3 SUPPLY
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    1.15V~1.25V
    BOTTOM
    BALL
    220
    1.2V
    0.8mm
    30
    EP2C35
    S-PBGA-B484
    306
    Not Qualified
    1.21.5/3.33.3V
    322
    450MHz
    322
    FIELD PROGRAMMABLE GATE ARRAY
    33216
    483840
    2076
    2.2mm
    19mm
    19mm
    RoHS Compliant
    -
  • EP2C35F484C8
    8 Weeks
    Surface Mount
    484-BGA
    YES
    0°C~85°C TJ
    Tray
    Cyclone® II
    e0
    Active
    3 (168 Hours)
    484
    3A991
    Tin/Lead (Sn/Pb)
    ALSO REQUIRES 3.3 SUPPLY
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    1.15V~1.25V
    BOTTOM
    BALL
    220
    1.2V
    1mm
    30
    EP2C35
    S-PBGA-B484
    306
    Not Qualified
    1.21.5/3.33.3V
    322
    402.5MHz
    322
    FIELD PROGRAMMABLE GATE ARRAY
    33216
    483840
    2076
    2.6mm
    23mm
    23mm
    Non-RoHS Compliant
    2008
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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