EP20K200RC240-3
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Altera EP20K200RC240-3

Part Number:
EP20K200RC240-3
Manufacturer:
Altera
Ventron No:
3134255-EP20K200RC240-3
Description:
IC FPGA 174 I/O 240RQFP
ECAD Model:
Datasheet:
APEX 20K Family Datasheet
Payment:
Payment
Delivery:
Delivery

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Part Overview
Description
The APEX 20K is a programmable logic device (PLD) that incorporates system-on-a-programmable-chip (SOPC) integration. It features a MultiCore™ architecture that integrates look-up table (LUT) logic, product-term logic, and embedded memory. The LUT logic is used for register-intensive functions, while the embedded system block (ESB) is used to implement memory functions such as first-in first-out (FIFO) buffers, dual-port RAM, and content-addressable memory (CAM). The ESB also implements product-term logic for combinatorial-intensive functions.

Features
Industry's first PLD with SOPC integration
MultiCore™ architecture with LUT logic, product-term logic, and embedded memory
High density: 30,000 to 1.5 million typical gates
Up to 51,840 logic elements (LEs)
Up to 442,368 RAM bits that can be used without reducing available logic
Up to 3,456 product-term-based macrocells

Applications
The APEX 20K is suitable for a wide range of applications, including:
Networking and communications
Industrial control
Consumer electronics
Automotive electronics
Medical electronics
Specifications
Altera EP20K200RC240-3 technical specifications, attributes, parameters and parts with similar specifications to Altera EP20K200RC240-3.
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    240-BFQFP Exposed Pad
  • Supplier Device Package
    240-RQFP (32x32)
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    0°C~85°C TJ
  • Packaging
    Tray
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    APEX-20K®
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    3 (168 Hours)
  • Voltage - Supply
    2.375V~2.625V
  • Base Part Number
    EP20K200
  • Number of I/O
    174
  • Number of Logic Elements/Cells
    8320
  • Total RAM Bits

    Total Ram Bits is a parameter that specifies the total number of bits that can be stored in a random access memory (RAM) chip. It is typically expressed in megabits (Mb) or gigabits (Gb). The higher the Total Ram Bits, the more data the RAM chip can store. This parameter is important for determining the amount of memory that is available to a computer system.

    106496
  • Number of Gates
    526000
  • Number of LABs/CLBs

    Number of Labs/Clbs (Number of Laboratories/Clubs) is a parameter that specifies the number of laboratories or clubs that are associated with a particular electronic component. This parameter is typically used to indicate the level of support that is available for the component, as well as the number of people who are familiar with its use. A higher number of labs/clubs indicates that the component is more widely used and supported, which can be beneficial for users who need assistance with its implementation or troubleshooting.

    832
Product Comparison
The three parts on the right have similar specifications to EP20K200RC240-3.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Supplier Device Package
    Operating Temperature
    Packaging
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Voltage - Supply
    Base Part Number
    Number of I/O
    Number of Logic Elements/Cells
    Total RAM Bits
    Number of Gates
    Number of LABs/CLBs
    Surface Mount
    JESD-609 Code
    ECCN Code
    Terminal Finish
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reach Compliance Code
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Power Supplies
    Propagation Delay
    Number of Inputs
    Programmable Logic Type
    Output Function
    Number of Dedicated Inputs
    Length
    Height Seated (Max)
    Width
    RoHS Status
    Number of Terminations
    View Compare
  • EP20K200RC240-3
    EP20K200RC240-3
    Surface Mount
    240-BFQFP Exposed Pad
    240-RQFP (32x32)
    0°C~85°C TJ
    Tray
    APEX-20K®
    Obsolete
    3 (168 Hours)
    2.375V~2.625V
    EP20K200
    174
    8320
    106496
    526000
    832
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • EP20K1000EFC33-2
    Surface Mount
    1020-BBGA
    -
    0°C~85°C TJ
    Tray
    APEX-20KE®
    Obsolete
    3 (168 Hours)
    1.71V~1.89V
    EP20K1000
    708
    38400
    327680
    1772000
    3840
    YES
    e0
    3A001.A.7.A
    TIN LEAD
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    220
    1.8V
    1mm
    compliant
    30
    S-PBGA-B1020
    700
    Not Qualified
    1.81.8/3.3V
    2.13 ns
    700
    LOADABLE PLD
    MACROCELL
    4
    33mm
    3.5mm
    33mm
    Non-RoHS Compliant
    -
  • EP20K100BI356-3
    Surface Mount
    356-LBGA
    -
    -40°C~100°C TJ
    Tray
    APEX-20K®
    Obsolete
    3 (168 Hours)
    2.375V~2.625V
    -
    252
    4160
    53248
    263000
    416
    YES
    e0
    -
    Tin/Lead (Sn/Pb)
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    BOTTOM
    BALL
    220
    2.5V
    1.27mm
    compliant
    NOT SPECIFIED
    S-PBGA-B356
    246
    Not Qualified
    2.52.5/3.3V
    -
    246
    LOADABLE PLD
    MACROCELL
    4
    35mm
    1.63mm
    35mm
    Non-RoHS Compliant
    356
  • EP20K1000CF33C8ES
    Surface Mount
    1020-BBGA
    1020-FBGA (33x33)
    0°C~85°C TJ
    Tray
    APEX-20KC®
    Obsolete
    3 (168 Hours)
    1.71V~1.89V
    -
    708
    38400
    327680
    1772000
    3840
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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