Micron Technology Inc. EDFA164A2PF-GD-F-D
- Part Number:
- EDFA164A2PF-GD-F-D
- Manufacturer:
- Micron Technology Inc.
- Ventron No:
- 3255436-EDFA164A2PF-GD-F-D
- Description:
- IC SDRAM 16GBIT 800MHZ FBGA
- Datasheet:
- EDFA164A2PF-GD-F-D
Micron Technology Inc. EDFA164A2PF-GD-F-D technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. EDFA164A2PF-GD-F-D.
- Package / CaseFBGA
- Operating Temperature-30°C~85°C TC
- PackagingTray
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- TechnologySDRAM - Mobile LPDDR3
- Voltage - Supply1.14V~1.95V
- Memory Size16Gb 256M x 64
- Memory TypeVolatile
- Clock Frequency800MHz
- Memory FormatDRAM
- Memory InterfaceParallel
- RoHS StatusROHS3 Compliant
EDFA164A2PF-GD-F-D Overview
The package or case for this particular product is FBGA, which stands for Fine-Pitch Ball Grid Array. The operating temperature range for this product is -30°C to 85°C, making it suitable for a wide range of environments. The packaging for this product is a tray, which is a common method of packaging electronic components. However, it should be noted that this product is now considered obsolete, meaning it is no longer in production. The Moisture Sensitivity Level (MSL) for this product is 3, which means it can withstand exposure to moisture for up to 168 hours. The technology used in this product is SDRAM - Mobile LPDDR3, which stands for Synchronous Dynamic Random Access Memory. The voltage supply for this product ranges from 1.14V to 1.95V. The memory size is 16Gb, with a configuration of 256M x 64. This is a volatile memory type, meaning it requires a constant power supply to retain data. Lastly, the clock frequency for this product is 800MHz, indicating its processing speed.
EDFA164A2PF-GD-F-D Features
Package / Case: FBGA
EDFA164A2PF-GD-F-D Applications
There are a lot of Micron Technology Inc.
EDFA164A2PF-GD-F-D Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
The package or case for this particular product is FBGA, which stands for Fine-Pitch Ball Grid Array. The operating temperature range for this product is -30°C to 85°C, making it suitable for a wide range of environments. The packaging for this product is a tray, which is a common method of packaging electronic components. However, it should be noted that this product is now considered obsolete, meaning it is no longer in production. The Moisture Sensitivity Level (MSL) for this product is 3, which means it can withstand exposure to moisture for up to 168 hours. The technology used in this product is SDRAM - Mobile LPDDR3, which stands for Synchronous Dynamic Random Access Memory. The voltage supply for this product ranges from 1.14V to 1.95V. The memory size is 16Gb, with a configuration of 256M x 64. This is a volatile memory type, meaning it requires a constant power supply to retain data. Lastly, the clock frequency for this product is 800MHz, indicating its processing speed.
EDFA164A2PF-GD-F-D Features
Package / Case: FBGA
EDFA164A2PF-GD-F-D Applications
There are a lot of Micron Technology Inc.
EDFA164A2PF-GD-F-D Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
EDFA164A2PF-GD-F-D More Descriptions
LPDDR3 256MX64 PLASTIC WFBGA 1.2
MICEDFA164A2PF-GD-F-D LPDDR3 16G 256MX64
IC DRAM 16GBIT PARALLEL 800MHZ
MICEDFA164A2PF-GD-F-D LPDDR3 16G 256MX64
IC DRAM 16GBIT PARALLEL 800MHZ
The three parts on the right have similar specifications to EDFA164A2PF-GD-F-D.
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ImagePart NumberManufacturerPackage / CaseOperating TemperaturePackagingPart StatusMoisture Sensitivity Level (MSL)TechnologyVoltage - SupplyMemory SizeMemory TypeClock FrequencyMemory FormatMemory InterfaceRoHS StatusSupplier Device PackageContact PlatingMountNumber of PinsNumber of TerminationsAdditional FeatureTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReach Compliance CodeTime@Peak Reflow Temperature-Max (s)Operating Supply VoltageSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Number of PortsOperating ModeData Bus WidthOrganizationMemory WidthDensityMax FrequencyAccess ModeHeight Seated (Max)LengthView Compare
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EDFA164A2PF-GD-F-DFBGA-30°C~85°C TCTrayObsolete3 (168 Hours)SDRAM - Mobile LPDDR31.14V~1.95V16Gb 256M x 64Volatile800MHzDRAMParallelROHS3 Compliant---------------------------
-
--30°C~85°C TCTape & Reel (TR)Obsolete3 (168 Hours)SDRAM - Mobile LPDDR31.14V~1.95V16Gb 256M x 64Volatile800MHzDRAMParallelROHS3 Compliant220-FBGA (14x14)-------------------------
-
--30°C~85°C TCTrayObsolete3 (168 Hours)SDRAM - Mobile LPDDR31.14V~1.95V16Gb 256M x 64Volatile800MHzDRAMParallelROHS3 Compliant--------------------------
-
FBGA-30°C~85°C TCTrayObsolete3 (168 Hours)SDRAM - Mobile LPDDR31.14V~1.95V16Gb 512M x 32Volatile-DRAMParallelROHS3 Compliant-Copper, Silver, TinSurface Mount178178AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY; IT ALSO HAVE 0.65 MM PITCHBOTTOMNOT SPECIFIED11.2V0.8mmunknownNOT SPECIFIED1.2V1.3V1.14V1SYNCHRONOUS32b512MX323216 Gb933MHzDUAL BANK PAGE BURST1mm11.5mm
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