Micron Technology Inc. EDF8164A3PK-JD-F-D

EDF8164A3PK-JD-F-D Overview
The package or case for this particular technology is a 216-WFBGA, which refers to the type of packaging used to house the integrated circuit. This package contains 216 terminations, which are the points where the package is connected to the circuit board. The technology used in this package is SDRAM - Mobile LPDDR3, a type of memory commonly used in mobile devices. The supply voltage-min (Vsup) for this technology is 1.14V, which is the minimum voltage required for the device to operate. This package has 1 port, allowing for data to be transferred in and out. It operates in synchronous mode, meaning that data is transferred in a coordinated and synchronized manner. The organization of this technology is 128MX64, indicating the number of rows and columns in the memory array. The memory density is an impressive 8589934592 bits, allowing for a large amount of data to be stored. The access mode is single bank page burst, which allows for quick and efficient access to the memory. Finally, the height seated (max) of this package is 0.7mm, making it a compact and space-saving option for electronic devices.

EDF8164A3PK-JD-F-D Features
Package / Case: 216-WFBGA
Additional Feature:AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY


EDF8164A3PK-JD-F-D Applications
There are a lot of Micron Technology Inc.
EDF8164A3PK-JD-F-D Memory applications.


Cache memory
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications