Micron Technology Inc. EDB4064B3PP-1D-F-D
- Part Number:
- EDB4064B3PP-1D-F-D
- Manufacturer:
- Micron Technology Inc.
- Ventron No:
- 3246237-EDB4064B3PP-1D-F-D
- Description:
- IC SDRAM 4GBIT 533MHZ 240FBGA
- Datasheet:
- EDB4064B3PP-1D-F-D
Micron Technology Inc. EDB4064B3PP-1D-F-D technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. EDB4064B3PP-1D-F-D.
- Mounting TypeSurface Mount
- Package / Case240-WFBGA
- Number of Pins240
- Supplier Device Package240-FBGA (14x14)
- Operating Temperature-30°C~85°C TC
- PackagingTray
- Published2015
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Max Operating Temperature85°C
- Min Operating Temperature-30°C
- TechnologySDRAM - Mobile LPDDR2
- Voltage - Supply1.14V~1.95V
- Frequency533MHz
- InterfaceParallel
- Memory Size4Gb 64M x 64
- Memory TypeVolatile
- Clock Frequency533MHz
- Memory FormatDRAM
- Memory InterfaceParallel
- RoHS StatusROHS3 Compliant
EDB4064B3PP-1D-F-D Overview
The product is a surface mount component with 240 pins. It has an operating temperature range of -30°C to 85°C TC and is packaged in a tray. The product was published in 2015 and is now considered obsolete. It has a moisture sensitivity level of 3 (168 hours) and a frequency of 533MHz. The interface is parallel and the product is compliant with ROHS3 regulations.
EDB4064B3PP-1D-F-D Features
Package / Case: 240-WFBGA
240 Pins
Freguency at 533MHz
533MHz terminals
EDB4064B3PP-1D-F-D Applications
There are a lot of Micron Technology Inc.
EDB4064B3PP-1D-F-D Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
The product is a surface mount component with 240 pins. It has an operating temperature range of -30°C to 85°C TC and is packaged in a tray. The product was published in 2015 and is now considered obsolete. It has a moisture sensitivity level of 3 (168 hours) and a frequency of 533MHz. The interface is parallel and the product is compliant with ROHS3 regulations.
EDB4064B3PP-1D-F-D Features
Package / Case: 240-WFBGA
240 Pins
Freguency at 533MHz
533MHz terminals
EDB4064B3PP-1D-F-D Applications
There are a lot of Micron Technology Inc.
EDB4064B3PP-1D-F-D Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
EDB4064B3PP-1D-F-D More Descriptions
4G BITS DDR2 MOBILE RAM POP(12MM X 12MM, 216-BALL FBGA)
IC DRAM 4GBIT PARALLEL 240FBGA
IC EEPROM 16K PARALLEL 24SOIC
LPDDR2 4G 64MX64 FBGA DDP
IC DRAM 4GBIT PARALLEL 240FBGA
IC EEPROM 16K PARALLEL 24SOIC
LPDDR2 4G 64MX64 FBGA DDP
The three parts on the right have similar specifications to EDB4064B3PP-1D-F-D.
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ImagePart NumberManufacturerMounting TypePackage / CaseNumber of PinsSupplier Device PackageOperating TemperaturePackagingPublishedPart StatusMoisture Sensitivity Level (MSL)Max Operating TemperatureMin Operating TemperatureTechnologyVoltage - SupplyFrequencyInterfaceMemory SizeMemory TypeClock FrequencyMemory FormatMemory InterfaceRoHS StatusFactory Lead TimeSurface MountJESD-609 CodeNumber of TerminationsECCN CodeTerminal FinishAdditional FeatureTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchTime@Peak Reflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Number of PortsOperating ModeOrganizationMemory WidthMemory DensityAccess ModeLengthHeight Seated (Max)WidthView Compare
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EDB4064B3PP-1D-F-DSurface Mount240-WFBGA240240-FBGA (14x14)-30°C~85°C TCTray2015Obsolete3 (168 Hours)85°C-30°CSDRAM - Mobile LPDDR21.14V~1.95V533MHzParallel4Gb 64M x 64Volatile533MHzDRAMParallelROHS3 Compliant--------------------------
-
Surface Mount134-WFBGA---40°C~125°C TCTray-Active3 (168 Hours)--SDRAM - Mobile LPDDR21.14V~1.95V--4Gb 128M x 32Volatile533MHzDRAMParallelROHS3 Compliant8 WeeksYESe1134EAR99Tin/Silver/Copper (Sn/Ag/Cu)AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMBOTTOM26011.2V0.65mm30R-PBGA-B1341.95V1.14V1SYNCHRONOUS128MX32324294967296 bitSINGLE BANK PAGE BURST11.5mm0.75mm10mm
-
Surface Mount134-WFBGA---40°C~105°C TCTray-Active3 (168 Hours)--SDRAM - Mobile LPDDR21.14V~1.95V--4Gb 128M x 32Volatile533MHzDRAMParallelROHS3 Compliant8 WeeksYESe1134EAR99Tin/Silver/Copper (Sn/Ag/Cu)AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMBOTTOM26011.2V0.65mm30R-PBGA-B1341.95V1.14V1SYNCHRONOUS128MX32324294967296 bitSINGLE BANK PAGE BURST11.5mm0.75mm10mm
-
Surface Mount216-WFBGA---40°C~85°C TCTray-Last Time Buy3 (168 Hours)--SDRAM - Mobile LPDDR21.14V~1.95V--4Gb 64M x 64Volatile533MHzDRAMParallelROHS3 Compliant9 Weeks------------------------
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