EDB4064B3PP-1D-F-D

Micron Technology Inc. EDB4064B3PP-1D-F-D

Part Number:
EDB4064B3PP-1D-F-D
Manufacturer:
Micron Technology Inc.
Ventron No:
3246237-EDB4064B3PP-1D-F-D
Description:
IC SDRAM 4GBIT 533MHZ 240FBGA
ECAD Model:
Datasheet:
EDB4064B3PP-1D-F-D

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Specifications
Micron Technology Inc. EDB4064B3PP-1D-F-D technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. EDB4064B3PP-1D-F-D.
  • Mounting Type
    Surface Mount
  • Package / Case
    240-WFBGA
  • Number of Pins
    240
  • Supplier Device Package
    240-FBGA (14x14)
  • Operating Temperature
    -30°C~85°C TC
  • Packaging
    Tray
  • Published
    2015
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Max Operating Temperature
    85°C
  • Min Operating Temperature
    -30°C
  • Technology
    SDRAM - Mobile LPDDR2
  • Voltage - Supply
    1.14V~1.95V
  • Frequency
    533MHz
  • Interface
    Parallel
  • Memory Size
    4Gb 64M x 64
  • Memory Type
    Volatile
  • Clock Frequency
    533MHz
  • Memory Format
    DRAM
  • Memory Interface
    Parallel
  • RoHS Status
    ROHS3 Compliant
Description
EDB4064B3PP-1D-F-D Overview
The product is a surface mount component with 240 pins. It has an operating temperature range of -30°C to 85°C TC and is packaged in a tray. The product was published in 2015 and is now considered obsolete. It has a moisture sensitivity level of 3 (168 hours) and a frequency of 533MHz. The interface is parallel and the product is compliant with ROHS3 regulations.

EDB4064B3PP-1D-F-D Features
Package / Case: 240-WFBGA
240 Pins
Freguency at 533MHz
533MHz terminals


EDB4064B3PP-1D-F-D Applications
There are a lot of Micron Technology Inc.
EDB4064B3PP-1D-F-D Memory applications.


cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
EDB4064B3PP-1D-F-D More Descriptions
4G BITS DDR2 MOBILE RAM POP(12MM X 12MM, 216-BALL FBGA)
IC DRAM 4GBIT PARALLEL 240FBGA
IC EEPROM 16K PARALLEL 24SOIC
LPDDR2 4G 64MX64 FBGA DDP
Product Comparison
The three parts on the right have similar specifications to EDB4064B3PP-1D-F-D.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Number of Pins
    Supplier Device Package
    Operating Temperature
    Packaging
    Published
    Part Status
    Moisture Sensitivity Level (MSL)
    Max Operating Temperature
    Min Operating Temperature
    Technology
    Voltage - Supply
    Frequency
    Interface
    Memory Size
    Memory Type
    Clock Frequency
    Memory Format
    Memory Interface
    RoHS Status
    Factory Lead Time
    Surface Mount
    JESD-609 Code
    Number of Terminations
    ECCN Code
    Terminal Finish
    Additional Feature
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    JESD-30 Code
    Supply Voltage-Max (Vsup)
    Supply Voltage-Min (Vsup)
    Number of Ports
    Operating Mode
    Organization
    Memory Width
    Memory Density
    Access Mode
    Length
    Height Seated (Max)
    Width
    View Compare
  • EDB4064B3PP-1D-F-D
    EDB4064B3PP-1D-F-D
    Surface Mount
    240-WFBGA
    240
    240-FBGA (14x14)
    -30°C~85°C TC
    Tray
    2015
    Obsolete
    3 (168 Hours)
    85°C
    -30°C
    SDRAM - Mobile LPDDR2
    1.14V~1.95V
    533MHz
    Parallel
    4Gb 64M x 64
    Volatile
    533MHz
    DRAM
    Parallel
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • EDB4432BBBJ-1DAUT-F-D
    Surface Mount
    134-WFBGA
    -
    -
    -40°C~125°C TC
    Tray
    -
    Active
    3 (168 Hours)
    -
    -
    SDRAM - Mobile LPDDR2
    1.14V~1.95V
    -
    -
    4Gb 128M x 32
    Volatile
    533MHz
    DRAM
    Parallel
    ROHS3 Compliant
    8 Weeks
    YES
    e1
    134
    EAR99
    Tin/Silver/Copper (Sn/Ag/Cu)
    AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
    BOTTOM
    260
    1
    1.2V
    0.65mm
    30
    R-PBGA-B134
    1.95V
    1.14V
    1
    SYNCHRONOUS
    128MX32
    32
    4294967296 bit
    SINGLE BANK PAGE BURST
    11.5mm
    0.75mm
    10mm
  • EDB4432BBBJ-1DAAT-F-D
    Surface Mount
    134-WFBGA
    -
    -
    -40°C~105°C TC
    Tray
    -
    Active
    3 (168 Hours)
    -
    -
    SDRAM - Mobile LPDDR2
    1.14V~1.95V
    -
    -
    4Gb 128M x 32
    Volatile
    533MHz
    DRAM
    Parallel
    ROHS3 Compliant
    8 Weeks
    YES
    e1
    134
    EAR99
    Tin/Silver/Copper (Sn/Ag/Cu)
    AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM
    BOTTOM
    260
    1
    1.2V
    0.65mm
    30
    R-PBGA-B134
    1.95V
    1.14V
    1
    SYNCHRONOUS
    128MX32
    32
    4294967296 bit
    SINGLE BANK PAGE BURST
    11.5mm
    0.75mm
    10mm
  • EDB4064B4PB-1DIT-F-R
    Surface Mount
    216-WFBGA
    -
    -
    -40°C~85°C TC
    Tray
    -
    Last Time Buy
    3 (168 Hours)
    -
    -
    SDRAM - Mobile LPDDR2
    1.14V~1.95V
    -
    -
    4Gb 64M x 64
    Volatile
    533MHz
    DRAM
    Parallel
    ROHS3 Compliant
    9 Weeks
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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