Cypress Semiconductor Corp CY7C2262XV18-450BZXC

CY7C2262XV18-450BZXC Overview
The package or case of this electronic component is a 165-LBGA, which stands for Land Grid Array. This type of package is commonly used in high-performance integrated circuits. The terminal finish is a combination of tin, silver, and copper, also known as Sn/Ag/Cu. This finish provides a reliable and durable connection between the component and the circuit board. One of the additional features of this component is its pipelined architecture, which allows for faster data processing. The peak reflow temperature for this component is 260 degrees Celsius, ensuring that it can withstand high temperatures during the manufacturing process. The terminal pitch, or distance between terminals, is 1mm, making it suitable for compact circuit designs. The supply voltage minimum is 1.7V, making it energy efficient. This component is designed to store data in SRAM format, which stands for Static Random-Access Memory. It also has 3-STATE output characteristics, meaning it can be in three different states: high, low, or high-impedance. The address bus width is 20b, meaning it can access up to 20 bits of data at a time. Lastly, this component is ROHS3 compliant, meaning it meets the standards for Restriction of Hazardous Substances.

CY7C2262XV18-450BZXC Features
Package / Case: 165-LBGA
165 Pins
Operating Supply Voltage:1.8V
Additional Feature:PIPELINED ARCHITECTURE
I/O Type: SEPARATE

CY7C2262XV18-450BZXC Applications
There are a lot of Cypress Semiconductor Corp CY7C2262XV18-450BZXC Memory applications.

nonvolatile BIOS memory
workstations,
DVD disk buffer
eSRAM
personal digital assistants
multimedia computers
networks
Camcorders
graphics card
personal computers