Cypress Semiconductor Corp CY7C2165KV18-550BZXC
- Part Number:
- CY7C2165KV18-550BZXC
- Manufacturer:
- Cypress Semiconductor Corp
- Ventron No:
- 3237018-CY7C2165KV18-550BZXC
- Description:
- IC SRAM 18MBIT 550MHZ 165FBGA
- Datasheet:
- CY7C2165KV18-550BZXC
Cypress Semiconductor Corp CY7C2165KV18-550BZXC technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp CY7C2165KV18-550BZXC.
- Factory Lead Time13 Weeks
- Mounting TypeSurface Mount
- Package / Case165-LBGA
- Surface MountYES
- Number of Pins165
- Operating Temperature0°C~70°C TA
- PackagingTray
- Published2003
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations165
- ECCN Code3A991
- Additional FeaturePIPELINED ARCHITECTURE
- HTS Code8542.32.00.41
- TechnologySRAM - Synchronous, QDR II
- Voltage - Supply1.7V~1.9V
- Terminal PositionBOTTOM
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Number of Functions1
- Supply Voltage1.8V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- Supply Voltage-Max (Vsup)1.9V
- Supply Voltage-Min (Vsup)1.7V
- Memory Size18Mb 512K x 36
- Memory TypeVolatile
- Clock Frequency550MHz
- Memory FormatSRAM
- Memory InterfaceParallel
- Organization512KX36
- Memory Width36
- Memory Density18874368 bit
- Access Time (Max)0.45 ns
- Height Seated (Max)1.4mm
- Length15mm
- Width13mm
- RoHS StatusROHS3 Compliant
CY7C2165KV18-550BZXC Overview
Cypress Semiconductor Corp is the brand of this part, which falls under the Memory category. Specifically, it is a Memory chip with a Memory Size of 18Mb 512K x 36. The Mounting Type is Surface Mount and the Part Status is Active. It has 165 Number of Terminations and an Additional Feature of PIPELINED ARCHITECTURE. The Supply Voltage-Min (Vsup) is 1.7V and the Access Time (Max) is 0.45 ns. The Height Seated (Max) is 1.4mm and the Width is 13mm. Additionally, it has an HTS Code of 8542.32.00.41.
CY7C2165KV18-550BZXC Features
Package / Case: 165-LBGA
165 Pins
Additional Feature:PIPELINED ARCHITECTURE
CY7C2165KV18-550BZXC Applications
There are a lot of Cypress Semiconductor Corp CY7C2165KV18-550BZXC Memory applications.
workstations,
networks
eSRAM
graphics card
mainframes
servers
printers
data buffer
telecommunications
networking
Cypress Semiconductor Corp is the brand of this part, which falls under the Memory category. Specifically, it is a Memory chip with a Memory Size of 18Mb 512K x 36. The Mounting Type is Surface Mount and the Part Status is Active. It has 165 Number of Terminations and an Additional Feature of PIPELINED ARCHITECTURE. The Supply Voltage-Min (Vsup) is 1.7V and the Access Time (Max) is 0.45 ns. The Height Seated (Max) is 1.4mm and the Width is 13mm. Additionally, it has an HTS Code of 8542.32.00.41.
CY7C2165KV18-550BZXC Features
Package / Case: 165-LBGA
165 Pins
Additional Feature:PIPELINED ARCHITECTURE
CY7C2165KV18-550BZXC Applications
There are a lot of Cypress Semiconductor Corp CY7C2165KV18-550BZXC Memory applications.
workstations,
networks
eSRAM
graphics card
mainframes
servers
printers
data buffer
telecommunications
networking
CY7C2165KV18-550BZXC More Descriptions
Synchronous SRAM, QDR-II , ODT, 18432 Kb Density, 550 MHz Frequency, BGA-165, RoHSCypress Semiconductor SCT
SRAM Chip Sync Dual 1.8V 18M-Bit 512K x 36 0.45ns 165-Pin FBGA Tray
IC SRAM 18MBIT PARALLEL 165FBGA
Product Description Demo for Development.
SRAM Chip Sync Dual 1.8V 18M-Bit 512K x 36 0.45ns 165-Pin FBGA Tray
IC SRAM 18MBIT PARALLEL 165FBGA
Product Description Demo for Development.
The three parts on the right have similar specifications to CY7C2165KV18-550BZXC.
-
ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeAdditional FeatureHTS CodeTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReflow Temperature-Max (s)Supply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Memory SizeMemory TypeClock FrequencyMemory FormatMemory InterfaceOrganizationMemory WidthMemory DensityAccess Time (Max)Height Seated (Max)LengthWidthRoHS StatusMountJESD-609 CodeTerminal FinishTime@Peak Reflow Temperature-Max (s)Base Part NumberPin CountOperating Supply VoltageNumber of PortsNominal Supply CurrentAccess TimeOutput CharacteristicsAddress Bus WidthDensityStandby Current-MaxI/O TypeSync/AsyncWord SizeStandby Voltage-MinRadiation HardeningLead FreePbfree CodeFrequencyWrite Cycle Time - Word, PageReach Compliance CodeJESD-30 CodeQualification StatusPower SuppliesSupply Current-MaxView Compare
-
CY7C2165KV18-550BZXC13 WeeksSurface Mount165-LBGAYES1650°C~70°C TATray2003Active3 (168 Hours)1653A991PIPELINED ARCHITECTURE8542.32.00.41SRAM - Synchronous, QDR II1.7V~1.9VBOTTOMNOT SPECIFIED11.8V1mmNOT SPECIFIED1.9V1.7V18Mb 512K x 36Volatile550MHzSRAMParallel512KX363618874368 bit0.45 ns1.4mm15mm13mmROHS3 Compliant-----------------------------
-
-Surface Mount172-LFBGA-1720°C~70°C TATray2003Obsolete3 (168 Hours)172-PIPELINED ARCHITECTURE-SRAM - Dual Port, Synchronous3.135V~3.465VBOTTOM26013.3V1mm-3.465V3.135V2Mb 64K x 36Volatile167MHzSRAMParallel64KX3636---15mm-ROHS3 CompliantSurface Mounte1Tin/Silver/Copper (Sn/Ag/Cu)40CY7C08511723.3V2300mA4 ns3-STATE32b2 Mb0.075ACOMMONSynchronous36b3.14VNoLead Free--------
-
8 WeeksSurface Mount144-LQFP-1440°C~70°C TATape & Reel (TR)1997Obsolete3 (168 Hours)144-AUTOMATIC POWER-DOWN-SRAM - Dual Port, Asynchronous3V~3.6VQUAD26013.3V0.5mm-3.465V3.135V1.152Mb 32K x 36Volatile-SRAMParallel-36-15 ns1.6mm--ROHS3 CompliantSurface Mounte3Matte Tin (Sn)30CY7C057-3.3V2360mA-3-STATE30b1.1 Mb0.00005ACOMMONAsynchronous36b2VNoLead Freeyes15GHz15ns-----
-
-Surface Mount100-LQFPYES-0°C~70°C TATray2004Obsolete3 (168 Hours)1003A991.B.2.A-8542.32.00.41SRAM - Dual Port, Asynchronous3V~3.6VQUAD26013.3V0.5mm-3.6V3V1.152Mb 64K x 18Volatile-SRAMParallel64KX18181179648 bit15 ns1.6mm14mm14mmROHS3 Compliant-e3Matte Tin (Sn)20CY7C038100-2--3-STATE--0.00005ACOMMON--2V-Lead Free--15nsunknownS-PQFP-G100Not Qualified3.3V0.185mA
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
12 December 2023
TM1650 LED Driver IC Features, Working Principle, Applications, Usage and More
Ⅰ. Overview of TM1650Ⅱ. Symbol, footprint and pin configuration of TM1650Ⅲ. Features of TM1650 LED driverⅣ. Technical parameters of TM1650 LED driverⅤ. How does the TM1650 LED driver... -
13 December 2023
74HC00 Pin Configuration, Replacements, Applications and Other Details
Ⅰ. Overview of 74HC00Ⅱ. Pin configuration and functions of 74HC00Ⅲ. What are the features of 74HC00?Ⅳ. Technical parameters of 74HC00Ⅴ. Working principle of 74HC00Ⅵ. Absolute maximum ratings of... -
13 December 2023
2N2222A NPN Transistor Features, Technical Parameters, Working Principle, Applications and Usage
Ⅰ. Overview of 2N2222A transistorⅡ. Symbol, footprint and pin configuration of 2N2222A transistorⅢ. What are the features of 2N2222A transistor?Ⅳ. Technical parameters of 2N2222A transistorⅤ. How does the... -
14 December 2023
AT24C256 EEPROM Features, Functions, Working Principle, Applications and AT24C256 vs 24LC256
Ⅰ. What is programmable read-only memory?Ⅱ. Overview of AT24C256 EEPROMⅢ. Pin configuration of AT24C256 EEPROMⅣ. What are the features of AT24C256 EEPROM?Ⅴ. Functions of AT24C256 EEPROMⅥ. Working principle...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.