Cypress Semiconductor Corp CY62162G18-55BGXIT
- Part Number:
- CY62162G18-55BGXIT
- Manufacturer:
- Cypress Semiconductor Corp
- Ventron No:
- 3235810-CY62162G18-55BGXIT
- Description:
- IC SRAM 16MBIT 55NS 119BGA
- Datasheet:
- CY62162G18-55BGXIT
Cypress Semiconductor Corp CY62162G18-55BGXIT technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp CY62162G18-55BGXIT.
- Factory Lead Time13 Weeks
- Mounting TypeSurface Mount
- Package / Case119-BGA
- Supplier Device Package119-PBGA (14x22)
- Operating Temperature-40°C~85°C TA
- PackagingTape & Reel (TR)
- Published2001
- SeriesMoBL®
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Max Operating Temperature85°C
- Min Operating Temperature-40°C
- TechnologySRAM - Asynchronous
- Voltage - Supply1.65V~2.2V
- InterfaceParallel
- Memory Size16Mb 512K x 32
- Memory TypeVolatile
- Access Time55ns
- Memory FormatSRAM
- Memory InterfaceParallel
- Write Cycle Time - Word, Page55ns
- RoHS StatusROHS3 Compliant
CY62162G18-55BGXIT Overview
The mounting type for this particular component is surface mount, making it easy to install and secure on a surface. Its part status is active, meaning it is currently in production and readily available for purchase. With a minimum operating temperature of -40°C, this component can withstand extreme temperatures without compromising its functionality. The interface for this memory component is parallel, allowing for efficient data transfer. With a memory size of 16Mb 512K x 32, it has a large storage capacity. This memory type is volatile, meaning it requires a continuous power supply to retain data. It has an access time of 55ns and a memory interface of parallel. The write cycle time for both word and page is 55ns, ensuring quick and efficient writing processes. Additionally, this component is ROHS3 compliant, meeting the standards for environmental safety.
CY62162G18-55BGXIT Features
Package / Case: 119-BGA
CY62162G18-55BGXIT Applications
There are a lot of Cypress Semiconductor Corp
CY62162G18-55BGXIT Memory applications.
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
The mounting type for this particular component is surface mount, making it easy to install and secure on a surface. Its part status is active, meaning it is currently in production and readily available for purchase. With a minimum operating temperature of -40°C, this component can withstand extreme temperatures without compromising its functionality. The interface for this memory component is parallel, allowing for efficient data transfer. With a memory size of 16Mb 512K x 32, it has a large storage capacity. This memory type is volatile, meaning it requires a continuous power supply to retain data. It has an access time of 55ns and a memory interface of parallel. The write cycle time for both word and page is 55ns, ensuring quick and efficient writing processes. Additionally, this component is ROHS3 compliant, meeting the standards for environmental safety.
CY62162G18-55BGXIT Features
Package / Case: 119-BGA
CY62162G18-55BGXIT Applications
There are a lot of Cypress Semiconductor Corp
CY62162G18-55BGXIT Memory applications.
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
CY62162G18-55BGXIT More Descriptions
SRAM Chip Sync Single 1.8V 16M-Bit 512K x 32 55ns 119-Pin P-BGA T/R
Asynchronous SRAM, 16384 Kb Density, 55 ns Speed, BGA-119, RoHSCypress Semiconductor SCT
IC SRAM 16MBIT PARALLEL 119PBGA
Asynchronous SRAM, 16384 Kb Density, 55 ns Speed, BGA-119, RoHSCypress Semiconductor SCT
IC SRAM 16MBIT PARALLEL 119PBGA
The three parts on the right have similar specifications to CY62162G18-55BGXIT.
-
ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSupplier Device PackageOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Max Operating TemperatureMin Operating TemperatureTechnologyVoltage - SupplyInterfaceMemory SizeMemory TypeAccess TimeMemory FormatMemory InterfaceWrite Cycle Time - Word, PageRoHS StatusSurface MountJESD-609 CodePbfree CodeNumber of TerminationsTerminal FinishTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReach Compliance CodeTime@Peak Reflow Temperature-Max (s)Pin CountJESD-30 CodeQualification StatusSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)OrganizationMemory WidthMemory DensityAccess Time (Max)LengthHeight Seated (Max)WidthView Compare
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CY62162G18-55BGXIT13 WeeksSurface Mount119-BGA119-PBGA (14x22)-40°C~85°C TATape & Reel (TR)2001MoBL®Active3 (168 Hours)85°C-40°CSRAM - Asynchronous1.65V~2.2VParallel16Mb 512K x 32Volatile55nsSRAMParallel55nsROHS3 Compliant-------------------------
-
-Surface Mount44-TSOP (0.400, 10.16mm Width)--40°C~85°C TATube-MoBL®Obsolete3 (168 Hours)--SRAM - Asynchronous2.2V~3.6V-2Mb 256K x 8Volatile-SRAMParallel45nsROHS3 CompliantYESe4yes32NICKEL PALLADIUM GOLDDUAL26013V1.27mmunknown2032R-PDSO-G32COMMERCIAL3.6V2.2V256KX882097152 bit45 ns20.95mm1.2mm10.16mm
-
-Surface Mount32-SOIC (0.445, 11.30mm Width)--40°C~85°C TATube-MoBL®Obsolete3 (168 Hours)--SRAM - Asynchronous2.2V~3.6V-1Mb 128K x 8Volatile-SRAMParallel55nsROHS3 CompliantYESe4yes32NICKEL PALLADIUM GOLDDUAL26013V1.27mmunknown2032R-PDSO-G32COMMERCIAL3.6V2.2V128KX881048576 bit55 ns20.4465mm2.997mm11.303mm
-
-Surface Mount32-TFSOP (0.724, 18.40mm Width)--40°C~125°C TATube-MoBL®Obsolete3 (168 Hours)--SRAM - Asynchronous4.5V~5.5V-1Mb 128K x 8Volatile-SRAMParallel70nsROHS3 CompliantYESe3/e4yes32MATTE TIN/NICKEL PALLADIUM GOLDDUAL26015V0.5mmunknown2032R-PDSO-G32COMMERCIAL5.5V4.5V128KX881048576 bit70 ns18.4mm1.2mm8mm
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