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Cypress Semiconductor Corp CY2CP1504ZXCT

Name: CY2CP1504ZXCT
Brand: Cypress Semiconductor Corp
SKU: 3116385-CY2CP1504ZXCT
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: CY2CP1504ZXCT

Manufacturer:: Cypress Semiconductor Corp

Ventron No:: 3116385-CY2CP1504ZXCT

Description:: IC CLK BUFFER 2:4 250MHZ 20TSSOP

ECAD Model:

Datasheet:: CY2CP1504ZXCT

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Part Overview

Description
The CY2CP1504 is a low-noise, low-skew, low-propagation delay 1:4 LVCMOS to LVPECL fanout buffer designed for high-speed clock distribution applications. It can select between two separate LVCMOS input clocks using the IN SEL pin. The synchronous clock enable function ensures glitch-free output transitions during enable and disable periods. The device has a fully differential internal architecture optimized for low additive jitter and low skew at operating frequencies up to 250 MHz.

Features
Selectable LVCMOS input clocks
30-ps maximum output-to-output skew
480-ps maximum propagation delay
0.15-ps maximum additive RMS phase jitter at 156.25 MHz (12-kHz to 20-MHz offset)
Up to 250 MHz operation
Synchronous clock enable function
20-Pin thin shrunk small outline package (TSSOP)
2.5-V or 3.3-V operating voltage
Commercial and industrial operating temperature range

Applications
High-speed clock distribution
Clock buffering
Clock fanout
Clock synchronization
Data communication systems
Networking equipment
Test and measurement equipment

Specifications

Cypress Semiconductor Corp CY2CP1504ZXCT technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp CY2CP1504ZXCT.

Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
20-TSSOP (0.173, 4.40mm Width)
Supplier Device Package
20-TSSOP
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
0°C~70°C
Packaging
Tape & Reel (TR)
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Obsolete
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
3 (168 Hours)
Voltage - Supply
2.375V~3.465V
Output
LVPECL
Number of Circuits
Number of Circuits refers to the number of independent signal paths within an electronic component. It indicates how many separate circuits or channels the component can handle simultaneously. For example, an operational amplifier with a Number of Circuits of 2 can amplify two separate input signals independently. This parameter is crucial for determining the component's functionality and its suitability for specific applications.
1
Frequency (Max)
250MHz
Input
LVCMOS
Ratio - Input:Output
2:4
Differential - Input:Output
No/Yes
RoHS Status
ROHS3 Compliant

Product Comparison

The three parts on the right have similar specifications to CY2CP1504ZXCT.

Image

Part Number

Manufacturer

Mounting Type

Package / Case

Supplier Device Package

Operating Temperature

Packaging

Part Status

Moisture Sensitivity Level (MSL)

Voltage - Supply

Output

Number of Circuits

Frequency (Max)

Input

Ratio - Input:Output

Differential - Input:Output

RoHS Status

Factory Lead Time

Contact Plating

Surface Mount

Number of Pins

Published

JESD-609 Code

Number of Terminations

ECCN Code

Subcategory

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Number of Functions

Supply Voltage

Terminal Pitch

Reflow Temperature-Max (s)

Base Part Number

Pin Count

Number of Outputs

Supply Voltage-Max (Vsup)

Power Supplies

Supply Voltage-Min (Vsup)

Max Supply Current

Propagation Delay

Family

fmax-Min

Same Edge Skew-Max (tskwd)

Duty Cycle

Height

Length

Width

Radiation Hardening

Lead Free

Pbfree Code

Terminal Finish

Additional Feature

Reach Compliance Code

JESD-30 Code

Qualification Status

Propagation Delay (tpd)

Height Seated (Max)

Turn On Delay Time

View Compare
CY2CP1504ZXCT

Cypress Semiconductor Corp

Surface Mount

20-TSSOP (0.173, 4.40mm Width)

20-TSSOP

0°C~70°C

Tape & Reel (TR)

Obsolete

3 (168 Hours)

2.375V~3.465V

LVPECL

1

250MHz

LVCMOS

2:4

No/Yes

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
CY2CP1504ZXI

Cypress Semiconductor Corp

Surface Mount

20-TSSOP (0.173, 4.40mm Width)

-

-40°C~85°C

Tube

Obsolete

3 (168 Hours)

2.375V~3.465V

LVPECL

1

250MHz

LVCMOS

2:4

No/Yes

ROHS3 Compliant

15 Weeks

Tin

YES

20

2002

e3

20

EAR99

Clock Drivers

DUAL

GULL WING

260

1

2.5V

0.65mm

30

CY2CP1504

20

4

2.625V

2.5/3.3V

2.375V

61mA

480 ps

2DL

250 MHz

0.03 ns

55 %

950μm

6.6mm

4.5mm

No

Lead Free

-

-

-

-

-

-

-

-

-

CY2CP1504ZXCT vs CY2CP1504ZXI
CY2CC810OXC

Cypress Semiconductor Corp

Surface Mount

20-SSOP (0.209, 5.30mm Width)

-

0°C~70°C

Tube

Obsolete

3 (168 Hours)

2.375V~3.465V

AVCMOS

1

650MHz

LVCMOS

1:10

No/No

ROHS3 Compliant

-

-

YES

-

-

e3

20

-

-

DUAL

GULL WING

260

1

2.5V

0.65mm

20

-

20

-

2.625V

-

2.375V

-

-

2CC

-

0.38 ns

-

-

7.2mm

5.3mm

-

-

yes

MATTE TIN

ALSO OPERATES AT 3.3V SUPPLY

unknown

R-PDSO-G20

COMMERCIAL

3.5 ns

2mm

-

CY2CP1504ZXCT vs CY2CC810OXC
CY2CP1504ZXC

Cypress Semiconductor Corp

Surface Mount

20-TSSOP (0.173, 4.40mm Width)

-

0°C~70°C

Tube

Obsolete

3 (168 Hours)

2.375V~3.465V

LVPECL

1

250MHz

LVCMOS

2:4

No/Yes

ROHS3 Compliant

15 Weeks

-

YES

20

2002

e3

20

EAR99

Clock Drivers

DUAL

GULL WING

260

1

2.5V

0.65mm

30

CY2CP1504

20

4

2.625V

2.5/3.3V

2.375V

-

480 ps

2DL

250 MHz

0.03 ns

55 %

-

6.5mm

-

No

Lead Free

-

Matte Tin (Sn)

-

-

-

-

-

-

480 ps

CY2CP1504ZXCT vs CY2CP1504ZXC