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Cypress Semiconductor Corp CY2CC910OXC

Part Number:

CY2CC910OXC

Manufacturer:

Cypress Semiconductor Corp

Ventron No:

2975171-CY2CC910OXC

Description:

IC CLK BUFFER 1:10 650MHZ 20SSOP

ECAD Model:

Datasheet:

CY2CC910

Payment:

Payment

Delivery:

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Part Overview

Description
Cypress CY2CC910 fanout buffer with 1 input and 10 outputs
Ideal for voltage conversion between 3.3 V, 2.5 V, and 1.8 V
Designed for clock management in data communications applications
Large fanout reduces loading on input clock

Features
Low voltage operation: 3.3 V, 2.5 V, 1.8 V
Over voltage tolerant input (hot swappable)
1:10 fanout
Drives 50Ohm or 75Ohm load
Low input capacitance
Low output skew
Low propagation delay (typical less than 4 ns)
High speed operation: 200 MHz at 1.8 V, 650 MHz at 2.5 V and 3.3 V
Industrial temperature range
Available in SSOP package

Applications
Clock management in data communications systems
Voltage conversion between 3.3 V, 2.5 V, and 1.8 V

Specifications

Cypress Semiconductor Corp CY2CC910OXC technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp CY2CC910OXC.

  • Mount
    Surface Mount
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    20-SSOP (0.209, 5.30mm Width)
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    20
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    0°C~70°C
  • Packaging
    Tube
  • Published
    2010
  • JESD-609 Code
    e3
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    3 (168 Hours)
  • Number of Terminations
    20
  • Terminal Finish
    Matte Tin (Sn)
  • Additional Feature
    ALSO OPERATES AT 2.5 V AND 3.3 V POWER SUPPLY
  • Subcategory
    Clock Drivers
  • Max Power Dissipation
    750mW
  • Voltage - Supply
    1.71V~3.465V
  • Terminal Position
    DUAL
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    1.8V
  • Terminal Pitch
    0.65mm
  • Reach Compliance Code
    unknown
  • Reflow Temperature-Max (s)
    20
  • Base Part Number
    CY2CC910
  • Pin Count
    20
  • Number of Outputs

    Number of Outputs refers to the number of independent output signals or channels that an electronic component can provide. It indicates the capability of the component to drive multiple external devices or circuits simultaneously. A higher number of outputs allows for greater flexibility and connectivity in electronic systems.

    10
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    1.8V
  • Number of Circuits

    Number of Circuits refers to the number of independent signal paths within an electronic component. It indicates how many separate circuits or channels the component can handle simultaneously. For example, an operational amplifier with a Number of Circuits of 2 can amplify two separate input signals independently. This parameter is crucial for determining the component's functionality and its suitability for specific applications.

    1
  • Power Dissipation

    Power Dissipation is the maximum amount of power that an electronic component can safely dissipate without being damaged. It is typically measured in watts (W) and is determined by the component's physical size, material properties, and design. Exceeding the power dissipation rating can lead to overheating, reduced performance, and even component failure.

    750mW
  • Propagation Delay
    4 ns
  • Quiescent Current

    Quiescent current is the amount of current drawn by an electronic component when it is not actively performing its intended function. It is typically measured in milliamps (mA) or microamps (µA). Quiescent current is important because it can affect the overall power consumption of a circuit, especially in battery-powered devices. Components with high quiescent current can drain batteries more quickly than those with low quiescent current.

    25mA
  • Frequency (Max)
    650MHz
  • Family
    2CC
  • Input
    AVCMOS
  • Ratio - Input:Output
    1:10
  • Differential - Input:Output
    No/No
  • Same Edge Skew-Max (tskwd)
    0.2 ns
  • Height Seated (Max)
    2mm
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    7.2mm
  • Width
    5.3mm
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free

Product Comparison

The three parts on the right have similar specifications to CY2CC910OXC.
  • Image
    Part Number
    Manufacturer
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Operating Temperature
    Packaging
    Published
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Additional Feature
    Subcategory
    Max Power Dissipation
    Voltage - Supply
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Reach Compliance Code
    Reflow Temperature-Max (s)
    Base Part Number
    Pin Count
    Number of Outputs
    Qualification Status
    Operating Supply Voltage
    Number of Circuits
    Power Dissipation
    Propagation Delay
    Quiescent Current
    Frequency (Max)
    Family
    Input
    Ratio - Input:Output
    Differential - Input:Output
    Same Edge Skew-Max (tskwd)
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Lead Free
    Factory Lead Time
    Contact Plating
    Surface Mount
    ECCN Code
    Output
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Max Supply Current
    fmax-Min
    Duty Cycle
    Height
    Radiation Hardening
    Pbfree Code
    JESD-30 Code
    Propagation Delay (tpd)
    Number of True Outputs
    Turn On Delay Time
    View Compare
  • CY2CC910OXC
    CY2CC910OXC
    Surface Mount
    Surface Mount
    20-SSOP (0.209, 5.30mm Width)
    20
    0°C~70°C
    Tube
    2010
    e3
    Obsolete
    3 (168 Hours)
    20
    Matte Tin (Sn)
    ALSO OPERATES AT 2.5 V AND 3.3 V POWER SUPPLY
    Clock Drivers
    750mW
    1.71V~3.465V
    DUAL
    GULL WING
    260
    1
    1.8V
    0.65mm
    unknown
    20
    CY2CC910
    20
    10
    Not Qualified
    1.8V
    1
    750mW
    4 ns
    25mA
    650MHz
    2CC
    AVCMOS
    1:10
    No/No
    0.2 ns
    2mm
    7.2mm
    5.3mm
    ROHS3 Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • CY2CP1504ZXI
    -
    Surface Mount
    20-TSSOP (0.173, 4.40mm Width)
    20
    -40°C~85°C
    Tube
    2002
    e3
    Obsolete
    3 (168 Hours)
    20
    -
    -
    Clock Drivers
    -
    2.375V~3.465V
    DUAL
    GULL WING
    260
    1
    2.5V
    0.65mm
    -
    30
    CY2CP1504
    20
    4
    -
    -
    1
    -
    480 ps
    -
    250MHz
    2DL
    LVCMOS
    2:4
    No/Yes
    0.03 ns
    -
    6.6mm
    4.5mm
    ROHS3 Compliant
    Lead Free
    15 Weeks
    Tin
    YES
    EAR99
    LVPECL
    2.625V
    2.5/3.3V
    2.375V
    61mA
    250 MHz
    55 %
    950μm
    No
    -
    -
    -
    -
    -
  • CY2CC910OXCT
    -
    Surface Mount
    20-SSOP (0.209, 5.30mm Width)
    -
    0°C~70°C
    Tape & Reel (TR)
    -
    e3
    Obsolete
    3 (168 Hours)
    20
    MATTE TIN
    ALSO OPERATES AT 2.5 V AND 3.3 V POWER SUPPLY
    -
    -
    1.71V~3.465V
    DUAL
    GULL WING
    260
    1
    1.8V
    0.65mm
    unknown
    20
    -
    20
    -
    COMMERCIAL
    -
    1
    -
    -
    -
    650MHz
    2CC
    AVCMOS
    1:10
    No/No
    0.2 ns
    2mm
    7.2mm
    5.3mm
    ROHS3 Compliant
    -
    -
    -
    YES
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    yes
    R-PDSO-G20
    3.5 ns
    10
    -
  • CY2CP1504ZXC
    -
    Surface Mount
    20-TSSOP (0.173, 4.40mm Width)
    20
    0°C~70°C
    Tube
    2002
    e3
    Obsolete
    3 (168 Hours)
    20
    Matte Tin (Sn)
    -
    Clock Drivers
    -
    2.375V~3.465V
    DUAL
    GULL WING
    260
    1
    2.5V
    0.65mm
    -
    30
    CY2CP1504
    20
    4
    -
    -
    1
    -
    480 ps
    -
    250MHz
    2DL
    LVCMOS
    2:4
    No/Yes
    0.03 ns
    -
    6.5mm
    -
    ROHS3 Compliant
    Lead Free
    15 Weeks
    -
    YES
    EAR99
    LVPECL
    2.625V
    2.5/3.3V
    2.375V
    -
    250 MHz
    55 %
    -
    No
    -
    -
    -
    -
    480 ps

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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