Cypress Semiconductor Corp CY14V116N-BZ30XI
- Part Number:
- CY14V116N-BZ30XI
- Manufacturer:
- Cypress Semiconductor Corp
- Ventron No:
- 3229523-CY14V116N-BZ30XI
- Description:
- IC NVSRAM 16MBIT 30NS 165FBGA
- Datasheet:
- CY14V116N-BZ30XI
Cypress Semiconductor Corp CY14V116N-BZ30XI technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp CY14V116N-BZ30XI.
- Factory Lead Time7 Weeks
- Contact PlatingCopper, Silver, Tin
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case165-LBGA
- Number of Pins165
- Operating Temperature-40°C~85°C TA
- PackagingTray
- Published2005
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations165
- ECCN Code3A991.B.2.B
- HTS Code8542.32.00.41
- TechnologyNVSRAM (Non-Volatile SRAM)
- Voltage - Supply1.7V~3.6V
- Terminal PositionBOTTOM
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Number of Functions1
- Supply Voltage3V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- Operating Supply Voltage3V
- Supply Voltage-Max (Vsup)3.6V
- Supply Voltage-Min (Vsup)2.7V
- Memory Size16Mb 1M x 16
- Memory TypeNon-Volatile
- Operating ModeASYNCHRONOUS
- Memory FormatNVSRAM
- Memory InterfaceParallel
- Data Bus Width16b
- Organization1MX16
- Memory Width16
- Write Cycle Time - Word, Page30ns
- Density16 Mb
- Access Time (Max)30 ns
- Height Seated (Max)1.4mm
- Length17mm
- RoHS StatusROHS3 Compliant
CY14V116N-BZ30XI Overview
This particular component is manufactured by Cypress Semiconductor Corp and falls under the category of Memory chips. It is designed with a contact plating of Copper, Silver, and Tin, and is packaged in a tray. This specific model was first published in 2005 and is currently still in active production. It has a Moisture Sensitivity Level (MSL) rating of 3, meaning it can withstand exposure to moisture for up to 168 hours without being damaged. The component has a single function and a terminal pitch of 1mm. Its memory size is 16Mb, specifically 1M x 16, and it utilizes a parallel memory interface. The maximum access time for this chip is 30 nanoseconds.
CY14V116N-BZ30XI Features
Package / Case: 165-LBGA
165 Pins
Operating Supply Voltage:3V
CY14V116N-BZ30XI Applications
There are a lot of Cypress Semiconductor Corp CY14V116N-BZ30XI Memory applications.
networking
eDRAM
cell phones
Camcorders
eSRAM
hard disk drive (HDD)
main computer memory
printers
personal digital assistants
Cache memory
This particular component is manufactured by Cypress Semiconductor Corp and falls under the category of Memory chips. It is designed with a contact plating of Copper, Silver, and Tin, and is packaged in a tray. This specific model was first published in 2005 and is currently still in active production. It has a Moisture Sensitivity Level (MSL) rating of 3, meaning it can withstand exposure to moisture for up to 168 hours without being damaged. The component has a single function and a terminal pitch of 1mm. Its memory size is 16Mb, specifically 1M x 16, and it utilizes a parallel memory interface. The maximum access time for this chip is 30 nanoseconds.
CY14V116N-BZ30XI Features
Package / Case: 165-LBGA
165 Pins
Operating Supply Voltage:3V
CY14V116N-BZ30XI Applications
There are a lot of Cypress Semiconductor Corp CY14V116N-BZ30XI Memory applications.
networking
eDRAM
cell phones
Camcorders
eSRAM
hard disk drive (HDD)
main computer memory
printers
personal digital assistants
Cache memory
CY14V116N-BZ30XI More Descriptions
CY14V116N Series 16 Mb (1024 K × 16) 3.6 V Surface Mount nvSRAM - FBGA-165
NVRAM NVSRAM Parallel 16Mbit 3V/3.3V 165-Pin FBGA Tray
NON-VOLATILE SRAM, 1MX16, 30NS P
NVRAM NVSRAM Parallel 16Mbit 3V/3.3V 165-Pin FBGA Tray
NON-VOLATILE SRAM, 1MX16, 30NS P
The three parts on the right have similar specifications to CY14V116N-BZ30XI.
-
ImagePart NumberManufacturerFactory Lead TimeContact PlatingMountMounting TypePackage / CaseNumber of PinsOperating TemperaturePackagingPublishedPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeHTS CodeTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReflow Temperature-Max (s)Operating Supply VoltageSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Memory SizeMemory TypeOperating ModeMemory FormatMemory InterfaceData Bus WidthOrganizationMemory WidthWrite Cycle Time - Word, PageDensityAccess Time (Max)Height Seated (Max)LengthRoHS StatusSurface MountTime@Peak Reflow Temperature-Max (s)JESD-30 CodeMemory DensityWidthReach Compliance CodePin CountQualification StatusSupplier Device PackageAccess TimeView Compare
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CY14V116N-BZ30XI7 WeeksCopper, Silver, TinSurface MountSurface Mount165-LBGA165-40°C~85°C TATray2005Active3 (168 Hours)1653A991.B.2.B8542.32.00.41NVSRAM (Non-Volatile SRAM)1.7V~3.6VBOTTOMNOT SPECIFIED13V1mmNOT SPECIFIED3V3.6V2.7V16Mb 1M x 16Non-VolatileASYNCHRONOUSNVSRAMParallel16b1MX161630ns16 Mb30 ns1.4mm17mmROHS3 Compliant-----------
-
26 Weeks--Surface Mount60-LFBGA--40°C~85°C TATray-Active3 (168 Hours)603A991.A.28542.90.00.00NVSRAM (Non-Volatile SRAM)2.7V~3.6VBOTTOMNOT SPECIFIED13V0.75mm--3.6V2.7V16Mb 1M x 16Non-VolatileASYNCHRONOUSNVSRAMParallel-1MX161625ns-25 ns1.2mm18mmROHS3 CompliantYESNOT SPECIFIEDR-PBGA-B6016777216 bit10mm-----
-
---Surface Mount44-TSOP (0.400, 10.16mm Width)--40°C~85°C TATube-Obsolete3 (168 Hours)44--NVSRAM (Non-Volatile SRAM)2.7V~3.6VDUAL-13V0.8mm--3.6V2.7V4Mb 512K x 8Non-VolatileASYNCHRONOUSNVSRAMParallel-512KX8845ns-45 ns1.194mm18.415mmROHS3 CompliantYES-R-PDSO-G444194304 bit10.16mmunknown44COMMERCIAL--
-
---Surface Mount48-TFBGA-0°C~70°C TATube-Obsolete3 (168 Hours)---NVSRAM (Non-Volatile SRAM)2.7V~3.6V---------4Mb 512K x 8Non-Volatile-NVSRAMParallel---45ns----Non-RoHS Compliant--------48-FBGA (6x10)45ns
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