KEMET CWR09KC106KB

Tolerance in electronic components refers to the allowable deviation from the specified value. It indicates the range within which the actual value of the component can vary while still meeting the manufacturer's specifications. Tolerance is typically expressed as a percentage of the nominal value, such as ±5% or ±10%. A lower tolerance indicates a tighter range of acceptable values, resulting in more precise and consistent performance.

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

Lifetime @ Temp. refers to the time it takes for a component's performance to degrade by half at a specified temperature. It is a measure of the component's reliability and stability over time. A longer lifetime indicates a more reliable component that is less likely to fail prematurely. The temperature at which the lifetime is specified is important because temperature can significantly affect the degradation rate of electronic components.

Lead spacing refers to the distance between the centers of two adjacent leads on an electronic component. It is typically measured in millimeters (mm) or inches (in). Lead spacing is an important parameter to consider when designing printed circuit boards (PCBs), as it determines the size and layout of the board. Proper lead spacing ensures that the component can be properly mounted and soldered onto the PCB, and that there is sufficient clearance between the leads to prevent short circuits.

Failure Rate (FR) is a measure of the reliability of an electronic component. It is defined as the number of failures per unit time, typically expressed in failures per million hours (FPMH). FR is used to predict the expected lifetime of a component and to compare the reliability of different components. A lower FR indicates a more reliable component. Factors that can affect FR include temperature, voltage, and current.