CGS2535VX
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Texas Instruments CGS2535VX

Part Number:
CGS2535VX
Manufacturer:
Texas Instruments
Ventron No:
2974998-CGS2535VX
Description:
IC CLK BUFFER 4:16 125MHZ 28PLCC
ECAD Model:
Datasheet:
CGS2535
Payment:
Payment
Delivery:
Delivery

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Part Overview
Description
The CGS2535V/CGS2535TV are clock drivers designed for driving memory arrays with large fanouts at high speeds. They are noninverting 4 to 16 drivers with CMOS I/O structures. The CGS2535 specification guarantees parttopart skew variation.

Features
Guaranteed:
1.0 ns rise and fall times while driving 12 inches of 500Ω microstrip terminated with 25 pF
350 ps pintopin skew (los and los)
650 ps parttopart variation on positive or negative transition 5V Voc
Operates with either 3.3V or 5.0V supply
Inputs 5V tolerant with Voc in 3.3V range
Symmetric output current drive: 24 mA Iowa
Industrial temperature range 40°C to 85°C
Symmetric package orientation
Large fanout for memory driving applications
Guaranteed 2 kV ESD protection
Implemented on National's ABT family process
28pin PLCC for optimum skew performance

Applications
Memory driving applications
Clock distribution
Highspeed data transmission
Specifications
Texas Instruments CGS2535VX technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments CGS2535VX.
  • Mount
    Surface Mount
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    28-LCC (J-Lead)
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    28
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    0°C~70°C
  • Packaging
    Tape & Reel (TR)
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Voltage - Supply
    3V~5.25V
  • Frequency

    Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.

    125MHz
  • Base Part Number
    CGS2535
  • Number of Outputs

    Number of Outputs refers to the number of independent output signals or channels that an electronic component can provide. It indicates the capability of the component to drive multiple external devices or circuits simultaneously. A higher number of outputs allows for greater flexibility and connectivity in electronic systems.

    16
  • Number of Circuits

    Number of Circuits refers to the number of independent signal paths within an electronic component. It indicates how many separate circuits or channels the component can handle simultaneously. For example, an operational amplifier with a Number of Circuits of 2 can amplify two separate input signals independently. This parameter is crucial for determining the component's functionality and its suitability for specific applications.

    1
  • Propagation Delay
    5 ns
  • Turn On Delay Time
    5 ns
  • Input
    CMOS
  • Ratio - Input:Output
    4:16
  • Differential - Input:Output
    No/No
  • Radiation Hardening
    No
  • RoHS Status
    Non-RoHS Compliant
  • Lead Free
    Contains Lead
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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