KEMET C323C184JAR5TA7301

Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

Voltage - Rated refers to the maximum voltage that an electronic component can withstand without being damaged. It is typically specified in volts (V) and is an important parameter to consider when selecting components for a circuit. Exceeding the rated voltage can lead to component failure, so it is important to ensure that the voltage applied to a component does not exceed its rated voltage.

Lead spacing refers to the distance between the centers of two adjacent leads on an electronic component. It is typically measured in millimeters (mm) or inches (in). Lead spacing is an important parameter to consider when designing printed circuit boards (PCBs), as it determines the size and layout of the board. Proper lead spacing ensures that the component can be properly mounted and soldered onto the PCB, and that there is sufficient clearance between the leads to prevent short circuits.