0 Shopping Cart

KEMET C317C339DAG5TA

Part Number:

C317C339DAG5TA

Manufacturer:

KEMET

Ventron No:

491760-C317C339DAG5TA

Description:

CAP CER 3.3PF 250V C0G RADIAL

ECAD Model:

Datasheet:

C317C339DAG5TA

Payment:

Payment

Delivery:

Delivery

Quick Request Quote

Please send RFQ , We will respond immediately.

Part Number
Quantity
Company
E-mail
Phone
Comments
  • One Stop Service

    One Stop Service

  • Competitive Price

    Competitive Price

  • Source Traceability

    Source Traceability

  • Same Day Delivery

    Same Day Delivery

Specifications

KEMET C317C339DAG5TA technical specifications, attributes, parameters and parts with similar specifications to KEMET C317C339DAG5TA.

  • Factory Lead Time
    13 Weeks
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Through Hole
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    Radial
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -55°C~125°C
  • Packaging
    Bulk
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    GoldMax 300 Comm C0G
  • Size / Dimension
    0.150Lx0.100W 3.81mmx2.54mm
  • Tolerance

    Tolerance in electronic components refers to the allowable deviation from the specified value. It indicates the range within which the actual value of the component can vary while still meeting the manufacturer's specifications. Tolerance is typically expressed as a percentage of the nominal value, such as ±5% or ±10%. A lower tolerance indicates a tighter range of acceptable values, resulting in more precise and consistent performance.

    ±0.5pF
  • Feature
    Low ESL
  • Pbfree Code
    yes
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Temperature Coefficient

    Temperature Coefficient (TC) measures the relative change in a component's value due to temperature variations. It is expressed as a percentage change per degree Celsius (°C). A positive TC indicates an increase in value with increasing temperature, while a negative TC indicates a decrease. TC is crucial for ensuring stable circuit performance over a range of temperatures. It helps designers compensate for temperature-induced changes and maintain desired component characteristics.

    C0G NP0
  • Applications
    General Purpose
  • Voltage - Rated

    Voltage - Rated refers to the maximum voltage that an electronic component can withstand without being damaged. It is typically specified in volts (V) and is an important parameter to consider when selecting components for a circuit. Exceeding the rated voltage can lead to component failure, so it is important to ensure that the voltage applied to a component does not exceed its rated voltage.

    250V
  • Capacitance

    Capacitance is the ability of a component to store electrical charge. It is measured in farads (F). A capacitor is a passive electronic component that consists of two conductors separated by an insulator. When a voltage is applied across the capacitor, charge builds up on the conductors. The amount of charge that can be stored depends on the capacitance of the capacitor. Capacitors are used in a variety of electronic circuits, including filters, timing circuits, and energy storage devices.

    3.3pF
  • Lead Spacing

    Lead spacing refers to the distance between the centers of two adjacent leads on an electronic component. It is typically measured in millimeters (mm) or inches (in). Lead spacing is an important parameter to consider when designing printed circuit boards (PCBs), as it determines the size and layout of the board. Proper lead spacing ensures that the component can be properly mounted and soldered onto the PCB, and that there is sufficient clearance between the leads to prevent short circuits.

    0.200 5.08mm
  • Lead Style
    Formed Leads
  • Height Seated (Max)
    0.200 5.08mm
  • RoHS Status
    ROHS3 Compliant

Description

C317C339DAG5TA Overview
The size/dimension of the program on this device is 0.150Lx0.100W 3.81mmx2.54mm.In general, the temperature coefficient of resistance is defined as the change in electrical resistance of a substance per degree of temperature change.

C317C339DAG5TA Features
a size/dimension of 0.150Lx0.100W 3.81mmx2.54mm
with C0G NP0 being the highest temperature coefficient


C317C339DAG5TA Applications
There are a lot of KEMET
C317C339DAG5TA applications of ceramic capacitors.


General electronic equipment
Mobile devices
Servers, PCs, tablets
Power supply circuit
C317C339DAG5TA More Descriptions
CAP CER 3.3PF 250V C0G/NP0 RAD
OEMs, CMs ONLY (NO BROKERS)

Product Comparison

The three parts on the right have similar specifications to C317C339DAG5TA.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Operating Temperature
    Packaging
    Series
    Size / Dimension
    Tolerance
    Feature
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Temperature Coefficient
    Applications
    Voltage - Rated
    Capacitance
    Lead Spacing
    Lead Style
    Height Seated (Max)
    RoHS Status
    View Compare
  • C317C339DAG5TA
    C317C339DAG5TA
    13 Weeks
    Through Hole
    Radial
    -55°C~125°C
    Bulk
    GoldMax 300 Comm C0G
    0.150Lx0.100W 3.81mmx2.54mm
    ±0.5pF
    Low ESL
    yes
    Active
    1 (Unlimited)
    C0G NP0
    General Purpose
    250V
    3.3pF
    0.200 5.08mm
    Formed Leads
    0.200 5.08mm
    ROHS3 Compliant
    -
  • C317C100F3G5TA
    13 Weeks
    Through Hole
    Radial
    -55°C~125°C
    Bulk
    GoldMax 300 Comm C0G
    0.150Lx0.100W 3.81mmx2.54mm
    ±1%
    Low ESL
    yes
    Active
    1 (Unlimited)
    C0G NP0
    General Purpose
    25V
    10pF
    0.200 5.08mm
    Formed Leads
    0.200 5.08mm
    ROHS3 Compliant
  • C317C100FAG5TA7301
    13 Weeks
    Through Hole
    Radial
    -55°C~125°C
    Tape & Reel (TR)
    GoldMax 300 Comm C0G
    0.150Lx0.100W 3.81mmx2.54mm
    ±1%
    Low ESL
    yes
    Active
    1 (Unlimited)
    C0G NP0
    General Purpose
    250V
    10pF
    0.200 5.08mm
    Formed Leads
    0.200 5.08mm
    ROHS3 Compliant
  • C317C100F3G5TA7301
    13 Weeks
    Through Hole
    Radial
    -55°C~125°C
    Tape & Reel (TR)
    GoldMax 300 Comm C0G
    0.150Lx0.100W 3.81mmx2.54mm
    ±1%
    Low ESL
    yes
    Active
    1 (Unlimited)
    C0G NP0
    General Purpose
    25V
    10pF
    0.200 5.08mm
    Formed Leads
    0.200 5.08mm
    ROHS3 Compliant

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

Latest News

  • 26 September 2023
    W25Q128JVSIQ Footprint, Features and Package
    Ⅰ. W25Q128JVSIQ descriptionⅡ. W25Q128JVSIQ symbol and footprintⅢ. Technical parametersⅣ. Features of W25Q128JVSIQⅤ. Pin configuration of W25Q128JVSIQⅥ. Package of W25Q128JVSIQⅦ. What are the characteristics of the SPI interface of...
  • 26 September 2023
    TDA7560 Audio Power Amplifier: Symbol, Features and Application
    Ⅰ. Overview of TDA7560Ⅱ. Pin connection, symbol and footprint of TDA7560Ⅲ. Technical parametersⅣ. Features of TDA7560Ⅴ. Application of TDA7560Ⅵ. Are TDA7560 and TDA7851 interchangeable?Ⅶ. TDA7560 car power amplifier...
  • 27 September 2023
    BC640 PNP Transistor: Features, Package and Other Details
    Ⅰ. Overview of BC640Ⅱ. Symbol and footprint of BC640Ⅲ. Technical parametersⅣ. Features of BC640Ⅴ. Pinout and package of BC640Ⅵ. Application of BC640Ⅶ. How to optimize the performance of...
  • 27 September 2023
    Introduction to the BTS7960B Motor Drive Module
    Ⅰ. What is BTS7960B?Ⅱ. BTS7960B symbol, footprint and pin configurationⅢ. Technical parametersⅣ. Features of BTS7960BⅤ. What are the advantages and disadvantages of BTS7960B?Ⅵ. How to optimize the BTS7960B...