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Rohm Semiconductor BR24S08FV-WE2

Part Number:

BR24S08FV-WE2

Manufacturer:

Rohm Semiconductor

Ventron No:

3719092-BR24S08FV-WE2

Description:

IC EEPROM 8KBIT 400KHZ 8SSOP

Datasheet:

BR24S08FV-WE2

Payment:

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Delivery:

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Part Overview

Description
The BR24Sxxx-W is a serial EEPROM with an I²C BUS interface. It is a highly reliable, low-power device that is suitable for a wide range of applications.

Features
Conforms to the I²C BUS standard
1.7V to 5.5V single power supply
FAST MODE 400kHz at 1.7V to 5.5V
Page write mode for efficient initial value writing
Auto erase and auto end function for data rewrite
Low current consumption:
Write operation (5V): 0.5mA (Typ.)
Read operation (5V): 0.2mA (Typ.)
Standby operation (5V): 0.1μA (Typ.)
Write mistake prevention function
Write protect function
Data rewrite up to 1,000,000 times
Data retention for 40 years
Noise filter built in SCL/SDA terminal
Shipment data all address FFh

Applications
The BR24Sxxx-W is suitable for a wide range of applications, including:
Data logging
Configuration storage
Parameter storage
Calibration data storage
Security key storage

Specifications

Rohm Semiconductor BR24S08FV-WE2 technical specifications, attributes, parameters and parts with similar specifications to Rohm Semiconductor BR24S08FV-WE2.

  • Factory Lead Time
    16 Weeks
  • Mount
    Surface Mount
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    8-TSSOP (0.173, 4.40mm Width)
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C TA
  • Packaging
    Tape & Reel (TR)
  • Published
    2009
  • Pbfree Code
    yes
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Number of Terminations
    8
  • ECCN Code
    EAR99
  • HTS Code
    8542.32.00.51
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    CMOS
  • Voltage - Supply
    1.7V~5.5V
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    2.5V
  • Terminal Pitch
    0.65mm
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Base Part Number
    BR24S08
  • Pin Count
    8
  • JESD-30 Code
    R-PDSO-G8
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    5.5V
  • Power Supplies
    1.8/5V
  • Supply Voltage-Min (Vsup)
    1.8V
  • Interface

    In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

    2-Wire, I2C, Serial
  • Memory Size
    8Kb 1K x 8
  • Memory Type

    Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.

    Non-Volatile
  • Operating Mode
    SYNCHRONOUS
  • Clock Frequency

    Clock Frequency, measured in Hertz (Hz), is the rate at which an electronic component, such as a microprocessor or oscillator, generates electrical pulses. It determines the speed at which the component can process data and execute instructions. A higher clock frequency generally indicates faster performance, but also higher power consumption and heat generation. Clock Frequency is a crucial parameter for timing-sensitive applications, such as digital signal processing and real-time systems.

    400kHz
  • Supply Current-Max
    0.002mA
  • Access Time

    Access time is the time it takes for a memory device to retrieve data from a specific location. It is typically measured in nanoseconds (ns) and is a critical factor in determining the performance of a computer system. The lower the access time, the faster the memory device can retrieve data and the faster the computer can perform tasks.

    900 ns
  • Memory Format

    Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.

    EEPROM
  • Memory Interface
    I2C
  • Organization
    1KX8
  • Memory Width
    8
  • Write Cycle Time - Word, Page
    5ms
  • Density
    8 kb
  • Standby Current-Max
    0.000002A
  • Serial Bus Type
    I2C
  • Endurance
    1000000 Write/Erase Cycles
  • Write Cycle Time-Max (tWC)
    5ms
  • Data Retention Time-Min
    40
  • Write Protection
    HARDWARE
  • I2C Control Byte
    1010DMMR
  • Height Seated (Max)
    1.5mm
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    4.4mm
  • Width
    3mm
  • RoHS Status
    ROHS3 Compliant

Product Comparison

The three parts on the right have similar specifications to BR24S08FV-WE2.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mount
    Mounting Type
    Package / Case
    Operating Temperature
    Packaging
    Published
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    HTS Code
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    Base Part Number
    Pin Count
    JESD-30 Code
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Interface
    Memory Size
    Memory Type
    Operating Mode
    Clock Frequency
    Supply Current-Max
    Access Time
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Write Cycle Time - Word, Page
    Density
    Standby Current-Max
    Serial Bus Type
    Endurance
    Write Cycle Time-Max (tWC)
    Data Retention Time-Min
    Write Protection
    I2C Control Byte
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Contact Plating
    Number of Pins
    Operating Supply Voltage
    Reach Compliance Code
    View Compare
  • BR24S08FV-WE2
    BR24S08FV-WE2
    16 Weeks
    Surface Mount
    Surface Mount
    8-TSSOP (0.173, 4.40mm Width)
    -40°C~85°C TA
    Tape & Reel (TR)
    2009
    yes
    Active
    1 (Unlimited)
    8
    EAR99
    8542.32.00.51
    CMOS
    1.7V~5.5V
    DUAL
    NOT SPECIFIED
    1
    2.5V
    0.65mm
    NOT SPECIFIED
    BR24S08
    8
    R-PDSO-G8
    Not Qualified
    5.5V
    1.8/5V
    1.8V
    2-Wire, I2C, Serial
    8Kb 1K x 8
    Non-Volatile
    SYNCHRONOUS
    400kHz
    0.002mA
    900 ns
    EEPROM
    I2C
    1KX8
    8
    5ms
    8 kb
    0.000002A
    I2C
    1000000 Write/Erase Cycles
    5ms
    40
    HARDWARE
    1010DMMR
    1.5mm
    4.4mm
    3mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
  • BR24C02-RDW6TP
    7 Weeks
    Surface Mount
    Surface Mount
    8-TSSOP (0.173, 4.40mm Width)
    -40°C~85°C TA
    Tape & Reel (TR)
    2005
    yes
    Not For New Designs
    1 (Unlimited)
    8
    EAR99
    -
    CMOS
    1.8V~5.5V
    DUAL
    NOT SPECIFIED
    1
    2.5V
    0.65mm
    NOT SPECIFIED
    BR24C02
    8
    -
    Not Qualified
    -
    -
    -
    2-Wire, I2C, Serial
    2Kb 256 x 8
    Non-Volatile
    ASYNCHRONOUS
    100kHz
    -
    3.5 μs
    EEPROM
    I2C
    2KX1
    1
    10ms
    2 kb
    3e-7A
    I2C
    1000000 Write/Erase Cycles
    10ms
    40
    HARDWARE
    1010DDDR
    1.2mm
    4.4mm
    3mm
    ROHS3 Compliant
    Copper, Tin
    8
    5V
    -
  • BR24G01FVT-3GE2
    10 Weeks
    Surface Mount
    Surface Mount
    8-TSSOP (0.173, 4.40mm Width)
    -40°C~85°C TA
    Tape & Reel (TR)
    2013
    -
    Active
    1 (Unlimited)
    8
    -
    -
    CMOS
    1.6V~5.5V
    DUAL
    NOT SPECIFIED
    1
    2.5V
    0.65mm
    NOT SPECIFIED
    BR24G01
    -
    -
    Not Qualified
    5.5V
    -
    1.6V
    2-Wire, I2C, Serial
    1Kb 128 x 8
    Non-Volatile
    SYNCHRONOUS
    400kHz
    0.002mA
    900 ns
    EEPROM
    I2C
    -
    8
    5ms
    1 kb
    0.000002A
    I2C
    1000000 Write/Erase Cycles
    5ms
    40
    HARDWARE
    1010DDDR
    1.2mm
    4.4mm
    3mm
    ROHS3 Compliant
    Tin
    8
    -
    -
  • BR24C08-RDS6TP
    -
    Surface Mount
    Surface Mount
    8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
    -40°C~85°C TA
    Tape & Reel (TR)
    2005
    yes
    Not For New Designs
    1 (Unlimited)
    8
    EAR99
    -
    CMOS
    1.8V~5.5V
    DUAL
    NOT SPECIFIED
    1
    2.5V
    0.65mm
    NOT SPECIFIED
    BR24C08
    8
    -
    Not Qualified
    -
    -
    -
    2-Wire, I2C, Serial
    8Kb 1K x 8
    Non-Volatile
    ASYNCHRONOUS
    100kHz
    -
    3.5 μs
    EEPROM
    I2C
    -
    1
    10ms
    8 kb
    3e-7A
    I2C
    1000000 Write/Erase Cycles
    10ms
    40
    HARDWARE
    1010DMMR
    1.1mm
    3mm
    3mm
    ROHS3 Compliant
    Copper, Tin
    8
    5V
    unknown

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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