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Rohm Semiconductor BD6112FVM-TR

Part Number:

BD6112FVM-TR

Manufacturer:

Rohm Semiconductor

Ventron No:

3296153-BD6112FVM-TR

Description:

IC REG SWTCHD CAP INV 10MA 8MSOP

ECAD Model:

Datasheet:

BD6112FVM

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Delivery:

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Part Overview

Description
BD6112FVM is a charge-pump negative supply IC with a built-in regulator. The charge-pump block inverts the positive supply voltage in the VBAT pin into a negative voltage, which is generated from the NEGOUT pin. The regulator block stabilizes this negative voltage with low noise, producing it from the OUT pin. Output voltage values of this regulator can be controlled by the voltage value inputted to the VIN pin and are determined by OUT-1.6 x VIN.

Features
Built-in high efficiency, inverting charge-pump
Built-in negative voltage regulator (low noise, output voltage variable)
Built-in standby SW (pull-down resistance 1MΩ)
Ultra-small MSOP8 package

Applications
Small terminal devices such as cellular phones, PHS, and PDA
Other equipment driven by batteries that require negative voltage

Specifications

Rohm Semiconductor BD6112FVM-TR technical specifications, attributes, parameters and parts with similar specifications to Rohm Semiconductor BD6112FVM-TR.

  • Factory Lead Time
    8 Weeks
  • Mount
    Surface Mount
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    8-VSSOP, 8-MSOP (0.110, 2.80mm Width)
  • Supplier Device Package
    8-MSOP
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -30°C~85°C TA
  • Packaging
    Tape & Reel (TR)
  • Published
    2001
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Max Operating Temperature
    85°C
  • Min Operating Temperature
    -30°C
  • Base Part Number
    BD6112
  • Function

    Function refers to the primary purpose or role of an electronic component within a circuit. It describes the specific task or operation that the component is designed to perform. For example, a resistor's function is to limit current flow, a capacitor's function is to store electrical energy, and a transistor's function is to amplify or switch signals. Understanding the function of a component is crucial for selecting the appropriate component for a particular application and ensuring its proper operation within the circuit.

    Step-Down
  • Number of Outputs

    Number of Outputs refers to the number of independent output signals or channels that an electronic component can provide. It indicates the capability of the component to drive multiple external devices or circuits simultaneously. A higher number of outputs allows for greater flexibility and connectivity in electronic systems.

    1
  • Voltage - Input (Max)
    5.5V
  • Voltage - Input (Min)
    2.5V
  • Output Configuration

    Output Configuration refers to the arrangement of output terminals or pins on an electronic component. It specifies the number, type, and arrangement of these terminals, allowing for various connection options. This parameter is crucial for determining the component's compatibility with other devices and ensuring proper signal flow within a circuit.

    Negative
  • Current - Output
    10mA
  • Topology
    Charge Pump
  • Frequency - Switching
    120kHz
  • Synchronous Rectifier
    No
  • RoHS Status
    ROHS3 Compliant

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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