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Microchip Technology ATSAMA5D42A-CU

Part Number:

ATSAMA5D42A-CU

Manufacturer:

Microchip Technology

Ventron No:

3147234-ATSAMA5D42A-CU

Description:

IC MCU 32BIT 128KB ROM 361TFBGA

ECAD Model:

Datasheet:

ATSAMA5D42A-CU

Payment:

Payment

Delivery:

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Part Overview

Description
High-performance, power-efficient Arm Cortex-A5 processor-based MPU running at up to 600 MHz
Arm NEON SIMD engine for accelerated signal processing, multimedia, and graphics
128 KB L2-Cache for high system performance
Arm TrustZone for strong security perimeter
Three software-selectable low-power modes: Idle, Ultra-low-power, and Backup
Internal multi-layer bus architecture with 32 DMA channels
Supports DDR2/LPDDR/LPDDR2 and SLC/MLC NAND Flash memory with 24-bit ECC

Features
720p hardware video decoder
LCD controller with overlays for hardware-accelerated image composition
Resistive touchscreen function
CMOS sensor interface
Dual 10/100 Ethernet MAC with IEEE1588
Three HS USB ports
UARTS, SPIs, and 12Cs
"On-the-fly" encryption-decryption process from external DDR memory
Tamper detection pins
Secure storage of critical data
Integrity check monitor (ICM)
Secure boot
Dedicated coprocessor for public key cryptography (RSA, ECC)
AES, 3DES, SHA function, and TRNG

Applications
Control panel/HMI applications needing video playback
Applications requiring high levels of connectivity in the industrial and consumer market
Secure gateways
IoT

Specifications

Microchip Technology ATSAMA5D42A-CU technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology ATSAMA5D42A-CU.

  • Factory Lead Time
    19 Weeks
  • Contact Plating
    Copper, Silver, Tin
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    361-TFBGA
  • Surface Mount
    YES
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    361
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C TA
  • Packaging
    Tray
  • Published
    2014
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    SAMA5D4
  • JESD-609 Code
    e2
  • Pbfree Code
    yes
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    3 (168 Hours)
  • Number of Terminations
    361
  • Terminal Finish
    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    1.26V
  • Terminal Pitch
    0.8mm
  • Frequency

    Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.

    528MHz
  • Base Part Number
    ATSAMA5D42
  • Operating Supply Voltage
    1.8V
  • Interface

    In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

    2-Wire, EBI/EMI, Ethernet, I2C, MMC, SD, SPI, UART, USART, USB
  • Max Supply Voltage
    1.98V
  • Min Supply Voltage
    1.62V
  • Memory Size
    128kB
  • Oscillator Type
    Internal
  • Number of I/O
    152
  • Speed

    Speed, in the context of electronic components, refers to the rate at which the component can process or transmit data. It is typically measured in units of bits per second (bps), megabits per second (Mbps), or gigabits per second (Gbps). The speed of a component is determined by its internal design and the technology used to manufacture it. Faster components can handle more data in a given amount of time, which can improve the overall performance of a system.

    600 MHz
  • RAM Size
    128kB
  • Memory Type

    Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.

    L2 Cache, ROM, SRAM
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Core Processor

    Core Processor refers to the central processing unit (CPU) of an electronic device. It is the brain of the device, responsible for executing instructions, processing data, and managing the overall operation of the system. The core processor's speed, number of cores, and architecture determine the device's performance and capabilities.

    ARM® Cortex®-A5
  • Peripherals
    DMA, LCD, POR, PWM, WDT
  • Data Bus Width

    Data Bus Width refers to the number of bits that can be transmitted simultaneously on a data bus. It determines the amount of data that can be transferred between components in a single operation. A wider data bus allows for faster data transfer rates and higher system performance. Common data bus widths include 8, 16, 32, and 64 bits, with wider buses typically found in high-performance systems.

    32b
  • Number of Timers/Counters
    3
  • Address Bus Width
    26
  • Core Architecture
    ARM
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • Format
    FIXED POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    1.2V 1.8V 3.3V
  • Ethernet

    Ethernet is a standardized networking technology for local area networks (LANs). It defines the physical layer and data link layer of the OSI model. Ethernet is widely used in homes, businesses, and schools to connect computers, printers, and other devices. The term "Ethernet" is derived from the word "ether," which refers to the hypothetical medium through which electromagnetic waves were once thought to travel. Ethernet was originally developed by Xerox in the 1970s as a way to connect computers and printers. It was later adopted by the IEEE as a standard, and it has since become the most widely used LAN technology in the world.

    10/100Mbps (1)
  • Number of Cores/Bus Width

    Number of Cores/Bus Width refers to the number of processing units (cores) within a processor and the width of the data path (bus) that connects them. A higher number of cores allows for parallel processing, improving performance for multi-threaded applications. Bus width determines the amount of data that can be transferred simultaneously, affecting overall system speed. A wider bus width enables faster data transfer and reduces bottlenecks.

    1 Core 32-Bit
  • Graphics Acceleration
    Yes
  • RAM Controllers
    LPDDR, LPDDR2, DDR2
  • USB
    USB 2.0 (3)
  • Additional Interfaces
    EBI, I2C, MMC/SD/SDIO, SPI, SSC, UART, USART
  • Co-Processors/DSP
    Multimedia; NEON™ SIMD
  • Number of Cores

    Number of Cores refers to the number of independent processing units within a single electronic component, such as a processor or graphics card. Each core operates as a separate unit, allowing for parallel processing and increased computational power. A higher number of cores generally indicates improved performance, especially for tasks that can be divided into multiple threads.

    1
  • Security Features
    AES, SHA, TDES, TRNG
  • Display & Interface Controllers
    LCD, Touchscreen
  • REACH SVHC
    No SVHC
  • RoHS Status
    ROHS3 Compliant

Product Comparison

The three parts on the right have similar specifications to ATSAMA5D42A-CU.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Contact Plating
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    Published
    Series
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Technology
    Terminal Position
    Terminal Form
    Supply Voltage
    Terminal Pitch
    Frequency
    Base Part Number
    Operating Supply Voltage
    Interface
    Max Supply Voltage
    Min Supply Voltage
    Memory Size
    Oscillator Type
    Number of I/O
    Speed
    RAM Size
    Memory Type
    uPs/uCs/Peripheral ICs Type
    Core Processor
    Peripherals
    Data Bus Width
    Number of Timers/Counters
    Address Bus Width
    Core Architecture
    Boundary Scan
    Low Power Mode
    Format
    Integrated Cache
    Voltage - I/O
    Ethernet
    Number of Cores/Bus Width
    Graphics Acceleration
    RAM Controllers
    USB
    Additional Interfaces
    Co-Processors/DSP
    Number of Cores
    Security Features
    Display & Interface Controllers
    REACH SVHC
    RoHS Status
    Mount
    Mounting Type
    Subcategory
    Qualification Status
    Supply Voltage-Max (Vsup)
    Voltage - Supply (Vcc/Vdd)
    Program Memory Type
    Core Size
    Program Memory Size
    Connectivity
    Bit Size
    Data Converter
    Watchdog Timer
    Has ADC
    DMA Channels
    PWM Channels
    CPU Family
    Number of ADC Channels
    Height Seated (Max)
    Length
    Lead Free
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Max Frequency
    Number of Programmable I/O
    Number of UART Channels
    Number of PWM Channels
    Number of I2C Channels
    Number of SPI Channels
    Height
    Width
    Radiation Hardening
    Max Power Dissipation
    Supply Voltage-Min (Vsup)
    View Compare
  • ATSAMA5D42A-CU
    ATSAMA5D42A-CU
    19 Weeks
    Copper, Silver, Tin
    361-TFBGA
    YES
    361
    -40°C~85°C TA
    Tray
    2014
    SAMA5D4
    e2
    yes
    Obsolete
    3 (168 Hours)
    361
    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
    CMOS
    BOTTOM
    BALL
    1.26V
    0.8mm
    528MHz
    ATSAMA5D42
    1.8V
    2-Wire, EBI/EMI, Ethernet, I2C, MMC, SD, SPI, UART, USART, USB
    1.98V
    1.62V
    128kB
    Internal
    152
    600 MHz
    128kB
    L2 Cache, ROM, SRAM
    MICROPROCESSOR, RISC
    ARM® Cortex®-A5
    DMA, LCD, POR, PWM, WDT
    32b
    3
    26
    ARM
    YES
    YES
    FIXED POINT
    YES
    1.2V 1.8V 3.3V
    10/100Mbps (1)
    1 Core 32-Bit
    Yes
    LPDDR, LPDDR2, DDR2
    USB 2.0 (3)
    EBI, I2C, MMC/SD/SDIO, SPI, SSC, UART, USART
    Multimedia; NEON™ SIMD
    1
    AES, SHA, TDES, TRNG
    LCD, Touchscreen
    No SVHC
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • ATSAM3N0AA-MU
    8 Weeks
    -
    48-VFQFN Exposed Pad
    -
    48
    -40°C~85°C TA
    Tray
    1997
    SAM3N
    e3
    yes
    Active
    3 (168 Hours)
    48
    Matte Tin (Sn)
    CMOS
    QUAD
    NO LEAD
    1.8V
    0.5mm
    48MHz
    ATSAM3N
    1.8V
    I2C, IrDA, SPI, UART, USART
    -
    -
    32kB
    Internal
    34
    -
    8K x 8
    -
    MICROCONTROLLER, RISC
    ARM® Cortex®-M3
    Brown-out Detect/Reset, DMA, POR, PWM, WDT
    32b
    6
    -
    ARM
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    Surface Mount
    Surface Mount
    Microcontrollers
    Not Qualified
    1.95V
    1.62V~3.6V
    FLASH
    32-Bit
    32KB 32K x 8
    I2C, IrDA, SPI, UART/USART
    32
    A/D 8x10b
    Yes
    YES
    YES
    YES
    CORTEX-M3
    8
    0.9mm
    7mm
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • ATSAM3N1AA-AU
    -
    -
    48-LQFP
    -
    48
    -40°C~85°C TA
    Tray
    1997
    SAM3N
    -
    -
    Obsolete
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    48MHz
    ATSAM3N
    -
    I2C, IrDA, SPI, UART, USART
    3.6V
    1.62V
    64kB
    Internal
    34
    48MHz
    8K x 8
    FLASH
    -
    ARM® Cortex®-M3
    Brown-out Detect/Reset, DMA, POR, PWM, WDT
    32b
    18
    32b
    ARM
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    No SVHC
    ROHS3 Compliant
    Surface Mount
    Surface Mount
    -
    -
    -
    1.62V~3.6V
    FLASH
    32-Bit
    64KB 64K x 8
    I2C, IrDA, SPI, UART/USART
    -
    A/D 8x10b
    Yes
    -
    -
    -
    -
    8
    -
    7mm
    -
    48-LQFP (7x7)
    85°C
    -40°C
    48MHz
    79
    2
    4
    2
    1
    1.45mm
    7mm
    No
    -
    -
  • ATSAM4CP16B-AHU-Y
    6 Weeks
    Tin
    176-LQFP
    -
    176
    -40°C~85°C TA
    Tray
    2015
    SAM4CP
    e3
    yes
    Last Time Buy
    3 (168 Hours)
    176
    -
    CMOS
    QUAD
    GULL WING
    1.2V
    0.5mm
    120MHz
    ATSAM4CP16B
    -
    I2C, IrDA, SPI, UART, USART
    -
    -
    1MB
    Internal
    69
    -
    152K x 8
    -
    MICROPROCESSOR CIRCUIT
    ARM® Cortex®-M4/M4F
    Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
    32b
    2
    -
    ARM
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    Surface Mount
    Surface Mount
    -
    -
    -
    1.08V~3.6V
    FLASH
    32-Bit Dual-Core
    1MB 1M x 8
    I2C, IrDA, SPI, UART/USART
    -
    A/D 8x10b
    Yes
    -
    -
    -
    -
    -
    1.6mm
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    394mW
    1.08V

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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