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Alpha & Omega Semiconductor Inc. AOZ1331DI

Part Number:

AOZ1331DI

Manufacturer:

Alpha & Omega Semiconductor Inc.

Ventron No:

3840099-AOZ1331DI

Description:

DUAL SMART LOAD SWITCH

Datasheet:

AOZ1331DI

Payment:

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Delivery:

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Part Overview

Description
The AOZ1331DI is a dual-channel load switch with a typical 20mΩ on-resistance in a small package. It contains two n-channel MOSFETs for up to 5.5V input voltage operation and 6A current per channel with a 2.5V to 5V bias supply. Each load switch is independently controlled by a low voltage control signal through the ON1/ON2 pin.
The AOZ1331DI integrates an internal 2200Ω load resistor in each channel for quick output discharge when the load switch is off. The optional external capacitor connected to CT1/CT2 controls the output slew rate.
The AOZ1331DI is available in a 3mm x 2mm DFN-14L package with a bottom thermal pad and is rated over a -40°C to 85°C ambient temperature range.

Features
0.8V to 5.5V input voltage range
6A continuous current per channel
Low Ros(ON) internal NFETs:
20mΩ at VBS 2.5V to 5V & VBIAS ≥ VIN
Low quiescent current:
80µA (both channels)
60μA (single channel)
Adjustable rise time
2.5V to 5V bias voltage
Integrated quick output discharge resistor
Thermally enhanced 3mm x 2mm DFN-14L package

Applications
Portable computers
Ultrabooks
Tablet PCs
Set top boxes
LCD TVs
Telecom/Networking/Datacom equipment (SSD)
Consumer electronics

Specifications

Alpha & Omega Semiconductor Inc. AOZ1331DI technical specifications, attributes, parameters and parts with similar specifications to Alpha & Omega Semiconductor Inc. AOZ1331DI.

  • Factory Lead Time
    16 Weeks
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    14-WFDFN Exposed Pad
  • Supplier Device Package
    14-DFN (3x2)
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C TA
  • Packaging
    Tape & Reel (TR)
  • Published
    2011
  • Feature
    Load Discharge, Slew Rate Controlled
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Max Operating Temperature
    85°C
  • Min Operating Temperature
    -40°C
  • Number of Outputs

    Number of Outputs refers to the number of independent output signals or channels that an electronic component can provide. It indicates the capability of the component to drive multiple external devices or circuits simultaneously. A higher number of outputs allows for greater flexibility and connectivity in electronic systems.

    2
  • Output Type

    Output type refers to the type of signal or power that an electronic component can produce. It can be analog or digital, AC or DC, and can vary in voltage, current, or power levels. The output type is determined by the component's design and is crucial for matching it with other components in a circuit. Understanding the output type ensures proper signal processing, power delivery, and overall system functionality.

    N-Channel
  • Max Output Current
    6A
  • Number of Channels

    Number of Channels refers to the number of independent signal paths within an electronic component. It indicates how many separate signals can be processed or transmitted simultaneously. For example, an audio amplifier with two channels can amplify two separate audio signals, while a multi-channel data converter can convert multiple analog signals into digital data. The number of channels is a crucial parameter for determining the component's functionality and application.

    2
  • Interface

    In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

    On/Off
  • Current - Output (Max)
    6A
  • Output Configuration

    Output Configuration refers to the arrangement of output terminals or pins on an electronic component. It specifies the number, type, and arrangement of these terminals, allowing for various connection options. This parameter is crucial for determining the component's compatibility with other devices and ensuring proper signal flow within a circuit.

    High Side
  • Voltage - Supply (Vcc/Vdd)
    Not Required
  • Switch Type

    Switch Type refers to the type of switching mechanism used in an electronic switch. It indicates the technology or design employed to control the flow of electrical signals or power.

    General Purpose
  • Ratio - Input:Output
    1:1
  • Voltage - Load
    0.8V~5.5V
  • Rds On (Typ)
    20mOhm
  • RoHS Status
    RoHS Compliant

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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