AMC1203BDUBR

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Texas Instruments AMC1203BDUBR

Part Number:

AMC1203BDUBR

Manufacturer:

Texas Instruments

Ventron No:

3012280-AMC1203BDUBR

Description:

±250-mV input, precision current sensing basic isolated modulator with int clock

ECAD Model:

Datasheet:

amc1203

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Payment

Delivery:

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Specifications

Texas Instruments AMC1203BDUBR technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments AMC1203BDUBR.

  • Factory Lead Time
    12 Weeks
  • Lifecycle Status
    ACTIVE (Last Updated: 3 days ago)
  • Contact Plating
    Gold
  • Mount
    Surface Mount
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    8-SMD, Gull Wing
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    8
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~105°C
  • Packaging
    Tape & Reel (TR)
  • JESD-609 Code
    e4
  • Pbfree Code
    yes
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    3 (168 Hours)
  • Number of Terminations
    8
  • Subcategory
    Other Analog ICs
  • Max Power Dissipation
    110mW
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    CMOS
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    5V
  • Terminal Pitch
    2.54mm
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Base Part Number
    AMC1203
  • Pin Count
    8
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    5V
  • Polarity

    Polarity refers to the direction of current flow through an electronic component. It is typically indicated by a plus (+) or minus (-) sign on the component's body. Components with polarity must be connected correctly in a circuit to function properly. For example, a diode will only allow current to flow in one direction, from the positive terminal to the negative terminal. If a diode is connected backwards, it will not conduct current.

    Bipolar
  • Power Supplies
    5V
  • Configuration
    ADC
  • Number of Channels

    Number of Channels refers to the number of independent signal paths within an electronic component. It indicates how many separate signals can be processed or transmitted simultaneously. For example, an audio amplifier with two channels can amplify two separate audio signals, while a multi-channel data converter can convert multiple analog signals into digital data. The number of channels is a crucial parameter for determining the component's functionality and application.

    1
  • Interface

    In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

    Serial
  • Max Supply Voltage
    5.5V
  • Min Supply Voltage
    4.5V
  • Analog IC - Other Type
    ANALOG CIRCUIT
  • Power Dissipation

    Power Dissipation is the maximum amount of power that an electronic component can safely dissipate without being damaged. It is typically measured in watts (W) and is determined by the component's physical size, material properties, and design. Exceeding the power dissipation rating can lead to overheating, reduced performance, and even component failure.

    110mW
  • Number of Bits
    16
  • Input Type

    Input Type refers to the type of signal that an electronic component can accept as input.

    Differential
  • Architecture

    Architecture refers to the internal design and organization of an electronic component. It encompasses the arrangement of functional blocks, their interconnections, and the overall data flow within the component. The architecture determines the component's performance characteristics, such as speed, power consumption, and functionality. It also influences the component's size, cost, and reliability.

    Sigma-Delta
  • Supply Type
    Analog, Digital
  • Reference Type

    Reference type is a parameter that specifies the type of reference used in an electronic component. It can be either a voltage reference or a current reference. A voltage reference provides a stable voltage output, while a current reference provides a stable current output. The type of reference used depends on the application. For example, a voltage reference is used in a voltage regulator to provide a stable voltage output, while a current reference is used in a current source to provide a stable current output.

    Internal
  • Data Interface

    Data Interface refers to the physical and logical means by which an electronic component communicates with other components or systems. It defines the protocols, pinouts, and signal characteristics used for data exchange. The Data Interface parameter specifies the type of interface supported by the component, such as SPI, I2C, UART, or Ethernet. It ensures compatibility and proper communication between different devices within a system.

    SPI
  • Resolution
    2 B
  • Sampling Rate

    Sampling rate refers to the number of times per second that an analog signal is measured and converted into a digital signal. It is expressed in Hertz (Hz) and determines the maximum frequency that can be accurately represented in the digital signal. A higher sampling rate results in a more accurate representation of the analog signal, but also increases the amount of data that needs to be processed. The sampling rate must be at least twice the highest frequency component of the analog signal to avoid aliasing, where high-frequency components are incorrectly represented as lower-frequency components.

    40 ksps
  • Voltage - Supply, Analog
    5V
  • Sampling Rate (Per Second)
    40k
  • Power Consumption
    80mW
  • Integral Nonlinearity (INL)
    6 LSB
  • Conversion Rate
    40 ksps
  • Signal to Noise Ratio (SNR)
    85 dB
  • Differential Nonlinearity
    1 LSB
  • Height

    Height, in the context of electronic components, refers to the vertical dimension of the component. It is typically measured in millimeters (mm) or inches (in). Height is an important parameter to consider when designing and assembling electronic circuits, as it affects the overall size and form factor of the device. Components with a smaller height are often preferred for applications where space is limited, such as in portable devices or embedded systems.

    4.85mm
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    9.5mm
  • Width
    6.57mm
  • Thickness

    Thickness, in the context of electronic components, refers to the vertical distance between two opposing surfaces of a component. It is typically measured in millimeters (mm) or inches (in). Thickness is a crucial parameter that affects the component's physical dimensions, weight, and performance characteristics. It influences factors such as heat dissipation, electrical insulation, and mechanical stability. Thinner components generally offer better heat dissipation and space efficiency, while thicker components may provide enhanced durability and structural integrity.

    3.3mm
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free

Description

AMC1203BDUBR Overview
The Texas Instruments Data Acquisition - Analog to Digital Converters (ADC) chip is a highly sought after component in the electronics industry. With a lifecycle status of ACTIVE, this chip is constantly being updated and improved upon to meet the ever-evolving needs of the market. Its Pbfree code indicates that it is free of lead, making it a more environmentally friendly option. This chip can withstand high temperatures, with a peak reflow temperature of 260 degrees Celsius, ensuring its durability and reliability in various applications. It boasts 1 function, making it a versatile and efficient choice for data acquisition processes. The operating supply voltage of 5V and minimum supply voltage of 4.5V make it compatible with a wide range of systems. Its analog and digital supply types allow for seamless integration into different systems, while its SPI data interface ensures fast and efficient data transfer. With a resolution of 2 B, this chip offers precise and accurate data conversion. Additionally, it is ROHS3 compliant, meeting the strict regulations for hazardous substances, making it a safe and responsible choice for manufacturers. Overall, the Texas Instruments Data Acquisition - Analog to Digital Converters (ADC) chip offers high performance, reliability, and compliance with industry standards, making it a top choice for engineers and designers.

AMC1203BDUBR Features
1 Functions
8 basic kinds of terminations
8 pin count
Minimal supply voltage of 4.5V
5V power supplies

AMC1203BDUBR Applications
There are a lot of Texas Instruments AMC1203BDUBR ADC applications.

Data Acquisition Systems
Scientific instruments.
High Speed Data Acquisition
CMOS Image sensors for mobile applications
Scientific instruments
Digital signal processing
Micro and pico cell systems, software radios
Digital Multimeters, PLC's (Programming Logic Controllers)
In-building wireless telephony
TD-SCDMA, WiMAX
AMC1203BDUBR More Descriptions
±250-mV input, precision current sensing basic isolated modulator with int clock 8-SOP -40 to 105
Analog to Digital Converters - ADC 1B 10MHz 2nd-Order Iso Delta-Sigma Mod
Single Channel Single ADC Delta-Sigma 40ksps 16-bit Serial 8-Pin SOP T/R
IC DELTASIGMA MOD 16 BIT 8SOP GW

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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