Microsemi Corporation AFS250-FGG256I
- Part Number:
- AFS250-FGG256I
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3634298-AFS250-FGG256I
- Description:
- IC FPGA 114 I/O 256FBGA
- Datasheet:
- AFS250-FGG256I
Microsemi Corporation AFS250-FGG256I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation AFS250-FGG256I.
- Factory Lead Time10 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 3 weeks ago)
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case256-LBGA
- Number of Pins256
- Weight400.011771mg
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2009
- SeriesFusion®
- JESD-609 Codee1
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations256
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- HTS Code8542.39.00.01
- TechnologyCMOS
- Voltage - Supply1.425V~1.575V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)260
- Supply Voltage1.5V
- Terminal Pitch1mm
- Frequency1.0989GHz
- Reflow Temperature-Max (s)40
- Base Part NumberAFS250
- Operating Supply Voltage1.5V
- Number of I/O114
- RAM Size4.5kB
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Total RAM Bits36864
- Number of Gates250000
- Number of Registers6144
- Height1.2mm
- Length17mm
- Width17mm
- Radiation HardeningNo
- RoHS StatusRoHS Compliant
AFS250-FGG256I Overview
The manufacturer of this component is Microsemi Corporation. It is a type of Embedded - FPGAs (Field Programmable Gate Array) chip, which falls under the Embedded - FPGAs (Field Programmable Gate Array) category. The package or casing of this chip is 256-LBGA and it weighs 400.011771 milligrams. It is packaged in a tray and has a JESD-609 Code of e1. The terminal position is located at the bottom of the chip. The supply voltage required for this chip is 1.5V. The base part number is AFS250 and it is a type of FIELD PROGRAMMABLE GATE ARRAY. The height of the chip is 1.2mm and it is compliant with RoHS regulations.
AFS250-FGG256I Features
114 I/Os
Up to 36864 RAM bits
256 LABs/CLBs
6144 registers
Operating from a frequency of 1.0989GHz
AFS250-FGG256I Applications
There are a lot of Microsemi Corporation AFS250-FGG256I FPGAs applications.
Medical ultrasounds
Automation
Electronic Warfare
Telecommunication
Software-defined radios
Scientific Instruments
Camera time adjustments
Military Temperature
Broadcast
Defense Applications
The manufacturer of this component is Microsemi Corporation. It is a type of Embedded - FPGAs (Field Programmable Gate Array) chip, which falls under the Embedded - FPGAs (Field Programmable Gate Array) category. The package or casing of this chip is 256-LBGA and it weighs 400.011771 milligrams. It is packaged in a tray and has a JESD-609 Code of e1. The terminal position is located at the bottom of the chip. The supply voltage required for this chip is 1.5V. The base part number is AFS250 and it is a type of FIELD PROGRAMMABLE GATE ARRAY. The height of the chip is 1.2mm and it is compliant with RoHS regulations.
AFS250-FGG256I Features
114 I/Os
Up to 36864 RAM bits
256 LABs/CLBs
6144 registers
Operating from a frequency of 1.0989GHz
AFS250-FGG256I Applications
There are a lot of Microsemi Corporation AFS250-FGG256I FPGAs applications.
Medical ultrasounds
Automation
Electronic Warfare
Telecommunication
Software-defined radios
Scientific Instruments
Camera time adjustments
Military Temperature
Broadcast
Defense Applications
AFS250-FGG256I More Descriptions
FPGA Fusion® Family 250K Gates 1098.9MHz 130nm Technology 1.5V 256-Pin FBGA Tray
Field Programmable Gate Array, 6144 Clbs, 250000 Gates, Cmos, Pbga256 Rohs Compliant: Yes |Microchip AFS250-FGG256I
IC FPGA 2MB FLASH 250K 256FBGA
Field Programmable Gate Array, 6144 Clbs, 250000 Gates, Cmos, Pbga256 Rohs Compliant: Yes |Microchip AFS250-FGG256I
IC FPGA 2MB FLASH 250K 256FBGA
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