AFS250-FGG256I

Microsemi Corporation AFS250-FGG256I

Part Number:
AFS250-FGG256I
Manufacturer:
Microsemi Corporation
Ventron No:
3634298-AFS250-FGG256I
Description:
IC FPGA 114 I/O 256FBGA
ECAD Model:
Datasheet:
AFS250-FGG256I

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Specifications
Microsemi Corporation AFS250-FGG256I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation AFS250-FGG256I.
  • Factory Lead Time
    10 Weeks
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 3 weeks ago)
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    256-LBGA
  • Number of Pins
    256
  • Weight
    400.011771mg
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Published
    2009
  • Series
    Fusion®
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    256
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.39.00.01
  • Technology
    CMOS
  • Voltage - Supply
    1.425V~1.575V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    1.5V
  • Terminal Pitch
    1mm
  • Frequency
    1.0989GHz
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    AFS250
  • Operating Supply Voltage
    1.5V
  • Number of I/O
    114
  • RAM Size
    4.5kB
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Total RAM Bits
    36864
  • Number of Gates
    250000
  • Number of Registers
    6144
  • Height
    1.2mm
  • Length
    17mm
  • Width
    17mm
  • Radiation Hardening
    No
  • RoHS Status
    RoHS Compliant
Description
AFS250-FGG256I Overview
The manufacturer of this component is Microsemi Corporation. It is a type of Embedded - FPGAs (Field Programmable Gate Array) chip, which falls under the Embedded - FPGAs (Field Programmable Gate Array) category. The package or casing of this chip is 256-LBGA and it weighs 400.011771 milligrams. It is packaged in a tray and has a JESD-609 Code of e1. The terminal position is located at the bottom of the chip. The supply voltage required for this chip is 1.5V. The base part number is AFS250 and it is a type of FIELD PROGRAMMABLE GATE ARRAY. The height of the chip is 1.2mm and it is compliant with RoHS regulations.

AFS250-FGG256I Features
114 I/Os
Up to 36864 RAM bits
256 LABs/CLBs
6144 registers
Operating from a frequency of 1.0989GHz

AFS250-FGG256I Applications
There are a lot of Microsemi Corporation AFS250-FGG256I FPGAs applications.

Medical ultrasounds
Automation
Electronic Warfare
Telecommunication
Software-defined radios
Scientific Instruments
Camera time adjustments
Military Temperature
Broadcast
Defense Applications
AFS250-FGG256I More Descriptions
FPGA Fusion® Family 250K Gates 1098.9MHz 130nm Technology 1.5V 256-Pin FBGA Tray
Field Programmable Gate Array, 6144 Clbs, 250000 Gates, Cmos, Pbga256 Rohs Compliant: Yes |Microchip AFS250-FGG256I
IC FPGA 2MB FLASH 250K 256FBGA
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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