Microsemi Corporation AFS250-FG256I

AFS250-FG256I Overview
The package or case of this electronic component is a 256-LBGA, which stands for Land Grid Array. This type of package is commonly used for integrated circuits and offers a high number of pins for connections. The weight of this component is 400.011771mg, making it lightweight and easy to handle. It has a wide operating temperature range of -40°C to 100°C, making it suitable for a variety of environments. This component was published in 2013, indicating its reliability and longevity. The terminal position is located at the bottom of the package, while the terminal form is in the shape of a ball. The peak reflow temperature for this component is 225°C, ensuring proper soldering during assembly. With a frequency of 1.0989GHz and a total RAM bits of 36864, this component offers high-speed performance. Its width measures at 17mm, making it compact and space-saving.

AFS250-FG256I Features
114 I/Os
Up to 36864 RAM bits
256 LABs/CLBs
6144 registers
Operating from a frequency of 1.0989GHz

AFS250-FG256I Applications
There are a lot of Microsemi Corporation AFS250-FG256I FPGAs applications.

Filtering and communication encoding
Electronic Warfare
Software-defined radio
Bioinformatics
Artificial intelligence (AI)
Video & Image Processing
ADAS
Development Boards and Shields for Microcontrollers
Server Applications
Security systems