AFS250-2FG256

Microsemi Corporation AFS250-2FG256

Part Number:
AFS250-2FG256
Manufacturer:
Microsemi Corporation
Ventron No:
3127088-AFS250-2FG256
Description:
IC FPGA 114 I/O 256FBGA
ECAD Model:
Datasheet:
AFS250-2FG256

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Specifications
Microsemi Corporation AFS250-2FG256 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation AFS250-2FG256.
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 2 weeks ago)
  • Factory Lead Time
    10 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    256-LBGA
  • Number of Pins
    256
  • Supplier Device Package
    256-FPBGA (17x17)
  • Weight
    400.011771mg
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Series
    Fusion®
  • Published
    2013
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Max Operating Temperature
    70°C
  • Min Operating Temperature
    0°C
  • Voltage - Supply
    1.425V~1.575V
  • Base Part Number
    AFS250
  • Operating Supply Voltage
    1.5V
  • Max Supply Voltage
    1.575V
  • Min Supply Voltage
    1.425V
  • Number of I/O
    114
  • RAM Size
    4.5kB
  • Total RAM Bits
    36864
  • Number of Gates
    250000
  • Max Frequency
    1.47059GHz
  • Speed Grade
    2
  • Number of Registers
    6144
  • Height
    1.2mm
  • Length
    17mm
  • Width
    17mm
  • Radiation Hardening
    No
  • RoHS Status
    Non-RoHS Compliant
Description
AFS250-2FG256 Overview
A 256-LBGA package contains it, and it is available for download. Its 114 I/Os help it transfer data more efficiently. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Fpga chips operates at a voltage of 1.425V~1.575V and uses a battery to supply power. FPGAs belonging to the Fusion® series are a type of FPGA that belong to the Fusion® series of FPGAs. Operating temperatures should be maintained within the 0°C~85°C TJ range at all times when the unit is in use. A model of this FPGA is contained in Tray for the purpose of saving space. Having a RAM bit size of 36864 means that this device will offer you a lot of memory. For related parts, use its base part number AFS250. A significant amount of RAM is allocated to this FPGA module to ensure that the program can operate normally. This cable has 256 pins and is designed to connect to a computer. Providing the FPGA is mounted in Surface Mount as per the specifications of the IC, then it should work perfectly according to its specifications. With a 1.5V supply voltage, designers can fully utilize the flexibility of the device. A maximum operating temperature of 70°C can be reached by this module. Over 0°C should be the operating temperature. 250000 gates make up the basic block of its construction. The registers used in the transfer of and storage of data are 6144 in number. It can take a maximum of 1.575V as the supply voltage. Using a supply voltage as low as 1.425V, fpga semiconductor will work. A FPGA of this type can achieve a speed as high as 1.47059GHz. There is a device package provided by 256-FPBGA (17x17), which is the supplier.

AFS250-2FG256 Features
114 I/Os
Up to 36864 RAM bits
256 LABs/CLBs
70°C gates
6144 registers


AFS250-2FG256 Applications
There are a lot of Microsemi Corporation
AFS250-2FG256 FPGAs applications.


Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
Audio
Automotive
Consumer Electronics
Distributed Monetary Systems
AFS250-2FG256 More Descriptions
FPGA Fusion Family 250K Gates 1470.59MHz 130nm (CMOS) Technology 1.5V 256-Pin FBGA
Afs250-2Fg256 256 Lfbga 17X17X1.7Mm Tray Rohs Compliant: Yes |Microchip AFS250-2FG256
FPGA - Field Programmable Gate Array AFS250-2FG256
Fusion FPGA, 250K System Gates
IC FPGA 2MB FLASH 250K 256FBGA
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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