AFS250-1QNG180I

Microsemi Corporation AFS250-1QNG180I

Part Number:
AFS250-1QNG180I
Manufacturer:
Microsemi Corporation
Ventron No:
3639820-AFS250-1QNG180I
Description:
IC FPGA 65 I/O 180QFN
ECAD Model:
Datasheet:
Fusion Family Mixed Signal FPGAs

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Specifications
Microsemi Corporation AFS250-1QNG180I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation AFS250-1QNG180I.
  • Mounting Type
    Surface Mount
  • Package / Case
    180-WFQFN Dual Rows, Exposed Pad
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~100°C TJ
  • Packaging
    Tray
  • Series
    Fusion®
  • Published
    2013
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    180
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    1.425V~1.575V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BUTT
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Supply Voltage
    1.5V
  • Terminal Pitch
    0.5mm
  • Reach Compliance Code
    compliant
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Base Part Number
    AFS250
  • JESD-30 Code
    S-XBCC-B180
  • Number of Outputs
    65
  • Qualification Status
    Not Qualified
  • Power Supplies
    1.53.3V
  • Number of I/O
    65
  • Clock Frequency
    350MHz
  • Number of Inputs
    65
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Total RAM Bits
    36864
  • Number of Gates
    250000
  • Number of CLBs
    6144
  • Number of Logic Cells
    6144
  • Length
    10mm
  • Height Seated (Max)
    0.8mm
  • Width
    10mm
  • RoHS Status
    RoHS Compliant
Description
AFS250-1QNG180I Overview
There are two packages that contain fpga chips: 180-WFQFN Dual Rows, Exposed Pad package and X package. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. Having 65 I/Os makes data transfers more coherent. The supply voltage is 1.5V volts. In this case, the FPGA part belongs to the Field Programmable Gate Arrays family. An attachment Surface Mount allows the FPGA module to be attached to the development board. The supply voltage of the device is 1.425V~1.575V , at which it runs. The Fusion® series FPGA is a type of FPGA that belongs to the Fusion® family of FPGAs. When operating the machine, it is important to keep the temperature within -40°C~100°C TJ range. This device is equipped with 65 separate outputs, which makes it a very versatile device. There is an FPGA model contained in Tray in order to conserve space. In total, it has 180 terminations on each end. A device like this one offers 36864 RAM bits, which is a considerable amount of memory. In order to find related parts, use the part number AFS250 as a base. The device runs on a 1.53.3V battery and requires no additional power supply to operate. The building block that forms the basis of the system contains 250000 gates. It usually uses a crystal oscillating at a frequency of 350MHz in order to do its work. A CLB is a basic module that determines the architecture of a system. For the building block, it encompasses 6144 logic cells that make up the logic circuit.

AFS250-1QNG180I Features
65 I/Os
Up to 36864 RAM bits


AFS250-1QNG180I Applications
There are a lot of Microsemi Corporation
AFS250-1QNG180I FPGAs applications.


Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
Audio
Automotive
Consumer Electronics
AFS250-1QNG180I More Descriptions
FPGA Fusion® Family 250K Gates 1282.05MHz 130nm (CMOS) Technology 1.5V 180-Pin QFN EP
IC FPGA 2MB FLASH 250K 180-QFN
IC FPGA 65 I/O 180QFN
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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