Texas Instruments AFE1256GBTD
- Part Number:
- AFE1256GBTD
- Manufacturer:
- Texas Instruments
- Ventron No:
- 3006650-AFE1256GBTD
- Description:
- IC AFE DIGTIAL X-RAY DIE
- Datasheet:
- AFE1256GBTD
Description
The AFE1256 is a 256-channel analog front-end (AFE) designed for flat-panel detectors (FPDs) in digital X-ray systems. It features 256 integrators, a programmable gain amplifier (PGA), a correlated double sampler (CDS), analog multiplexers, and four 16-bit analog-to-digital converters (ADCs). The device allows for the integration of positive or negative charge and provides flexibility in system design. It also has a Nap feature for power saving. The AFE1256 is available as a gold-bumped die, a chip-on-film (COF) TDQ package, and a COF-314 TDS package.
Features
256 channels
On-chip, 16-bit ADC
Photodiode short immunity
Column short immunity
High performance:
Noise: 758 e-RMS with 28-pF sensor capacitor in 1.2-pC range
Integral nonlinearity: 2 LSB with internal 16-bit ADC
Minimum scan time: 37.9 us in normal mode, 20 μs in 2x binning mode
Integration:
Eight selectable full-scale ranges: 0.15 pC (min) to 9.6 pC (max)
Built-in correlated double sampler
2x binning (averages charge of two adjacent channels) for faster throughput
Pipelined integrate and read: allows data read during integration
Flexibility:
Electron and hole integration
Low power:
2.9 mW/Ch with ADC
2.3 mW/Ch without ADC
0.1 mW/Ch in Nap mode
Total power-down feature
22-mm x 5-mm gold-bumped die, suitable for TCP and COF2 application
Applications
Flat-panel, X-ray detectors
The AFE1256 is a 256-channel analog front-end (AFE) designed for flat-panel detectors (FPDs) in digital X-ray systems. It features 256 integrators, a programmable gain amplifier (PGA), a correlated double sampler (CDS), analog multiplexers, and four 16-bit analog-to-digital converters (ADCs). The device allows for the integration of positive or negative charge and provides flexibility in system design. It also has a Nap feature for power saving. The AFE1256 is available as a gold-bumped die, a chip-on-film (COF) TDQ package, and a COF-314 TDS package.
Features
256 channels
On-chip, 16-bit ADC
Photodiode short immunity
Column short immunity
High performance:
Noise: 758 e-RMS with 28-pF sensor capacitor in 1.2-pC range
Integral nonlinearity: 2 LSB with internal 16-bit ADC
Minimum scan time: 37.9 us in normal mode, 20 μs in 2x binning mode
Integration:
Eight selectable full-scale ranges: 0.15 pC (min) to 9.6 pC (max)
Built-in correlated double sampler
2x binning (averages charge of two adjacent channels) for faster throughput
Pipelined integrate and read: allows data read during integration
Flexibility:
Electron and hole integration
Low power:
2.9 mW/Ch with ADC
2.3 mW/Ch without ADC
0.1 mW/Ch in Nap mode
Total power-down feature
22-mm x 5-mm gold-bumped die, suitable for TCP and COF2 application
Applications
Flat-panel, X-ray detectors
Texas Instruments AFE1256GBTD technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments AFE1256GBTD.
- Factory Lead Time12 Weeks
- Lifecycle StatusACTIVE (Last Updated: 4 days ago)
- Contact PlatingGold
- Package / CaseDie
- Surface MountYES
- Number of Pins0
- PackagingTray
- Pbfree Codeyes
- Part StatusActive
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations533
- Max Operating Temperature85°C
- Min Operating Temperature0°C
- Terminal PositionUPPER
- Terminal FormNO LEAD
- Number of Functions1
- Base Part NumberAFE1256
- JESD-30 CodeR-XUUC-N533
- Temperature GradeOTHER
- Number of Channels256
- InterfaceSPI
- Analog IC - Other TypeANALOG CIRCUIT
- Number of Bits16
- Resolution2 B
- Power Consumption742mW
- Length22mm
- Width5mm
- RoHS StatusROHS3 Compliant
- Lead FreeLead Free
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