Analog Devices Inc. AD5821AD-WAFER
- Part Number:
- AD5821AD-WAFER
- Manufacturer:
- Analog Devices Inc.
- Ventron No:
- 3629174-AD5821AD-WAFER
- Description:
- IC DAC 10BITS 1CH DIE
- Datasheet:
- AD5821A
Analog Devices Inc. AD5821AD-WAFER technical specifications, attributes, parameters and parts with similar specifications to Analog Devices Inc. AD5821AD-WAFER.
- Mounting TypeSurface Mount
- Package / CaseDie
- Surface MountYES
- Operating Temperature-30°C~85°C
- PackagingTray
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations8
- Terminal PositionUPPER
- Number of Functions1
- Supply Voltage3V
- Base Part NumberAD5821
- JESD-30 CodeR-XUUC-N8
- Output TypeCurrent - Buffered
- Number of Bits10
- ArchitectureCurrent Sink
- Converter TypeD/A CONVERTER
- Reference TypeInternal
- Data InterfaceI2C
- Differential OutputNo
- Voltage - Supply, Analog2.7V~5.5V
- Voltage - Supply, Digital2.7V~5.5V
- Settling Time250μs (Typ)
- Linearity Error-Max (EL)0.3906%
- Input Bit CodeBINARY
- INL/DNL (LSB)±1.5, ±1 (Max)
- Input FormatSERIAL
- Number of D/A Converters1
- Analog Output Voltage-Max5.5V
- Analog Output Voltage-Min0.48V
- RoHS StatusNon-RoHS Compliant
AD5821AD-WAFER Overview
There are two packages that contain it: Die package and X package. The supply voltage is 3V volts. An attachment Surface Mount allows the FPGA module to be attached to the development board. When operating the machine, it is important to keep the temperature within -30°C~85°C range. There is an FPGA model contained in Tray in order to conserve space. In total, it has 8 terminations on each end. In order to find related parts, use the part number AD5821 as a base.
AD5821AD-WAFER Features
Die package
AD5821AD-WAFER Applications
There are a lot of Analog Devices Inc.
AD5821AD-WAFER Digital to Analog Converters (DAC) applications.
Digital Potentiometer
Software Radio
Wireless infrastructure:
WCDMA, CDMA2000, TD-SCDMA, WiMAX
Wideband communications:
LMDS/MMDS, point-to-point
Instrumentation:
RF signal generators, arbitrary waveform generators
Mobile Communications
Process Control and Industrial Automation
There are two packages that contain it: Die package and X package. The supply voltage is 3V volts. An attachment Surface Mount allows the FPGA module to be attached to the development board. When operating the machine, it is important to keep the temperature within -30°C~85°C range. There is an FPGA model contained in Tray in order to conserve space. In total, it has 8 terminations on each end. In order to find related parts, use the part number AD5821 as a base.
AD5821AD-WAFER Features
Die package
AD5821AD-WAFER Applications
There are a lot of Analog Devices Inc.
AD5821AD-WAFER Digital to Analog Converters (DAC) applications.
Digital Potentiometer
Software Radio
Wireless infrastructure:
WCDMA, CDMA2000, TD-SCDMA, WiMAX
Wideband communications:
LMDS/MMDS, point-to-point
Instrumentation:
RF signal generators, arbitrary waveform generators
Mobile Communications
Process Control and Industrial Automation
AD5821AD-WAFER More Descriptions
IC DAC 10BIT A-OUT DIE
IC DAC 10BITS 1CH DIE
IC DAC 10BITS 1CH DIE
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