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Analog Devices Inc. AD5541LRZ-REEL7

Part Number:

AD5541LRZ-REEL7

Manufacturer:

Analog Devices Inc.

Ventron No:

4542248-AD5541LRZ-REEL7

Description:

IC DAC 16BIT SRL IN/VOUT 8-SOIC

ECAD Model:

Datasheet:

AD5541LRZ-REEL7

Payment:

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Delivery:

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Specifications

Analog Devices Inc. AD5541LRZ-REEL7 technical specifications, attributes, parameters and parts with similar specifications to Analog Devices Inc. AD5541LRZ-REEL7.

  • Factory Lead Time
    8 Weeks
  • Lifecycle Status
    PRODUCTION (Last Updated: 1 month ago)
  • Contact Plating
    Tin
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    8-SOIC (0.154, 3.90mm Width)
  • Surface Mount
    YES
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    8
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    0°C~70°C
  • Packaging
    Tape & Reel (TR)
  • JESD-609 Code
    e3
  • Pbfree Code
    no
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Number of Terminations
    8
  • ECCN Code
    EAR99
  • Subcategory
    Other Converters
  • Max Power Dissipation
    6.05mW
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    CMOS
  • Terminal Position
    DUAL
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    3V
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    AD5541
  • Pin Count
    8
  • Output Type

    Output type refers to the type of signal or power that an electronic component can produce. It can be analog or digital, AC or DC, and can vary in voltage, current, or power levels. The output type is determined by the component's design and is crucial for matching it with other components in a circuit. Understanding the output type ensures proper signal processing, power delivery, and overall system functionality.

    Voltage - Unbuffered
  • Operating Supply Voltage
    5V
  • Polarity

    Polarity refers to the direction of current flow through an electronic component. It is typically indicated by a plus (+) or minus (-) sign on the component's body. Components with polarity must be connected correctly in a circuit to function properly. For example, a diode will only allow current to flow in one direction, from the positive terminal to the negative terminal. If a diode is connected backwards, it will not conduct current.

    Unipolar
  • Power Supplies
    5V
  • Interface

    In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

    SPI, Serial
  • Max Supply Voltage
    5.5V
  • Min Supply Voltage
    4.5V
  • Power Dissipation

    Power Dissipation is the maximum amount of power that an electronic component can safely dissipate without being damaged. It is typically measured in watts (W) and is determined by the component's physical size, material properties, and design. Exceeding the power dissipation rating can lead to overheating, reduced performance, and even component failure.

    750μW
  • Number of Bits
    16
  • Max Output Voltage
    5V
  • Min Input Voltage
    2V
  • Slew Rate

    Slew rate is a measure of how quickly an electronic component's output voltage can change in response to a change in its input voltage. It is typically expressed in volts per microsecond (V/µs). A higher slew rate indicates that the component can respond more quickly to changes in its input voltage, which can be important in applications where fast signal processing is required.

    25 V/μs
  • Architecture

    Architecture refers to the internal design and organization of an electronic component. It encompasses the arrangement of functional blocks, their interconnections, and the overall data flow within the component. The architecture determines the component's performance characteristics, such as speed, power consumption, and functionality. It also influences the component's size, cost, and reliability.

    R-2R
  • Max Input Voltage
    5V
  • Converter Type

    Converter Type refers to the type of conversion performed by an electronic component, such as an analog-to-digital converter (ADC) or a digital-to-analog converter (DAC). It specifies the input and output signal types that the converter can handle.

    D/A CONVERTER
  • Supply Type
    Single
  • Reference Type

    Reference type is a parameter that specifies the type of reference used in an electronic component. It can be either a voltage reference or a current reference. A voltage reference provides a stable voltage output, while a current reference provides a stable current output. The type of reference used depends on the application. For example, a voltage reference is used in a voltage regulator to provide a stable voltage output, while a current reference is used in a current source to provide a stable current output.

    External
  • Data Interface

    Data Interface refers to the physical and logical means by which an electronic component communicates with other components or systems. It defines the protocols, pinouts, and signal characteristics used for data exchange. The Data Interface parameter specifies the type of interface supported by the component, such as SPI, I2C, UART, or Ethernet. It ensures compatibility and proper communication between different devices within a system.

    SPI, DSP
  • Differential Output

    Differential Output is a parameter that describes the output signal of an electronic component. It refers to the difference in voltage or current between two output terminals. Differential outputs are commonly used in high-speed circuits and applications where noise immunity is important. By transmitting the signal as a differential pair, the common-mode noise is canceled out, resulting in a more robust and reliable signal.

    No
  • Resolution
    2 B
  • Sampling Rate

    Sampling rate refers to the number of times per second that an analog signal is measured and converted into a digital signal. It is expressed in Hertz (Hz) and determines the maximum frequency that can be accurately represented in the digital signal. A higher sampling rate results in a more accurate representation of the analog signal, but also increases the amount of data that needs to be processed. The sampling rate must be at least twice the highest frequency component of the analog signal to avoid aliasing, where high-frequency components are incorrectly represented as lower-frequency components.

    1.5 Msps
  • Voltage - Supply, Analog
    2.7V~5.5V
  • Min Output Voltage
    0V
  • Voltage - Supply, Digital
    2.7V~5.5V
  • Settling Time
    1μs (Typ)
  • Integral Nonlinearity (INL)
    1 LSB
  • Input Bit Code
    BINARY
  • Number of Converters

    Number of Converters refers to the quantity of analog-to-digital converters (ADCs) or digital-to-analog converters (DACs) present in an electronic component. ADCs convert analog signals into digital form, while DACs perform the reverse operation. The number of converters determines the component's ability to handle multiple analog or digital signals simultaneously. A higher number of converters allows for increased data acquisition or signal generation capabilities.

    1
  • Conversion Rate
    1.5 Msps
  • INL/DNL (LSB)
    ±0.5, ±0.5
  • Signal to Noise Ratio (SNR)
    92 dB
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    4.9mm
  • Width
    3.9mm
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Contains Lead

Description

AD5541LRZ-REEL7 Overview
The mounting type for this particular device is surface mount, which means that it can be attached directly to the surface of a circuit board. This is confirmed by the fact that the surface mount option is listed as "YES." Additionally, this device is labeled as being Pbfree, meaning that it does not contain lead. The maximum power dissipation for this device is 6.05mW, indicating that it is a low power device. The slew rate, which measures how quickly the output can change, is 25 V/μs. The maximum input voltage for this device is 5V, meaning that it can handle a range of input voltages up to 5V. This device is a D/A converter, meaning that it converts a digital signal into an analog signal. It does not have a differential output, meaning that there is only one output signal. The integral nonlinearity (INL) for this device is 1 LSB, indicating that it has a high level of accuracy. The INL/DNL (LSB) is listed as ±0.5, ±0.5, which means that the device has a maximum error of ±0.5 LSB for both INL and DNL. Overall, this device is a surface mount, Pbfree, low power D/A converter with high accuracy and a single output.

AD5541LRZ-REEL7 Features
8-SOIC (0.154, 3.90mm Width) package
8 pin count
8 pins
Minimal input voltage of 2V

AD5541LRZ-REEL7 Applications
There are a lot of Analog Devices Inc. AD5541LRZ-REEL7 Digital to Analog Converters (DAC)?applications.

Closed-loop process control
Motor Control
Wireless infrastructure:
Bus Structured instruments
Optical Networks
Audio Amplifier
Digitally controlled calibration
Automatic Test Equipment
Data Acquisition Systems
Software Controlled Gain Adjustment
AD5541LRZ-REEL7 More Descriptions
SERIAL INPUT LOADING 1 us SETTLING TIME 16-BIT DAC PDSO8
2.7 V to 5.5 V, Serial-Input, Voltage-Output, 16-Bit DAC
Digital to Analog Converters - DAC IC 16-Bit DAC Serial Input VTG Out
DAC 1-CH Segment 16-bit 8-Pin SOIC N T/R

Product Comparison

The three parts on the right have similar specifications to AD5541LRZ-REEL7.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Contact Plating
    Mounting Type
    Package / Case
    Surface Mount
    Number of Pins
    Operating Temperature
    Packaging
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Subcategory
    Max Power Dissipation
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Reflow Temperature-Max (s)
    Base Part Number
    Pin Count
    Output Type
    Operating Supply Voltage
    Polarity
    Power Supplies
    Interface
    Max Supply Voltage
    Min Supply Voltage
    Power Dissipation
    Number of Bits
    Max Output Voltage
    Min Input Voltage
    Slew Rate
    Architecture
    Max Input Voltage
    Converter Type
    Supply Type
    Reference Type
    Data Interface
    Differential Output
    Resolution
    Sampling Rate
    Voltage - Supply, Analog
    Min Output Voltage
    Voltage - Supply, Digital
    Settling Time
    Integral Nonlinearity (INL)
    Input Bit Code
    Number of Converters
    Conversion Rate
    INL/DNL (LSB)
    Signal to Noise Ratio (SNR)
    Length
    Width
    RoHS Status
    Lead Free
    Mount
    Terminal Pitch
    Height Seated (Max)
    Nominal Supply Current
    Differential Nonlinearity
    Number of DAC Channels
    REACH SVHC
    View Compare
  • AD5541LRZ-REEL7
    AD5541LRZ-REEL7
    8 Weeks
    PRODUCTION (Last Updated: 1 month ago)
    Tin
    Surface Mount
    8-SOIC (0.154, 3.90mm Width)
    YES
    8
    0°C~70°C
    Tape & Reel (TR)
    e3
    no
    Active
    1 (Unlimited)
    8
    EAR99
    Other Converters
    6.05mW
    CMOS
    DUAL
    GULL WING
    260
    1
    3V
    30
    AD5541
    8
    Voltage - Unbuffered
    5V
    Unipolar
    5V
    SPI, Serial
    5.5V
    4.5V
    750μW
    16
    5V
    2V
    25 V/μs
    R-2R
    5V
    D/A CONVERTER
    Single
    External
    SPI, DSP
    No
    2 B
    1.5 Msps
    2.7V~5.5V
    0V
    2.7V~5.5V
    1μs (Typ)
    1 LSB
    BINARY
    1
    1.5 Msps
    ±0.5, ±0.5
    92 dB
    4.9mm
    3.9mm
    ROHS3 Compliant
    Contains Lead
    -
    -
    -
    -
    -
    -
    -
    -
  • AD5542ABCPZ-1-RL7
    8 Weeks
    PRODUCTION (Last Updated: 1 month ago)
    Tin
    Surface Mount
    10-VFDFN Exposed Pad, CSP
    -
    10
    -40°C~85°C
    Tape & Reel (TR)
    e3
    no
    Active
    3 (168 Hours)
    10
    EAR99
    -
    1.5mW
    -
    DUAL
    -
    260
    1
    5V
    40
    AD5542
    10
    Voltage - Unbuffered
    5V
    Bipolar, Unipolar
    -
    SPI, Serial
    5.5V
    2.7V
    825mW
    16
    10V
    2V
    17 V/μs
    R-2R
    5.5V
    D/A CONVERTER
    Single
    External
    SPI, DSP
    No
    2 B
    -
    2.7V~5.5V
    2V
    2.7V~5.5V
    1μs (Typ)
    1 LSB
    BINARY
    1
    -
    ±0.5, ±0.5
    92 dB
    3mm
    3mm
    ROHS3 Compliant
    Contains Lead
    Surface Mount
    0.5mm
    0.8mm
    -
    -
    -
    -
  • AD5542ABRUZ-REEL7
    8 Weeks
    PRODUCTION (Last Updated: 2 weeks ago)
    Tin
    Surface Mount
    16-TSSOP (0.173, 4.40mm Width)
    YES
    -
    -40°C~85°C
    Tape & Reel (TR)
    e3
    no
    Active
    1 (Unlimited)
    16
    EAR99
    Other Converters
    1.5mW
    CMOS
    DUAL
    GULL WING
    260
    1
    5V
    30
    AD5542
    16
    Voltage - Unbuffered
    5V
    Bipolar, Unipolar
    -
    SPI, Serial
    5.5V
    2.7V
    825mW
    16
    10V
    2V
    17 V/μs
    R-2R
    5.5V
    D/A CONVERTER
    Single
    External
    SPI, DSP
    No
    2 B
    -
    2.7V~5.5V
    2V
    2.7V~5.5V
    1μs (Typ)
    1 LSB
    BINARY
    1
    -
    ±0.5, ±0.5
    92 dB
    5mm
    4.4mm
    ROHS3 Compliant
    Contains Lead
    -
    0.65mm
    -
    -
    -
    -
    -
  • AD5541ABCPZ-1-RL7
    14 Weeks
    PRODUCTION (Last Updated: 1 month ago)
    Tin
    Surface Mount
    8-WFDFN Exposed Pad, CSP
    YES
    8
    -40°C~125°C
    Tape & Reel (TR)
    e3
    no
    Active
    3 (168 Hours)
    8
    EAR99
    Other Converters
    600μW
    CMOS
    DUAL
    -
    225
    1
    -
    -
    AD5541
    8
    Voltage - Unbuffered
    5V
    Unipolar
    -
    SPI, Serial
    5.5V
    2.7V
    825μW
    16
    5V
    2V
    17 V/μs
    R-2R
    5.5V
    D/A CONVERTER
    -
    External
    SPI, DSP
    No
    2 B
    1 Msps
    2.7V~5.5V
    0V
    2.7V~5.5V
    1μs
    1 LSB
    BINARY
    -
    1 Msps
    ±0.5, ±0.5
    92 dB
    3mm
    3mm
    ROHS3 Compliant
    Contains Lead
    -
    0.5mm
    -
    125μA
    0.5 LSB
    1
    No SVHC

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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