Microsemi Corporation A2F200M3F-FGG256

Name: A2F200M3F-FGG256
Brand: Microsemi Corporation
SKU: 3162320-A2F200M3F-FGG256
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: A2F200M3F-FGG256

Manufacturer:: Microsemi Corporation

Ventron No:: 3162320-A2F200M3F-FGG256

Description:: IC FPGA 256K FLASH 256FBGA

ECAD Model:

Datasheet:: A2F200M3F-FGG256

Specifications

Microsemi Corporation A2F200M3F-FGG256 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F200M3F-FGG256.

Factory Lead Time
12 Weeks
Package / Case
256-LBGA
Number of Pins
256
Supplier Device Package
256-FPBGA (17x17)
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2011
Series
SmartFusion®
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
85°C
Min Operating Temperature
0°C
Frequency
80MHz
Base Part Number
A2F200
Operating Supply Voltage
1.5V
Interface
EBI/EMI, Ethernet, I2C, SPI, UART, USART
Max Supply Voltage
1.575V
Min Supply Voltage
1.425V
Memory Size
4.5kB
Operating Supply Current
7mA
Number of I/O
MCU - 25, FPGA - 66
Speed
80MHz
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Data Rate
400 kbps
Architecture
MCU, FPGA
Number of Logic Elements/Cells
2500
Core Architecture
ARM
Number of Gates
200000
Max Frequency
100MHz
Primary Attributes
ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Number of Registers
4608
Flash Size
256KB
Radiation Hardening
No
RoHS Status
RoHS Compliant

Description

This SoC is built on ARM? Cortex?-M3 core processor(s).
Microsemi Corporation is a well-known brand in the technology industry, known for its high-quality and innovative products. One of its notable products is the Embedded - System On Chip (SoC) chip, which falls under the Embedded - System On Chip (SoC) category. This chip was first published in 2011 and has since then been an active part of the market, providing reliable and efficient solutions for various applications. With a frequency of 80MHz, this chip is capable of handling complex tasks and processes with ease. It offers a total of 91 I/O pins, with 25 dedicated to the MCU and 66 for the FPGA, making it suitable for a wide range of applications that require both microcontroller and field-programmable gate array capabilities. This chip also comes equipped with essential peripherals such as DMA, POR, and WDT, providing additional functionality and flexibility for users. With 2500 logic elements/cells and 200,000 gates, this chip offers ample resources for designing and implementing complex systems. Its maximum frequency of 100MHz allows for efficient and speedy processing, making it an ideal choice for time-sensitive applications. The primary attribute of this chip is its ProASIC®3 FPGA, which boasts 200,000 gates and 4608 D-Flip-Flops, providing a powerful and versatile platform for designing and implementing various applications. Overall, the Microsemi Corporation's Embedded - System On Chip (SoC) chip offers a comprehensive and robust solution for a wide range of embedded system applications, making it a popular choice among engineers and developers.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F200M3F-FGG256 System On Chip (SoC) applications.

Mouse
Optical drive
Cyberphysical system-on-chip
Defense
CNC control
Digital Media
Efficient hardware for inference of neural networks
Multiprocessor system-on-chips (MPSoCs)
Special Issue Editors
ARM

A2F200M3F-FGG256 More Descriptions

FPGA SmartFusion Family 200K Gates 100MHz 130nm Technology 1.5V 256-Pin FBGA
IC SOC CORTEX-M3 80MHZ 256FBGA
IC SOC CORTEX-M3 100MHZ 208QFP
French Electronic Distributor since 1988

Product Comparison

The three parts on the right have similar specifications to A2F200M3F-FGG256.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Number of Pins

Supplier Device Package

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

Max Operating Temperature

Min Operating Temperature

Frequency

Base Part Number

Operating Supply Voltage

Interface

Max Supply Voltage

Min Supply Voltage

Memory Size

Operating Supply Current

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Data Rate

Architecture

Number of Logic Elements/Cells

Core Architecture

Number of Gates

Max Frequency

Primary Attributes

Number of Registers

Flash Size

Radiation Hardening

RoHS Status

Number of Logic Blocks (LABs)

Mount

Number of Terminations

Terminal Finish

Subcategory

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Reflow Temperature-Max (s)

Number of Outputs

Qualification Status

Programmable Logic Type

Height Seated (Max)

Length

Width

Surface Mount

JESD-609 Code

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

View Compare
A2F200M3F-FGG256

Microsemi Corporation

12 Weeks

256-LBGA

256

256-FPBGA (17x17)

0°C~85°C TJ

Tray

2011

SmartFusion®

Active

3 (168 Hours)

85°C

0°C

80MHz

A2F200

1.5V

EBI/EMI, Ethernet, I2C, SPI, UART, USART

1.575V

1.425V

4.5kB

7mA

MCU - 25, FPGA - 66

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

400 kbps

MCU, FPGA

2500

ARM

200000

100MHz

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

256KB

No

RoHS Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
A2F200M3F-PQ208

Microsemi Corporation

2 Weeks

208-BFQFP

208

208-PQFP (28x28)

0°C~85°C TJ

Tray

2015

SmartFusion®

Obsolete

3 (168 Hours)

85°C

0°C

80MHz

A2F200

1.5V

EBI/EMI, Ethernet, I2C, SPI, UART, USART

1.575V

1.425V

-

-

MCU - 22, FPGA - 66

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

-

MCU, FPGA

-

ARM

-

100MHz

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

4608

256KB

No

Non-RoHS Compliant

8

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

A2F200M3F-FGG256 vs A2F200M3F-PQ208
A2F200M3F-FG256

Microsemi Corporation

12 Weeks

256-LBGA

256

-

0°C~85°C TJ

Tray

2012

SmartFusion®

Active

3 (168 Hours)

-

-

80MHz

A2F200

1.5V

EBI/EMI, Ethernet, I2C, SPI, UART, USART

1.575V

1.425V

-

2mA

MCU - 25, FPGA - 66

-

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

-

MCU, FPGA

-

ARM

200000

-

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

-

256KB

-

Non-RoHS Compliant

8

Surface Mount

256

TIN LEAD/TIN LEAD SILVER

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

225

1.5V

1mm

30

66

Not Qualified

FIELD PROGRAMMABLE GATE ARRAY

1.7mm

17mm

17mm

-

-

-

-

A2F200M3F-FGG256 vs A2F200M3F-FG256
A2F200M3F-FG484

Microsemi Corporation

12 Weeks

484-BGA

484

-

0°C~85°C TJ

Tray

-

SmartFusion®

Active

3 (168 Hours)

-

-

80MHz

A2F200

-

EBI/EMI, Ethernet, I2C, SPI, UART, USART

-

-

-

2mA

MCU - 41, FPGA - 94

-

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

-

MCU, FPGA

-

ARM

200000

-

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

-

256KB

-

Non-RoHS Compliant

8

-

484

Tin/Lead (Sn/Pb)

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

225

1.5V

1mm

30

94

Not Qualified

FIELD PROGRAMMABLE GATE ARRAY

2.44mm

23mm

23mm

YES

e0

1.575V

1.425V

A2F200M3F-FGG256 vs A2F200M3F-FG484