Microsemi Corporation A2F200M3F-1FGG484

Name: A2F200M3F-1FGG484
Brand: Microsemi Corporation
SKU: 3162359-A2F200M3F-1FGG484
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: A2F200M3F-1FGG484

Manufacturer:: Microsemi Corporation

Ventron No:: 3162359-A2F200M3F-1FGG484

Description:: IC FPGA 256K FLASH 484FBGA

ECAD Model:

Datasheet:: A2F200M3F-1FGG484

Specifications

Microsemi Corporation A2F200M3F-1FGG484 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F200M3F-1FGG484.

Factory Lead Time
8 Weeks
Package / Case
484-BGA
Number of Pins
484
Supplier Device Package
484-FPBGA (23x23)
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2013
Series
SmartFusion®
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
85°C
Min Operating Temperature
0°C
Frequency
100MHz
Base Part Number
A2F200
Operating Supply Voltage
1.5V
Interface
EBI/EMI, Ethernet, I2C, SPI, UART, USART
Max Supply Voltage
1.575V
Min Supply Voltage
1.425V
Memory Size
4.5kB
Operating Supply Current
7mA
Number of I/O
MCU - 41, FPGA - 94
Speed
100MHz
RAM Size
64KB
Core Processor
ARM® Cortex®-M3
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, Ethernet, I2C, SPI, UART/USART
Data Rate
400 kbps
Architecture
MCU, FPGA
Number of Logic Elements/Cells
2500
Core Architecture
ARM
Number of Gates
200000
Max Frequency
120MHz
Primary Attributes
ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Flash Size
256KB
RoHS Status
RoHS Compliant
Lead Free
Lead Free

Description

This SoC is built on ARM? Cortex?-M3 core processor(s).
The Supplier Device Package for this particular product is a 484-FPBGA (23x23) and was published in 2013. It is currently an active part, meaning it is still in production and readily available. The Moisture Sensitivity Level (MSL) for this device is 3, which indicates that it can withstand up to 168 hours of exposure to moisture without being damaged. The frequency for this device is 100MHz and the maximum supply voltage is 1.575V. It also has a RAM size of 64KB and a data rate of 400 kbps. This device features an architecture of both MCU and FPGA, making it a versatile option for various applications. Its primary attributes include a ProASIC®3 FPGA with 200K gates and 4608 D-Flip-Flops, providing a powerful and efficient performance.

ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F200M3F-1FGG484 System On Chip (SoC) applications.

Industrial
ARM
Automotive
Test and Measurement
Transmitters
Efficient hardware for training of neural networks
Industrial automation devices
Robotics
Keywords
Servo drive control module

A2F200M3F-1FGG484 More Descriptions

FPGA SmartFusion 200K Gates 2000 Cells 100MHz 130nm (CMOS) Technology 1.5V 484-Pin FBGA
IC SOC CORTEX-M3 100MHZ 484FBGA
IC FPGA 256K FLASH 484FBGA
OEMs, CMs ONLY (NO BROKERS)
new, original packaged
Contact for details

Product Comparison

The three parts on the right have similar specifications to A2F200M3F-1FGG484.

Image

Part Number

Manufacturer

Factory Lead Time

Package / Case

Number of Pins

Supplier Device Package

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

Max Operating Temperature

Min Operating Temperature

Frequency

Base Part Number

Operating Supply Voltage

Interface

Max Supply Voltage

Min Supply Voltage

Memory Size

Operating Supply Current

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Data Rate

Architecture

Number of Logic Elements/Cells

Core Architecture

Number of Gates

Max Frequency

Primary Attributes

Flash Size

RoHS Status

Lead Free

Surface Mount

JESD-609 Code

Number of Terminations

Terminal Finish

Subcategory

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Reflow Temperature-Max (s)

Number of Outputs

Qualification Status

Programmable Logic Type

Number of Logic Blocks (LABs)

Height Seated (Max)

Length

Width

Supply Voltage-Max (Vsup)

Supply Voltage-Min (Vsup)

Radiation Hardening

View Compare
A2F200M3F-1FGG484

Microsemi Corporation

8 Weeks

484-BGA

484

484-FPBGA (23x23)

0°C~85°C TJ

Tray

2013

SmartFusion®

Active

3 (168 Hours)

85°C

0°C

100MHz

A2F200

1.5V

EBI/EMI, Ethernet, I2C, SPI, UART, USART

1.575V

1.425V

4.5kB

7mA

MCU - 41, FPGA - 94

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

400 kbps

MCU, FPGA

2500

ARM

200000

120MHz

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

RoHS Compliant

Lead Free

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-
A2F200M3F-1FGG484I

Microsemi Corporation

12 Weeks

484-BGA

484

-

-40°C~100°C TJ

Tray

2015

SmartFusion®

Active

3 (168 Hours)

-

-

100MHz

A2F200

1.5V

EBI/EMI, Ethernet, I2C, SPI, UART, USART

1.575V

1.425V

-

1mA

MCU - 41, FPGA - 94

-

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

-

MCU, FPGA

-

ARM

200000

-

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

RoHS Compliant

-

YES

e1

484

Tin/Silver/Copper (Sn/Ag/Cu)

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

250

1.5V

1mm

30

94

Not Qualified

FIELD PROGRAMMABLE GATE ARRAY

8

2.44mm

23mm

23mm

-

-

-

A2F200M3F-1FGG484 vs A2F200M3F-1FGG484I
A2F200M3F-1FG256

Microsemi Corporation

12 Weeks

256-LBGA

256

-

0°C~85°C TJ

Tray

2009

SmartFusion®

Active

3 (168 Hours)

-

-

100MHz

A2F200

-

EBI/EMI, Ethernet, I2C, SPI, UART, USART

-

-

-

3mA

MCU - 25, FPGA - 66

-

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

-

MCU, FPGA

-

ARM

200000

-

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

Non-RoHS Compliant

-

YES

-

256

TIN LEAD/TIN LEAD SILVER

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

225

1.5V

1mm

30

66

-

FIELD PROGRAMMABLE GATE ARRAY

8

1.7mm

17mm

17mm

1.575V

1.425V

No

A2F200M3F-1FGG484 vs A2F200M3F-1FG256
A2F200M3F-1FG256I

Microsemi Corporation

12 Weeks

256-LBGA

256

-

-40°C~100°C TJ

Tray

2009

SmartFusion®

Active

3 (168 Hours)

-

-

100MHz

A2F200

-

EBI/EMI, Ethernet, I2C, SPI, UART, USART

-

-

-

3mA

MCU - 25, FPGA - 66

-

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, SPI, UART/USART

-

MCU, FPGA

-

ARM

200000

-

ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops

256KB

Non-RoHS Compliant

-

YES

e0

256

Tin/Lead (Sn/Pb)

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

225

1.5V

1mm

20

66

-

FIELD PROGRAMMABLE GATE ARRAY

8

1.7mm

17mm

17mm

1.575V

1.425V

No

A2F200M3F-1FGG484 vs A2F200M3F-1FG256I