Microsemi Corporation A2F060M3E-1CSG288I

Name: A2F060M3E-1CSG288I
Brand: Microsemi Corporation
SKU: 3162373-A2F060M3E-1CSG288I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: A2F060M3E-1CSG288I

Manufacturer:: Microsemi Corporation

Ventron No:: 3162373-A2F060M3E-1CSG288I

Description:: IC FPGA 60K GATES 128KB 288-CSP

ECAD Model:

Datasheet:: SmartFusion cSoC Datasheet

Specifications

Microsemi Corporation A2F060M3E-1CSG288I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation A2F060M3E-1CSG288I.

Package / Case
288-TFBGA, CSPBGA
Number of Pins
288
Supplier Device Package
288-CSP (11x11)
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Published
2015
Series
SmartFusion®
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Max Operating Temperature
100°C
Min Operating Temperature
-40°C
Frequency
100MHz
Base Part Number
A2F060M3E
Operating Supply Voltage
1.5V
Interface
EBI/EMI, I2C, SPI, UART, USART
Number of I/O
MCU - 28, FPGA - 68
Speed
100MHz
RAM Size
16KB
Core Processor
ARM® Cortex®-M3
Peripherals
DMA, POR, WDT
Connectivity
EBI/EMI, I2C, SPI, UART/USART
Architecture
MCU, FPGA
Core Architecture
ARM
Max Frequency
100MHz
Number of Logic Blocks (LABs)
8
Speed Grade
1
Primary Attributes
ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Number of Registers
1536
Flash Size
128KB
Radiation Hardening
No
RoHS Status
RoHS Compliant

Description

This SoC is built on ARM? Cortex?-M3 core processor(s).
This product has 288 pins and can operate in a temperature range of -40°C to 100°C. It is packaged in a tray and has a maximum operating temperature of 100°C. The frequency of this product is 100MHz and its base part number is A2F060M3E. It has multiple interfaces including EBI/EMI, I2C, SPI, UART, and USART. The number of I/O for this product is 28 for MCU and 68 for FPGA. It has a speed grade of 1 and a flash size of 128KB.

ARM? Cortex?-M3 processor.
16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation
A2F060M3E-1CSG288I System On Chip (SoC) applications.

Remote control
Medical
Smartphone accessories
Networked sensors
Defense
Three phase UPS
ARM processors
Communication interfaces ( I2C, SPI )
Keywords
Measurement testers

A2F060M3E-1CSG288I More Descriptions

ACTEL'S SMARTFUSION INTELLIGENT MIXED-SIGNAL FPGAS
IC FPGA 60K GATES 128KB 288-CSP
IC SOC CORTEX-M3 100MHZ 288CSP

Product Comparison

The three parts on the right have similar specifications to A2F060M3E-1CSG288I.

Image

Part Number

Manufacturer

Package / Case

Number of Pins

Supplier Device Package

Operating Temperature

Packaging

Published

Series

Part Status

Moisture Sensitivity Level (MSL)

Max Operating Temperature

Min Operating Temperature

Frequency

Base Part Number

Operating Supply Voltage

Interface

Number of I/O

Speed

RAM Size

Core Processor

Peripherals

Connectivity

Architecture

Core Architecture

Max Frequency

Number of Logic Blocks (LABs)

Speed Grade

Primary Attributes

Number of Registers

Flash Size

Radiation Hardening

RoHS Status

Weight

Max Supply Voltage

Min Supply Voltage

Height

Length

Width

HTS Code

Reach Compliance Code

View Compare
A2F060M3E-1CSG288I

Microsemi Corporation

288-TFBGA, CSPBGA

288

288-CSP (11x11)

-40°C~100°C TJ

Tray

2015

SmartFusion®

Obsolete

3 (168 Hours)

100°C

-40°C

100MHz

A2F060M3E

1.5V

EBI/EMI, I2C, SPI, UART, USART

MCU - 28, FPGA - 68

100MHz

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

MCU, FPGA

ARM

100MHz

8

1

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

1536

128KB

No

RoHS Compliant

-

-

-

-

-

-

-

-

-
A2F060M3E-1TQG144

Microsemi Corporation

144-LQFP

144

144-TQFP (20x20)

0°C~85°C TJ

Tray

2015

SmartFusion®

Obsolete

3 (168 Hours)

85°C

0°C

100MHz

A2F060M3E

1.5V

EBI/EMI, I2C, SPI, UART, USART

MCU - 21, FPGA - 33

100MHz

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

MCU, FPGA

ARM

-

-

1

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

1536

128KB

No

RoHS Compliant

1.319103g

1.575V

1.425V

1.4mm

20mm

20mm

-

-

A2F060M3E-1CSG288I vs A2F060M3E-1TQG144
A2F060M3E-1FGG256M

Microsemi Corporation

256-LBGA

256

256-FPBGA (17x17)

-55°C~125°C TJ

Tray

-

SmartFusion®

Obsolete

3 (168 Hours)

125°C

-55°C

100MHz

A2F060M3E

-

EBI/EMI, I2C, SPI, UART, USART

MCU - 26, FPGA - 66

100MHz

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

MCU, FPGA

ARM

-

-

-

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

-

128KB

-

RoHS Compliant

-

-

-

-

-

-

-

-

A2F060M3E-1CSG288I vs A2F060M3E-1FGG256M
A2F060M3E-1FG256M

Microsemi Corporation

256-LBGA

256

-

-55°C~125°C TJ

Tray

-

SmartFusion®

Obsolete

3 (168 Hours)

-

-

100MHz

A2F060M3E

-

EBI/EMI, I2C, SPI, UART, USART

MCU - 26, FPGA - 66

-

16KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, I2C, SPI, UART/USART

MCU, FPGA

ARM

-

-

-

ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

-

128KB

-

Non-RoHS Compliant

-

-

-

-

-

-

8542.39.00.01

unknown

A2F060M3E-1CSG288I vs A2F060M3E-1FG256M