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Microchip Technology 93LC66AT-E/ST

Part Number:

93LC66AT-E/ST

Manufacturer:

Microchip Technology

Ventron No:

3719075-93LC66AT-E/ST

Description:

IC EEPROM 4KBIT 2MHZ 8TSSOP

Datasheet:

93LC66AT-E/ST

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Delivery:

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Part Overview

Description
The Microchip Technology Inc. 93XX66A/B/C devices are 4Kbit low-voltage serial Electrically Erasable PROMS (EEPROM). Word-selectable devices such as the 93AA66C, 93LC66C or 93C66C are dependent upon external logic levels driving the ORG pin to set word size. For dedicated 8-bit communication, the 93XX66A devices are available, while the 93XX668 devices provide dedicated 16-bit communication.
Advanced CMOS technology makes these devices ideal for low-power, nonvolatile memory applications. The entire 93XX Series is available in standard packages including 8-lead PDIP and SOIC, and advanced packaging including 8-lead MSOP, 6-lead SOT-23, 8-lead 2x3 DFN/TDFN and 8-lead TSSOP. All packages are Pb-free (Matte Tin) finish.

Features
Low-Power CMOS Technology
ORG Pin to Select Word Size for '66C' Version
512 x 8-bit Organization 'A' Devices (no ORG)
256 x 16-bit organization B' Devices (no ORG)
Self-timed Erase/Write Cycles (including Auto-Erase)
Automatic Erase All (ERAL) Before Write All (WRAL)
Power-On/Off Data Protection Circuitry
Industry Standard 3-Wire Serial I/O
Device Status Signal (Ready/Busy)
Sequential Read Function
1,000,000 Erase/Write Cycles
Data Retention > 200 Years
Pb-free and RoHS Compliant
Temperature Ranges Supported:
Industrial (1) -40°C to 85°C
Automotive (E) -40°C to 125°C

Applications
Nonvolatile memory applications
Low-power applications
Industrial applications
Automotive applications

Specifications

Microchip Technology 93LC66AT-E/ST technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology 93LC66AT-E/ST.

  • Factory Lead Time
    6 Weeks
  • Contact Plating
    Tin
  • Mount
    Surface Mount
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    8-TSSOP (0.173, 4.40mm Width)
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    8
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~125°C TA
  • Packaging
    Tape & Reel (TR)
  • Published
    2005
  • JESD-609 Code
    e3
  • Pbfree Code
    yes
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Number of Terminations
    8
  • ECCN Code
    EAR99
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    CMOS
  • Voltage - Supply
    2.5V~5.5V
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    3V
  • Terminal Pitch
    0.65mm
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    93LC66A
  • Pin Count
    8
  • Supply Voltage-Max (Vsup)
    5.5V
  • Power Supplies
    3/5V
  • Supply Voltage-Min (Vsup)
    2.5V
  • Interface

    In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

    Serial
  • Memory Size
    4Kb 512 x 8
  • Nominal Supply Current
    2mA
  • Memory Type

    Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.

    Non-Volatile
  • Clock Frequency

    Clock Frequency, measured in Hertz (Hz), is the rate at which an electronic component, such as a microprocessor or oscillator, generates electrical pulses. It determines the speed at which the component can process data and execute instructions. A higher clock frequency generally indicates faster performance, but also higher power consumption and heat generation. Clock Frequency is a crucial parameter for timing-sensitive applications, such as digital signal processing and real-time systems.

    2MHz
  • Access Time

    Access time is the time it takes for a memory device to retrieve data from a specific location. It is typically measured in nanoseconds (ns) and is a critical factor in determining the performance of a computer system. The lower the access time, the faster the memory device can retrieve data and the faster the computer can perform tasks.

    250 ns
  • Memory Format

    Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.

    EEPROM
  • Memory Interface
    SPI
  • Memory Width
    8
  • Write Cycle Time - Word, Page
    6ms
  • Density
    4 kb
  • Standby Current-Max
    0.000005A
  • Serial Bus Type
    MICROWIRE
  • Endurance
    1000000 Write/Erase Cycles
  • Write Cycle Time-Max (tWC)
    6ms
  • Data Retention Time-Min
    200
  • Write Protection
    SOFTWARE
  • Height Seated (Max)
    1.2mm
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    4.4mm
  • Width
    3mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free

Product Comparison

The three parts on the right have similar specifications to 93LC66AT-E/ST.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Contact Plating
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Operating Temperature
    Packaging
    Published
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Base Part Number
    Pin Count
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Interface
    Memory Size
    Nominal Supply Current
    Memory Type
    Clock Frequency
    Access Time
    Memory Format
    Memory Interface
    Memory Width
    Write Cycle Time - Word, Page
    Density
    Standby Current-Max
    Serial Bus Type
    Endurance
    Write Cycle Time-Max (tWC)
    Data Retention Time-Min
    Write Protection
    Height Seated (Max)
    Length
    Width
    Radiation Hardening
    RoHS Status
    Lead Free
    Supplier Device Package
    Surface Mount
    Series
    Reach Compliance Code
    JESD-30 Code
    Operating Mode
    Organization
    Memory Density
    Parallel/Serial
    Alternate Memory Width
    View Compare
  • 93LC66AT-E/ST
    93LC66AT-E/ST
    6 Weeks
    Tin
    Surface Mount
    Surface Mount
    8-TSSOP (0.173, 4.40mm Width)
    8
    -40°C~125°C TA
    Tape & Reel (TR)
    2005
    e3
    yes
    Active
    1 (Unlimited)
    8
    EAR99
    CMOS
    2.5V~5.5V
    DUAL
    260
    1
    3V
    0.65mm
    40
    93LC66A
    8
    5.5V
    3/5V
    2.5V
    Serial
    4Kb 512 x 8
    2mA
    Non-Volatile
    2MHz
    250 ns
    EEPROM
    SPI
    8
    6ms
    4 kb
    0.000005A
    MICROWIRE
    1000000 Write/Erase Cycles
    6ms
    200
    SOFTWARE
    1.2mm
    4.4mm
    3mm
    No
    ROHS3 Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • 93LC46C/S15K
    -
    -
    -
    Surface Mount
    Die
    -
    0°C~70°C TA
    Tray
    -
    -
    -
    Active
    1 (Unlimited)
    -
    -
    EEPROM
    2.5V~5.5V
    -
    -
    -
    -
    -
    -
    93LC46C
    -
    -
    -
    -
    -
    1Kb 128 x 8 64 x 16
    -
    Non-Volatile
    3MHz
    -
    EEPROM
    SPI
    -
    6ms
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    -
    Die
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • 93LC66BT-I/OT15KVAO
    -
    -
    -
    Surface Mount
    SOT-23-6
    -
    -40°C~85°C TA
    Tape & Reel (TR)
    -
    -
    -
    Active
    1 (Unlimited)
    5
    -
    CMOS
    2.5V~5.5V
    DUAL
    -
    1
    5V
    0.95mm
    -
    93LC66B
    -
    5.5V
    -
    2.5V
    -
    4Kb 256 x 16
    -
    Non-Volatile
    2MHz
    -
    EEPROM
    SPI
    16
    6ms
    -
    -
    MICROWIRE
    -
    6ms
    -
    -
    1.45mm
    2.9mm
    1.55mm
    -
    -
    -
    -
    YES
    Automotive, AEC-Q100
    compliant
    R-PDSO-G5
    SYNCHRONOUS
    256X16
    4096 bit
    SERIAL
    -
  • 93LC66CT-E/SN15KVAO
    -
    -
    -
    Surface Mount
    8-SOIC (0.154, 3.90mm Width)
    -
    -40°C~125°C TA
    Tape & Reel (TR)
    -
    -
    -
    Active
    3 (168 Hours)
    8
    -
    CMOS
    2.5V~5.5V
    DUAL
    -
    1
    5V
    1.27mm
    -
    93LC66C
    -
    5.5V
    -
    4.5V
    -
    4Kb 512 x 8 256 x 16
    -
    Non-Volatile
    2MHz
    -
    EEPROM
    SPI
    16
    6ms
    -
    -
    MICROWIRE
    -
    6ms
    -
    -
    1.75mm
    4.9mm
    3.9mm
    -
    Non-RoHS Compliant
    -
    -
    YES
    Automotive, AEC-Q100
    -
    R-PDSO-G8
    SYNCHRONOUS
    256X16
    4096 bit
    SERIAL
    8

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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