IDT, Integrated Device Technology Inc 89HAL808G2ZBHLGI

89HAL808G2ZBHLGI Overview
The BGA package, first introduced in 1996, has become a popular choice for many electronic devices due to its compact size and high performance capabilities. This package, also known as Ball Grid Array, has undergone several advancements over the years, making it a preferred option for various applications. One of the significant developments in the BGA package is its RoHS compliance. RoHS, which stands for Restriction of Hazardous Substances, is a regulation that restricts the use of certain hazardous materials in electronic products. With the BGA package being RoHS compliant, it ensures that the materials used are environmentally friendly and safe for both consumers and the environment. This further adds to the appeal and reliability of the BGA package, making it a top choice for electronic manufacturers.

89HAL808G2ZBHLGI Features

89HAL808G2ZBHLGI Applications
There are a lot of Integrated Device Technology (IDT) 89HAL808G2ZBHLGI Specialized Interface ICs applications.

DSLAMs
Public switching systems and PBX interfaces
Medical systems
Battery-powered systems
SONET/SDH and PDH Multiplexers
Video signal routing
Mechanical reed relay replacement
Automatic test equipment
Switching Systems
Low-Voltage