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IDT, Integrated Device Technology Inc 74LVC16373APVG8

Part Number:

74LVC16373APVG8

Manufacturer:

IDT, Integrated Device Technology Inc

Ventron No:

3222079-74LVC16373APVG8

Description:

IC TRANSP LATCH 16BIT D 48-SSOP

Datasheet:

74LVC16373APVG8

Quantity:

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Total Price: $0.88

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Unit Price

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  • 1

    $0.8795

    $0.88

  • 200

    $0.3410

    $68.20

  • 500

    $0.3287

    $164.35

  • 1000

    $0.3225

    $322.50

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Part Overview

Description
The IDT74LVC16373A is a 16-bit transparent D-type latch built using advanced dual metal CMOS technology. It is designed for temporary storage of data and can be used in applications such as memory address latches, I/O ports, and bus drivers. The device features flow-through organization of signal pins for simplified layout and all inputs are designed with hysteresis for improved noise margin.

Features
Typical output skew (tsk(o)) < 250ps
3.3V CMOS 16-bit transparent D-type latch with 3-state outputs and 5V tolerant I/O
ESD > 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C=200pF, R = 0)
Vcc 3.3V ± 0.3V, Normal Range; Vcc 2.7V to 3.6V, Extended Range
CMOS power levels (0.4μW typ. static)
All inputs, outputs, and I/O are 5V tolerant
Supports hot insertion
Available in SSOP and TSSOP packages
High Output Drivers: ±24mA
Reduced system switching noise

Applications
5V and 3.3V mixed voltage systems
Data communication and telecommunication systems

Specifications

IDT, Integrated Device Technology Inc 74LVC16373APVG8 technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc 74LVC16373APVG8.

  • Factory Lead Time
    7 Weeks
  • Contact Plating
    Tin
  • Mount
    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    SSOP
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    48
  • Published
    2006
  • JESD-609 Code
    e3
  • Pbfree Code
    yes
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1
  • Number of Terminations
    48
  • ECCN Code
    EAR99
  • Max Operating Temperature
    85°C
  • Min Operating Temperature
    -40°C
  • Subcategory
    FF/Latches
  • Packing Method
    TAPE AND REEL
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    CMOS
  • Terminal Position
    DUAL
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    2
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    3.3V
  • Terminal Pitch
    0.635mm
  • Reflow Temperature-Max (s)
    30
  • Pin Count
    48
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    3.3V
  • Polarity

    Polarity refers to the direction of current flow through an electronic component. It is typically indicated by a plus (+) or minus (-) sign on the component's body. Components with polarity must be connected correctly in a circuit to function properly. For example, a diode will only allow current to flow in one direction, from the positive terminal to the negative terminal. If a diode is connected backwards, it will not conduct current.

    Non-Inverting
  • Temperature Grade
    INDUSTRIAL
  • Max Supply Voltage
    3.6V
  • Min Supply Voltage
    2.7V
  • Load Capacitance

    Load Capacitance (CL) is a parameter that specifies the maximum capacitance that can be connected to the output of an electronic component without affecting its performance. It is typically measured in picofarads (pF) or nanofarads (nF). A high load capacitance can cause the output voltage to drop or the output current to increase, which can lead to instability or damage to the component.

    50pF
  • Number of Ports

    Number of Ports refers to the number of electrical connections or terminals available on an electronic component. It indicates the number of external devices or signals that can be connected to the component. For example, a transistor may have three ports (emitter, base, and collector), while a resistor has two ports (terminals). The number of ports determines the functionality and connectivity options of the component within a circuit.

    2
  • Number of Bits
    16
  • Propagation Delay
    6.3 ns
  • Turn On Delay Time
    2.1 ns
  • Family
    LVC/LCX/Z
  • Logic Function
    D-Type, Latch
  • Output Characteristics
    3-STATE
  • Logic IC Type
    BUS DRIVER
  • High Level Output Current
    24mA
  • Low Level Output Current
    24mA
  • Independent Circuits
    2
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    15.9mm
  • Width
    7.5mm
  • Thickness

    Thickness, in the context of electronic components, refers to the vertical distance between two opposing surfaces of a component. It is typically measured in millimeters (mm) or inches (in). Thickness is a crucial parameter that affects the component's physical dimensions, weight, and performance characteristics. It influences factors such as heat dissipation, electrical insulation, and mechanical stability. Thinner components generally offer better heat dissipation and space efficiency, while thicker components may provide enhanced durability and structural integrity.

    2.3mm
  • RoHS Status
    RoHS Compliant
  • Lead Free
    Lead Free

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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