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74HCT4538N,112

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NXP USA Inc. 74HCT4538N,112

Part Number:

74HCT4538N,112

Manufacturer:

NXP USA Inc.

Ventron No:

3219163-74HCT4538N,112

Description:

IC DUAL RETRIG MULTIVIB 16DIP

ECAD Model:

Datasheet:

74HC(T)4538

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Part Overview

Description
The 74HC4538 is a dual retriggerable-resettable monostable multivibrator. Each multivibrator has two trigger/retrigger inputs (nÄ and nB), a direct reset input (nCD), two complementary outputs (nQ and nQ), and two pins (nREXT/CEXT and CEXT) for connecting the external timing components CEXT and REXT. Typical pulse width variation over temperature range is ± 0.2 %. The device may be triggered by either the positive or the negative edges of the input pulse. The duration and accuracy of the output pulse are determined by the external timing components CEXT and REXT. The output pulse width (Tw) is equal to 0.7 x REXT CEXT. The linear design techniques guarantee precise control of the output pulse width. A LOW level at nCD terminates the output pulse immediately. Schmitt-trigger action in the trigger inputs makes the circuit highly tolerant to slower rise and fall times. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of Vcc-2.

Features
Wide supply voltage range from 2.0 to 6.0 V
CMOS low power dissipation
CMOS input levels
High noise immunity
Tolerant of slow trigger rise and fall times
Separate reset inputs
Triggering from falling or rising edge
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
Complies with JEDEC standards
JESDBC (2.7 V to 3.6 V)
JESD7A (2.0 V to 6.0 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Specified from -40 °C to 85 °C and from -40 °C to 125°C

Applications
Precision timing circuits
Pulse generation
Monostable multivibrators
Retriggerable one-shots
Resettable timers

Specifications

NXP USA Inc. 74HCT4538N,112 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. 74HCT4538N,112.

  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Through Hole
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    16-DIP (0.300, 7.62mm)
  • Surface Mount
    NO
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~125°C
  • Packaging
    Tube
  • Published
    1997
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    74HCT
  • JESD-609 Code
    e4
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Number of Terminations
    16
  • Terminal Finish
    Nickel/Palladium/Gold (Ni/Pd/Au)
  • Additional Feature
    RETRIGGERABLE
  • Subcategory
    Prescaler/Multivibrators
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    CMOS
  • Voltage - Supply
    4.5V~5.5V
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    2
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    5V
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    74HCT4538
  • Pin Count
    16
  • JESD-30 Code
    R-PDIP-T16
  • Supply Voltage-Max (Vsup)
    5.5V
  • Power Supplies
    5V
  • Supply Voltage-Min (Vsup)
    4.5V
  • Load Capacitance

    Load Capacitance (CL) is a parameter that specifies the maximum capacitance that can be connected to the output of an electronic component without affecting its performance. It is typically measured in picofarads (pF) or nanofarads (nF). A high load capacitance can cause the output voltage to drop or the output current to increase, which can lead to instability or damage to the component.

    50pF
  • Propagation Delay
    35ns
  • Family
    HCT
  • Current - Output High, Low
    4mA 4mA
  • Logic Type

    Logic Type refers to the type of logic implemented by an electronic component, such as a logic gate or flip-flop.

    Monostable
  • Output Polarity
    COMPLEMENTARY
  • Independent Circuits
    2
  • Schmitt Trigger Input
    No
  • Number of Data/Clock Inputs
    2
  • Height Seated (Max)
    4.7mm
  • RoHS Status
    ROHS3 Compliant

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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