74FCT163244APAG
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IDT, Integrated Device Technology Inc 74FCT163244APAG

Part Number:
74FCT163244APAG
Manufacturer:
IDT, Integrated Device Technology Inc
Ventron No:
3200457-74FCT163244APAG
Description:
IC BUFF DVR 16BIT N-INV 48TSSOP
ECAD Model:
Datasheet:
74FCT163244APAG
Payment:
Payment
Delivery:
Delivery

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Reference Price ( In US Dollars )

Pricing

Qty

Unit Price

Ext Price

  • 1

    $1.8970

    $1.90

  • 200

    $0.7347

    $146.94

  • 500

    $0.7085

    $354.25

  • 1000

    $0.6962

    $696.20

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Part Overview
Description
The IDT74FCT163244A/C is a 16-bit buffer/line driver built using advanced dual-metal CMOS technology. It offers high speed, low power, and bus/backplane interface capability with improved packing density. The flow-through organization simplifies board layout, and the three-state controls allow operation in Quad-Nibble, Dual-Byte, or single 16-bit word mode. All inputs are designed with hysteresis for improved noise margin.

Features
0.5-micron CMOS technology
Typical output skew < 250ps
ESD protection: 2000V per MIL-STD-883, Method 3015; > 200V using machine model (C=200pF, R=0)
Vcc = 3.3V ± 0.3V (Normal Range) or 2.7V to 3.6V (Extended Range)
CMOS power levels (0.4μW typ. static)
Rail-to-rail output swing for increased noise margin
Low ground bounce (0.3V typ.)
Inputs (except I/O) can be driven by 3.3V or 5V components
Available in SSOP, TSSOP, and TVSOP packages

Applications
Bus/backplane interface
Buffering
Line driving
Mixed 3.3V/5V supply systems
Specifications
IDT, Integrated Device Technology Inc 74FCT163244APAG technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc 74FCT163244APAG.
  • Factory Lead Time
    12 Weeks
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    48-TFSOP (0.240, 6.10mm Width)
  • Supplier Device Package
    48-TSSOP
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C TA
  • Packaging
    Tube
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    74FCT
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Voltage - Supply
    2.7V~3.6V
  • Base Part Number
    74FCT163244
  • Output Type

    Output type refers to the type of signal or power that an electronic component can produce. It can be analog or digital, AC or DC, and can vary in voltage, current, or power levels. The output type is determined by the component's design and is crucial for matching it with other components in a circuit. Understanding the output type ensures proper signal processing, power delivery, and overall system functionality.

    3-State
  • Number of Elements
    4
  • Current - Output High, Low
    8mA 24mA
  • Logic Type

    Logic Type refers to the type of logic implemented by an electronic component, such as a logic gate or flip-flop.

    Buffer, Non-Inverting
  • Number of Bits per Element

    Number of Bits Per Element (NBE) specifies the number of bits used to represent each element in a digital signal. It determines the resolution and precision of the signal. A higher NBE results in a more accurate representation of the signal, but also increases the data size and processing requirements. NBE is commonly used in digital-to-analog converters (DACs), analog-to-digital converters (ADCs), and other digital signal processing systems.

    4
  • RoHS Status
    ROHS3 Compliant
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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