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74ABT573AD,118

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NXP USA Inc. 74ABT573AD,118

Part Number:

74ABT573AD,118

Manufacturer:

NXP USA Inc.

Ventron No:

3219184-74ABT573AD,118

Description:

IC OCTAL D TRANSP LATCH 20-SOIC

ECAD Model:

Datasheet:

74ABT573A

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Part Overview

Description
The 74ABT573A is an octal transparent latch coupled to eight 3-State output buffers. The two sections of the device are controlled independently by Enable (E) and Output Enable (OE) control gates. The 74ABT573A is functionally identical to the 74ABT373 but has a flow-through pinout configuration to facilitate PC board layout and allow easy interface with microprocessors.
The data on the D inputs are transferred to the latch outputs when the Latch Enable (E) input is High. The latch remains transparent to the data inputs while E is High, and stores the data that is present one setup time before the High-to-Low enable transition.
The 3-State output buffers are designed to drive heavily loaded 3-State buses, MOS memories, or MOS microprocessors. The active-Low Output Enable (OE) controls all eight 3-State buffers independent of the latch operation. When OE is Low, the latched or transparent data appears at the outputs. When OE is High, the outputs are in the High-impedance "OFF" state, which means they will neither drive nor load the bus.

Features
74ABT573A is flow-through pinout version of 74ABT373
Inputs and outputs on opposite side of package allow easy interface to microprocessors
3-State output buffers
Common output enable
Latch-up protection exceeds 500mA per JEDEC Std 17
ESD protection exceeds 2000 V per MIL STD 883 Method 3015 and 200 V per Machine Model
Power-up 3-State
Power-up reset

Applications
Bus interface
Data storage
Register file
Microprocessor interface

Specifications

NXP USA Inc. 74ABT573AD,118 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. 74ABT573AD,118.

  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    20-SOIC (0.295, 7.50mm Width)
  • Supplier Device Package
    20-SO
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C
  • Packaging
    Tape & Reel (TR)
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    74ABT
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Voltage - Supply
    4.5V~5.5V
  • Output Type

    Output type refers to the type of signal or power that an electronic component can produce. It can be analog or digital, AC or DC, and can vary in voltage, current, or power levels. The output type is determined by the component's design and is crucial for matching it with other components in a circuit. Understanding the output type ensures proper signal processing, power delivery, and overall system functionality.

    Tri-State
  • Circuit

    Circuit is a term used in electronics to describe a complete path for electrical current to flow. It consists of a source of electrical energy, such as a battery or power supply, a load, such as a resistor or motor, and a conducting path, such as wires or traces on a printed circuit board. The circuit provides a closed loop for the current to flow, allowing the electrical energy to be transferred from the source to the load.

    8:8
  • Current - Output High, Low
    32mA 64mA
  • Logic Type

    Logic Type refers to the type of logic implemented by an electronic component, such as a logic gate or flip-flop.

    D-Type Transparent Latch
  • Independent Circuits
    1
  • Delay Time - Propagation
    3.3ns
  • RoHS Status
    ROHS3 Compliant

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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