72T72115L5BB

IDT, Integrated Device Technology Inc 72T72115L5BB

Part Number:
72T72115L5BB
Manufacturer:
IDT, Integrated Device Technology Inc
Ventron No:
3206854-72T72115L5BB
Description:
IC FIFO 131072X72 5NS 324-BGA
ECAD Model:
Datasheet:
72T72115L5BB

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Specifications
IDT, Integrated Device Technology Inc 72T72115L5BB technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc 72T72115L5BB.
  • Factory Lead Time
    7 Weeks
  • Contact Plating
    Lead, Tin
  • Mount
    Surface Mount
  • Package / Case
    BGA
  • Number of Pins
    324
  • Published
    2009
  • JESD-609 Code
    e0
  • Pbfree Code
    no
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3
  • Number of Terminations
    324
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Lead (Sn63Pb37)
  • Max Operating Temperature
    70°C
  • Min Operating Temperature
    0°C
  • HTS Code
    8542.32.00.71
  • Subcategory
    FIFOs
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    225
  • Number of Functions
    1
  • Supply Voltage
    2.5V
  • Terminal Pitch
    1mm
  • Frequency
    200MHz
  • Reflow Temperature-Max (s)
    20
  • Pin Count
    324
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    2.5V
  • Temperature Grade
    COMMERCIAL
  • Max Supply Voltage
    2.625V
  • Min Supply Voltage
    2.375V
  • Element Configuration
    Dual
  • Nominal Supply Current
    130mA
  • Max Supply Current
    130mA
  • Frequency (Max)
    200MHz
  • Access Time
    3.6 ns
  • Organization
    128KX72
  • Density
    9 Mb
  • Standby Current-Max
    0.05A
  • Parallel/Serial
    PARALLEL
  • Sync/Async
    Synchronous
  • Word Size
    72b
  • Memory IC Type
    OTHER FIFO
  • Bus Directional
    Unidirectional
  • Retransmit Capability
    Yes
  • Output Enable
    YES
  • Cycle Time
    5 ns
  • Height Seated (Max)
    1.97mm
  • Length
    19mm
  • Width
    19mm
  • Thickness
    1.76mm
  • RoHS Status
    RoHS Compliant
  • Lead Free
    Contains Lead
Description
72T72115L5BB Overview
The manufacturer of this component is IDT, also known as Integrated Device Technology Inc. It is a type of Logic - FIFOs Memory chip, which falls under the category of Logic - FIFOs Memory. The contact plating used on this chip is Lead and Tin, and it is also Pbfree (meaning it does not contain lead). There are a total of 324 terminations on this chip. The minimum operating temperature for this chip is 0°C, and the peak reflow temperature is 225°C. This chip has one function and is configured as a Dual element. The maximum standby current is 0.05A. This chip can operate synchronously or asynchronously, and has a word size of 72 bits.

72T72115L5BB Features
FIFOs category
Frequency at most

72T72115L5BB Applications
There are a lot of Integrated Device Technology (IDT) 72T72115L5BB FIFOs Memory applications.

Communications
High-speed disk
Code converters
Product traceability
Consumer Systems
Multimedia
IP Radio
Industrial Systems
Battery Charger
A/D output buffers
72T72115L5BB More Descriptions
128Kx72 130mA 2.375V~2.625V PBGA-324(19x19) FIFO Memory ROHS
IC FIFO ASYNC/SYN 128KX72 324BGA
IC FIFO 131072X72 5NS 324-BGA
128K x 72 TeraSync FIFO, 2.5V
Product Comparison
The three parts on the right have similar specifications to 72T72115L5BB.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Contact Plating
    Mount
    Package / Case
    Number of Pins
    Published
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    Max Operating Temperature
    Min Operating Temperature
    HTS Code
    Subcategory
    Technology
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Frequency
    Reflow Temperature-Max (s)
    Pin Count
    Qualification Status
    Operating Supply Voltage
    Temperature Grade
    Max Supply Voltage
    Min Supply Voltage
    Element Configuration
    Nominal Supply Current
    Max Supply Current
    Frequency (Max)
    Access Time
    Organization
    Density
    Standby Current-Max
    Parallel/Serial
    Sync/Async
    Word Size
    Memory IC Type
    Bus Directional
    Retransmit Capability
    Output Enable
    Cycle Time
    Height Seated (Max)
    Length
    Width
    Thickness
    RoHS Status
    Lead Free
    Mounting Type
    Operating Temperature
    Packaging
    Series
    Voltage - Supply
    Base Part Number
    Function
    Current - Supply (Max)
    Memory Size
    Data Rate
    FWFT Support
    Expansion Type
    Additional Feature
    Operating Mode
    Memory Density
    View Compare
  • 72T72115L5BB
    72T72115L5BB
    7 Weeks
    Lead, Tin
    Surface Mount
    BGA
    324
    2009
    e0
    no
    Active
    3
    324
    EAR99
    Tin/Lead (Sn63Pb37)
    70°C
    0°C
    8542.32.00.71
    FIFOs
    CMOS
    BOTTOM
    BALL
    225
    1
    2.5V
    1mm
    200MHz
    20
    324
    Not Qualified
    2.5V
    COMMERCIAL
    2.625V
    2.375V
    Dual
    130mA
    130mA
    200MHz
    3.6 ns
    128KX72
    9 Mb
    0.05A
    PARALLEL
    Synchronous
    72b
    OTHER FIFO
    Unidirectional
    Yes
    YES
    5 ns
    1.97mm
    19mm
    19mm
    1.76mm
    RoHS Compliant
    Contains Lead
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • 72T7295L5BB
    12 Weeks
    -
    -
    324-BGA
    -
    -
    -
    -
    Active
    3 (168 Hours)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    10ns, 3.6ns
    -
    -
    -
    -
    -
    -
    -
    Uni-Directional
    -
    -
    -
    -
    -
    -
    -
    Non-RoHS Compliant
    -
    Surface Mount
    0°C~70°C
    Tray
    72T
    2.375V~2.625V
    72T7295
    Asynchronous, Synchronous
    130mA
    2.25M 32K x 72
    83MHz, 200MHz
    Yes
    Depth, Width
    -
    -
    -
  • 72T7295L4-4BB
    7 Weeks
    Lead, Tin
    Surface Mount
    BGA
    324
    2009
    e0
    no
    Active
    3
    324
    EAR99
    Tin/Lead (Sn63Pb37)
    70°C
    0°C
    8542.32.00.71
    FIFOs
    CMOS
    BOTTOM
    BALL
    225
    1
    2.5V
    1mm
    225MHz
    20
    324
    Not Qualified
    2.5V
    COMMERCIAL
    2.625V
    2.375V
    Dual
    130mA
    130mA
    225MHz
    3.4 ns
    32KX72
    2.3 Mb
    0.05A
    PARALLEL
    Synchronous
    72b
    OTHER FIFO
    Unidirectional
    Yes
    YES
    4.44 ns
    1.97mm
    19mm
    19mm
    1.76mm
    RoHS Compliant
    Contains Lead
    -
    -
    Bulk
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • 72T7295L4-4BBG
    7 Weeks
    Copper, Silver, Tin
    Surface Mount
    BGA
    324
    2009
    e1
    yes
    Active
    3
    324
    EAR99
    Tin/Silver/Copper (Sn/Ag/Cu)
    70°C
    0°C
    8542.32.00.71
    FIFOs
    CMOS
    BOTTOM
    BALL
    260
    1
    2.5V
    1mm
    -
    30
    324
    Not Qualified
    2.5V
    COMMERCIAL
    2.625V
    2.375V
    Dual
    -
    130mA
    225MHz
    3.4 ns
    32KX72
    -
    0.02A
    PARALLEL
    -
    -
    OTHER FIFO
    Unidirectional
    Yes
    YES
    4.44 ns
    1.97mm
    19mm
    19mm
    1.76mm
    RoHS Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    ASYNCHRONOUS OPERATION ALSO POSSIBLE
    SYNCHRONOUS
    2359296 bit
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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