IDT, Integrated Device Technology Inc 71V3559S80BQ
- Part Number:
- 71V3559S80BQ
- Manufacturer:
- IDT, Integrated Device Technology Inc
- Ventron No:
- 3721759-71V3559S80BQ
- Description:
- IC SRAM 4.5MBIT 8NS 165CABGA
- Datasheet:
- IDT Suffixes
IDT, Integrated Device Technology Inc 71V3559S80BQ technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc 71V3559S80BQ.
- Factory Lead Time13 Weeks
- Mounting TypeSurface Mount
- Package / Case165-TBGA
- Supplier Device Package165-CABGA (13x15)
- Operating Temperature0°C~70°C TA
- PackagingTray
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- TechnologySRAM - Synchronous, SDR (ZBT)
- Voltage - Supply3.135V~3.465V
- Base Part NumberIDT71V3559
- Memory Size4.5Mb 256K x 18
- Memory TypeVolatile
- Access Time8ns
- Memory FormatSRAM
- Memory InterfaceParallel
- RoHS StatusNon-RoHS Compliant
71V3559S80BQ Overview
The product is a Surface Mount type with an Active status. It has a Moisture Sensitivity Level (MSL) of 3, meaning it can withstand exposure to high humidity for up to 168 hours. The technology used is SRAM - Synchronous, SDR (ZBT), and the Base Part Number is IDT71V3559. It is a Volatile memory type with an Access Time of 8ns. The Memory Format is SRAM and it has a Parallel Memory Interface. This product is currently Non-RoHS Compliant.
71V3559S80BQ Features
Package / Case: 165-TBGA
71V3559S80BQ Applications
There are a lot of Renesas Electronics America Inc.
71V3559S80BQ Memory applications.
Cache memory
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
The product is a Surface Mount type with an Active status. It has a Moisture Sensitivity Level (MSL) of 3, meaning it can withstand exposure to high humidity for up to 168 hours. The technology used is SRAM - Synchronous, SDR (ZBT), and the Base Part Number is IDT71V3559. It is a Volatile memory type with an Access Time of 8ns. The Memory Format is SRAM and it has a Parallel Memory Interface. This product is currently Non-RoHS Compliant.
71V3559S80BQ Features
Package / Case: 165-TBGA
71V3559S80BQ Applications
There are a lot of Renesas Electronics America Inc.
71V3559S80BQ Memory applications.
Cache memory
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
71V3559S80BQ More Descriptions
3.3V 256K x 18 ZBT Synchronous Flow-Through SRAM w/3.3V I/O
IC SRAM 4.5M PARALLEL 165CABGA
IC SRAM 4.5MBIT PAR 165CABGA
IC SRAM 4.5M PARALLEL 165CABGA
IC SRAM 4.5MBIT PAR 165CABGA
The three parts on the right have similar specifications to 71V3559S80BQ.
-
ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSupplier Device PackageOperating TemperaturePackagingPart StatusMoisture Sensitivity Level (MSL)TechnologyVoltage - SupplyBase Part NumberMemory SizeMemory TypeAccess TimeMemory FormatMemory InterfaceRoHS StatusWrite Cycle Time - Word, PageView Compare
-
71V3559S80BQ13 WeeksSurface Mount165-TBGA165-CABGA (13x15)0°C~70°C TATrayActive3 (168 Hours)SRAM - Synchronous, SDR (ZBT)3.135V~3.465VIDT71V35594.5Mb 256K x 18Volatile8nsSRAMParallelNon-RoHS Compliant--
-
12 WeeksSurface Mount64-LQFP64-TQFP (10x10)0°C~70°C TATrayActive3 (168 Hours)SRAM - Dual Port, Asynchronous3V~3.6VIDT71V32116Kb 2K x 8Volatile25nsSRAMParallelROHS3 Compliant25ns
-
-Surface Mount64-LQFP64-TQFP (14x14)-40°C~85°C TATrayObsolete3 (168 Hours)SRAM - Dual Port, Asynchronous3V~3.6VIDT71V32116Kb 2K x 8Volatile25nsSRAMParallelNon-RoHS Compliant25ns
-
-Surface Mount64-LQFP64-TQFP (10x10)-40°C~85°C TATrayObsolete3 (168 Hours)SRAM - Dual Port, Asynchronous3V~3.6VIDT71V308Kb 1K x 8Volatile35nsSRAMParallelNon-RoHS Compliant35ns
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
29 March 2024
TLP2362 Optocoupler Characteristics, Specifications, Working Principle and More
Ⅰ. Overview of TLP2362Ⅱ. Characteristics of TLP2362Ⅲ. Specifications of TLP2362Ⅳ. Recommended operating conditions of TLP2362Ⅴ. How does TLP2362 work?Ⅵ. Internal equivalent circuit of TLP2362Ⅶ. Storage and soldering of... -
29 March 2024
STM32H743VIT6 Specifications, Characteristics, Pinout and Market Situation
Ⅰ. Description of STM32H743VIT6Ⅱ. Specifications of STM32H743VIT6Ⅲ. Characteristics of STM32H743VIT6Ⅳ. How to use STM32H743VIT6?Ⅴ. STM32H743VIT6 pinoutⅥ. Low-power strategy of STM32H743VIT6Ⅶ. Market situation of STM32H743VIT6Ⅰ. Description of STM32H743VIT6The STM32H743VIT6... -
01 April 2024
XCF32PFSG48C Symbol, Manufacturer, Specifications and Programming
Ⅰ. Overview of XCF32PFSG48CⅡ. Symbol, footprint and 3D model of XCF32PFSG48CⅢ. Manufacturer of XCF32PFSG48CⅣ. Reset and power-on reset activationⅤ. Specifications of XCF32PFSG48CⅥ. Programming of XCF32PFSG48CⅦ. In which emerging... -
01 April 2024
M24C16-RMN6TP Structure, Advantages, Package and Other Details
Ⅰ. M24C16-RMN6TP descriptionⅡ. Basic structure and working principle of M24C16-RMN6TPⅢ. Technical parameters of M24C16-RMN6TPⅣ. What are the market competitive advantages of M24C16-RMN6TP?Ⅴ. Package of M24C16-RMN6TPⅥ. Data transmission process...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.