71T75602S150PFGI8
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IDT, Integrated Device Technology Inc 71T75602S150PFGI8

Part Number:
71T75602S150PFGI8
Manufacturer:
IDT, Integrated Device Technology Inc
Ventron No:
3724245-71T75602S150PFGI8
Description:
IC SRAM 18MBIT 150MHZ 100TQFP
ECAD Model:
Datasheet:
71T75602S150PFGI8
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Delivery:
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Reference Price ( In US Dollars )

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Unit Price

Ext Price

  • 1

    $38.9728

    $38.97

  • 200

    $15.0819

    $3016.38

  • 500

    $14.5525

    $7276.25

  • 1000

    $14.2901

    $14290.10

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Part Overview
Description
The 71T75602/71T75802 are high-performance synchronous ZBT™ SRAMs with a 2.5V power supply and 2.5V I/O supply. They are available in 512K x 36 and 1M x 18 memory configurations and support system speeds up to 200 MHz (3.2 ns Clock-to-Data Access).
The ZBT™ feature eliminates dead cycles between write and read cycles, while the internally synchronized output buffer enable eliminates the need to control OE. The single R/W (READ/WRITE) control pin and positive clock-edge triggered address, data, and control signal registers enable fully pipelined applications.
The 71T75602/71T75802 offer a 4-word burst capability (interleaved or linear), individual byte write control, three chip enables for simple depth expansion, and a power down mode controlled by the ZZ input. They are packaged in a JEDEC standard 100-pin plastic thin quad flat pack (TQFP) or 119 ball grid array (BGA) and are available in an industrial temperature range (-40°C to 85°C) for selected speeds.

Features
512K x 36, 1M x 18 memory configurations
Supports high performance system speed - 200 MHz (3.2 ns Clock-to-Data Access)
ZBT™ Feature - No dead cycles between write and read cycles
Internally synchronized output buffer enable eliminates the need to control OE
Single R/W (READ/WRITE) control pin
Positive clock-edge triggered address, data, and control signal registers for fully pipelined applications
4-word burst capability (interleaved or linear)
Individual byte write (BW1 - BW4) control (May tie active)
Three chip enables for simple depth expansion
2.5V power supply (±5%)
2.5V I/O Supply (VDDQ)
Power down controlled by ZZ input
Boundary Scan JTAG Interface (IEEE 1149.1 Compliant)
Packaged in a JEDEC standard 100-pin plastic thin quad flat pack (TQFP), 119 ball grid array (BGA)
Industrial temperature range (-40°C to 85°C) is available for selected speeds

Applications
High-performance computing
Networking
Telecommunications
Industrial automation
Medical imaging
Automotive electronics
Specifications
IDT, Integrated Device Technology Inc 71T75602S150PFGI8 technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc 71T75602S150PFGI8.
  • Factory Lead Time
    14 Weeks
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    100-LQFP
  • Supplier Device Package
    100-TQFP (14x14)
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C TA
  • Packaging
    Tape & Reel (TR)
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    3 (168 Hours)
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    SRAM - Synchronous, SDR (ZBT)
  • Voltage - Supply
    2.375V~2.625V
  • Base Part Number
    IDT71T75
  • Memory Size
    18Mb 512K x 36
  • Memory Type

    Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.

    Volatile
  • Clock Frequency

    Clock Frequency, measured in Hertz (Hz), is the rate at which an electronic component, such as a microprocessor or oscillator, generates electrical pulses. It determines the speed at which the component can process data and execute instructions. A higher clock frequency generally indicates faster performance, but also higher power consumption and heat generation. Clock Frequency is a crucial parameter for timing-sensitive applications, such as digital signal processing and real-time systems.

    150MHz
  • Access Time

    Access time is the time it takes for a memory device to retrieve data from a specific location. It is typically measured in nanoseconds (ns) and is a critical factor in determining the performance of a computer system. The lower the access time, the faster the memory device can retrieve data and the faster the computer can perform tasks.

    3.8ns
  • Memory Format

    Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.

    SRAM
  • Memory Interface
    Parallel
  • RoHS Status
    ROHS3 Compliant
Product Comparison
The three parts on the right have similar specifications to 71T75602S150PFGI8.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Supplier Device Package
    Operating Temperature
    Packaging
    Part Status
    Moisture Sensitivity Level (MSL)
    Technology
    Voltage - Supply
    Base Part Number
    Memory Size
    Memory Type
    Clock Frequency
    Access Time
    Memory Format
    Memory Interface
    RoHS Status
    View Compare
  • 71T75602S150PFGI8
    71T75602S150PFGI8
    14 Weeks
    Surface Mount
    100-LQFP
    100-TQFP (14x14)
    -40°C~85°C TA
    Tape & Reel (TR)
    Active
    3 (168 Hours)
    SRAM - Synchronous, SDR (ZBT)
    2.375V~2.625V
    IDT71T75
    18Mb 512K x 36
    Volatile
    150MHz
    3.8ns
    SRAM
    Parallel
    ROHS3 Compliant
    -
  • 71T75602S166BGI8
    14 Weeks
    Surface Mount
    119-BGA
    119-PBGA (14x22)
    -40°C~85°C TA
    Tape & Reel (TR)
    Active
    3 (168 Hours)
    SRAM - Synchronous, SDR (ZBT)
    2.375V~2.625V
    IDT71T75
    18Mb 512K x 36
    Volatile
    166MHz
    3.5ns
    SRAM
    Parallel
    Non-RoHS Compliant
  • 71T75602S150BGGI8
    14 Weeks
    Surface Mount
    119-BGA
    119-PBGA (14x22)
    -40°C~85°C TA
    Tape & Reel (TR)
    Active
    3 (168 Hours)
    SRAM - Synchronous, SDR (ZBT)
    2.375V~2.625V
    IDT71T75
    18Mb 512K x 36
    Volatile
    150MHz
    3.8ns
    SRAM
    Parallel
    ROHS3 Compliant
  • 71T75802S100BGI8
    14 Weeks
    Surface Mount
    119-BGA
    -
    -40°C~85°C TA
    Tape & Reel (TR)
    Active
    3 (168 Hours)
    SRAM - Synchronous, SDR (ZBT)
    2.375V~2.625V
    IDT71T75
    18Mb 1M x 18
    Volatile
    100MHz
    5ns
    SRAM
    Parallel
    Non-RoHS Compliant
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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