IDT, Integrated Device Technology Inc 7164S35DB

7164S35DB Overview
The mounting type for this particular device is Through Hole, meaning it can be securely attached to a circuit board using holes drilled through the board. The package or case size is 28-CDIP (0.600, 15.24mm), indicating that it is a ceramic dual inline package with a width of 0.600 inches or 15.24 millimeters. The supplier device package is 28-CerDip, which is a ceramic dual inline package with 28 pins. This device is designed to operate in extreme temperatures, with an operating temperature range of -55°C to 125°C. It is packaged in a tube for easy handling and transportation. The technology used for this device is SRAM - Asynchronous, a type of memory that allows for fast data access. The memory size is 64Kb 8K x 8, meaning it can store 64 kilobits of data in an 8K by 8 format. The access time for this device is 35ns, indicating how quickly data can be retrieved from the memory. The memory format is SRAM, confirming that this device is a type of static random access memory. The write cycle time for this device is 35ns, specifically for word and page writes.

7164S35DB Features
Package / Case: 28-CDIP (0.600, 15.24mm)


7164S35DB Applications
There are a lot of Renesas Electronics America Inc.
7164S35DB Memory applications.


eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer