IDT, Integrated Device Technology Inc 7133LA70G
- Part Number:
- 7133LA70G
- Manufacturer:
- IDT, Integrated Device Technology Inc
- Ventron No:
- 3237426-7133LA70G
- Description:
- IC SRAM 32KBIT 70NS 68PGA
- Datasheet:
- 7133LA70G
IDT, Integrated Device Technology Inc 7133LA70G technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc 7133LA70G.
- Factory Lead Time13 Weeks
- Mounting TypeThrough Hole
- Package / Case68-BPGA
- Operating Temperature0°C~70°C TA
- PackagingTray
- Part StatusActive
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- TechnologySRAM - Dual Port, Asynchronous
- Voltage - Supply4.5V~5.5V
- Base Part NumberIDT7133
- Memory Size32Kb 2K x 16
- Memory TypeVolatile
- Memory FormatSRAM
- Memory InterfaceParallel
- Write Cycle Time - Word, Page70ns
- RoHS StatusNon-RoHS Compliant
7133LA70G Overview
The package or case of the product is a 68-BPGA, which stands for Ball Grid Array. This type of packaging is commonly used for integrated circuits and offers a compact and efficient design. The operating temperature range for this product is 0°C to 70°C, making it suitable for a wide range of environments. The packaging method used for this product is a tray, which allows for easy handling and storage. The Moisture Sensitivity Level (MSL) of this product is 1, which means it has an unlimited shelf life when stored properly. The technology used for this product is SRAM - Dual Port, Asynchronous, which provides high-speed data access and processing. With a memory size of 32Kb 2K x 16, this product offers ample storage capacity for various applications. The memory type is volatile, meaning it requires power to retain data. The memory format is SRAM, which stands for Static Random Access Memory, and the memory interface is parallel, allowing for fast data transfer. The write cycle time for this product is 70ns, ensuring efficient and speedy operations.
7133LA70G Features
Package / Case: 68-BPGA
7133LA70G Applications
There are a lot of Renesas Electronics America Inc.
7133LA70G Memory applications.
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
The package or case of the product is a 68-BPGA, which stands for Ball Grid Array. This type of packaging is commonly used for integrated circuits and offers a compact and efficient design. The operating temperature range for this product is 0°C to 70°C, making it suitable for a wide range of environments. The packaging method used for this product is a tray, which allows for easy handling and storage. The Moisture Sensitivity Level (MSL) of this product is 1, which means it has an unlimited shelf life when stored properly. The technology used for this product is SRAM - Dual Port, Asynchronous, which provides high-speed data access and processing. With a memory size of 32Kb 2K x 16, this product offers ample storage capacity for various applications. The memory type is volatile, meaning it requires power to retain data. The memory format is SRAM, which stands for Static Random Access Memory, and the memory interface is parallel, allowing for fast data transfer. The write cycle time for this product is 70ns, ensuring efficient and speedy operations.
7133LA70G Features
Package / Case: 68-BPGA
7133LA70G Applications
There are a lot of Renesas Electronics America Inc.
7133LA70G Memory applications.
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
7133LA70G More Descriptions
PGA-68(29.46x29.46) SRAM ROHS
16M X 36 (288MEG) LLDRAM II COMM
SRAM 32K(2KX16)CMOS DUALPORT R
16M X 36 (288MEG) LLDRAM II COMM
SRAM 32K(2KX16)CMOS DUALPORT R
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