IDT, Integrated Device Technology Inc 70V639S12BFGI

70V639S12BFGI Overview
The package or case of this electronic component is 208-LFBGA, which stands for Low Profile Fine-Pitch Ball Grid Array. This type of package is commonly used for integrated circuits and provides a compact and reliable solution for electronic devices. The Moisture Sensitivity Level (MSL) of this component is 3, indicating that it can withstand exposure to ambient humidity levels for up to 168 hours without any negative effects. The voltage supply for this component ranges from 3.15V to 3.45V, providing a stable and efficient power source. The base part number for this component is IDT70V639, and it has a memory size of 2.25Mb, with a memory format of SRAM. The access time for this component is 12ns, ensuring fast and efficient data retrieval. It has a parallel memory interface, which allows for simultaneous data transfer. The write cycle time for both word and page is 12ns, making it a high-speed component. Additionally, it is RoHS3 compliant, meaning it is environmentally friendly and does not contain any hazardous materials.

70V639S12BFGI Features
Package / Case: 208-LFBGA


70V639S12BFGI Applications
There are a lot of Renesas Electronics America Inc.
70V639S12BFGI Memory applications.


multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory