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IDT, Integrated Device Technology Inc 70V35L15PF8

Name: 70V35L15PF8
Brand: IDT, Integrated Device Technology Inc
SKU: 3724241-70V35L15PF8
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: 70V35L15PF8

Manufacturer:: IDT, Integrated Device Technology Inc

Ventron No:: 3724241-70V35L15PF8

Description:: IC SRAM 144KBIT 15NS 100TQFP

ECAD Model:

Datasheet:: IDT Suffixes

Payment:

Delivery:

Part Overview

Description
The IDT70V35/34/25/24 is a high-speed, low-power, dual-port static RAM (SRAM) with a capacity of 8/4K x 18/16 bits. It features true dual-ported memory cells that allow simultaneous reads of the same memory location. The SRAM operates from a single 3.3V (±0.3V) power supply and is available in a 100-pin TQFP (IDT70V35/34 & IDT70V25/24) and 84-pin PLCC (IDT70V24) package.

Features
True dual-ported memory cells
High-speed access:
IDT70V35: 15ns (max.)
IDT70V34: 15ns (max.)
IDT70V25: 15/35ns (max.)
IDT70V24: 15/35/55ns (max.)
Low-power operation:
IDT70V35/34: Active: 415mW (typ.), Standby: 660μW (typ.)
IDT70V25/24: Active: 400mW (typ.), Standby: 3.3mW (typ.)
IDT70V25/24: Active: 380mW (typ.), Standby: 660uW (typ.)
Separate upper-byte and lower-byte control for multiplexed bus compatibility
Easily expands data bus width to 36 bits (32 bits) or more using the Master/Slave select when cascading more than one device
M/S = VIH for BUSY output flag on Master
M/S = VIL for BUSY input on Slave
BUSY and Interrupt Flag
On-chip port arbitration logic
Full on-chip hardware support of semaphore signaling between ports
Fully asynchronous operation from either port
LVTTL-compatible
Industrial temperature range (-40°C to 85°C) available for selected speeds
Green parts available

Applications
High-speed data buffering
Cache memory
Shared memory between multiple processors
Semaphore signaling
Interrupt handling
FIFO buffers
Stack memory

Specifications

IDT, Integrated Device Technology Inc 70V35L15PF8 technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc 70V35L15PF8.

Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
100-LQFP
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
0°C~70°C TA
Packaging
Tape & Reel (TR)
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Obsolete
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
3 (168 Hours)
Technology
Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.
SRAM - Dual Port, Asynchronous
Voltage - Supply
3V~3.6V
Base Part Number
IDT70V35
Memory Size
144Kb 8K x 18
Memory Type
Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.
Volatile
Memory Format
Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.
SRAM
Memory Interface
Parallel
Write Cycle Time - Word, Page
15ns
RoHS Status
Non-RoHS Compliant

Product Comparison

The three parts on the right have similar specifications to 70V35L15PF8.

Image

Part Number

Manufacturer

Mounting Type

Package / Case

Operating Temperature

Packaging

Part Status

Moisture Sensitivity Level (MSL)

Technology

Voltage - Supply

Base Part Number

Memory Size

Memory Type

Memory Format

Memory Interface

Write Cycle Time - Word, Page

RoHS Status

Factory Lead Time

Supplier Device Package

Clock Frequency

Access Time

View Compare
70V35L15PF8

IDT, Integrated Device Technology Inc

Surface Mount

100-LQFP

0°C~70°C TA

Tape & Reel (TR)

Obsolete

3 (168 Hours)

SRAM - Dual Port, Asynchronous

3V~3.6V

IDT70V35

144Kb 8K x 18

Volatile

SRAM

Parallel

15ns

Non-RoHS Compliant

-

-

-

-

-
70V3319S133BF8

IDT, Integrated Device Technology Inc

Surface Mount

208-LFBGA

0°C~70°C TA

Tape & Reel (TR)

Active

4 (72 Hours)

SRAM - Dual Port, Synchronous

3.15V~3.45V

IDT70V3319

4.5Mb 256K x 18

Volatile

SRAM

Parallel

-

Non-RoHS Compliant

12 Weeks

208-CABGA (15x15)

133MHz

4.2ns

70V35L15PF8 vs 70V3319S133BF8
70V3379S5BC

IDT, Integrated Device Technology Inc

Surface Mount

256-LBGA

0°C~70°C TA

Tray

Active

4 (72 Hours)

SRAM - Dual Port, Synchronous

3.15V~3.45V

IDT70V3379

576Kb 32K x 18

Volatile

SRAM

Parallel

-

Non-RoHS Compliant

10 Weeks

256-CABGA (17x17)

-

5ns

70V35L15PF8 vs 70V3379S5BC
70V3389S4BCG

IDT, Integrated Device Technology Inc

Surface Mount

256-LBGA

0°C~70°C TA

Tray

Active

3 (168 Hours)

SRAM - Dual Port, Synchronous

3.15V~3.45V

IDT70V3389

1.125Mb 64K x 18

Volatile

SRAM

Parallel

-

ROHS3 Compliant

10 Weeks

256-CABGA (17x17)

-

4.2ns

70V35L15PF8 vs 70V3389S4BCG