IDT, Integrated Device Technology Inc 70V3319S133BFI8

70V3319S133BFI8 Overview
The package or case for this particular product is 208-LFBGA, which is a type of surface mount package commonly used for integrated circuits. The operating temperature range for this product is -40°C to 85°C, making it suitable for a wide range of environments. The packaging for this product is tape and reel, which is a method of packaging electronic components for shipping and storage. The part status is active, meaning that it is currently in production and available for purchase. This product utilizes SRAM technology, specifically dual port and synchronous. The voltage supply for this product is 3.15V to 3.45V. The memory size is 4.5Mb, with a configuration of 256K x 18. This product is classified as volatile memory, meaning that it requires power to retain data. The memory format is SRAM, which stands for static random-access memory. It is important to note that this product is not compliant with RoHS standards, meaning that it contains substances that are harmful to the environment.

70V3319S133BFI8 Features
Package / Case: 208-LFBGA


70V3319S133BFI8 Applications
There are a lot of Renesas Electronics America Inc.
70V3319S133BFI8 Memory applications.


mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer