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70V261S55PF8
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IDT, Integrated Device Technology Inc 70V261S55PF8

Part Number:

70V261S55PF8

Manufacturer:

IDT, Integrated Device Technology Inc

Ventron No:

3724250-70V261S55PF8

Description:

IC SRAM 256KBIT 55NS 100TQFP

ECAD Model:

Datasheet:

IDT Suffixes

Payment:

Payment

Delivery:

Delivery

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Reference Price ( In US Dollars )

Pricing

Qty

Unit Price

Ext Price

  • 1

    $63.5830

    $63.58

  • 200

    $25.3706

    $5074.12

  • 750

    $24.5231

    $18392.33

  • 1500

    $24.1039

    $36155.85

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    One Stop Service

  • Competitive Price

    Competitive Price

  • Source Traceability

    Source Traceability

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    Same Day Delivery

Part Overview

Description
The IDT70V261S/L is a high-speed, 3.3V, 16K x 16 dual-port static RAM with true dual-ported memory cells that allow simultaneous access to the same memory location. It features low-power operation, separate upper-byte and lower-byte control for multiplexed bus compatibility, and an on-chip port arbitration logic.

Features
True dual-ported memory cells
High-speed access:
Commercial: 25/35ns (max.)
Industrial: 25ns (max.)
Low-power operation:
IDT70V261S:
Active: 300mW (typ.)
Standby: 3.3mW (typ.)
IDT70V261L:
Active: 300mW (typ.)
Standby: 660μW (typ.)
Separate upper-byte and lower-byte control for multiplexed bus compatibility
On-chip port arbitration logic
Full on-chip hardware support of semaphore signaling between ports
Fully asynchronous operation from either port
TTL-compatible, single 3.3V (±0.3V) power supply
Available in a 100-pin TQFP
Industrial temperature range (-40°C to 85°C) available for selected speed

Applications
Data buffering
Cache memory
Shared memory
Semaphore signaling
Multiprocessor systems

Specifications

IDT, Integrated Device Technology Inc 70V261S55PF8 technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc 70V261S55PF8.

  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    100-LQFP
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    0°C~70°C TA
  • Packaging
    Tape & Reel (TR)
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    3 (168 Hours)
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    SRAM - Dual Port, Asynchronous
  • Voltage - Supply
    3V~3.6V
  • Base Part Number
    IDT70V261
  • Memory Size
    256Kb 16K x 16
  • Memory Type

    Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.

    Volatile
  • Memory Format

    Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.

    SRAM
  • Memory Interface
    Parallel
  • Write Cycle Time - Word, Page
    55ns
  • RoHS Status
    Non-RoHS Compliant

Product Comparison

The three parts on the right have similar specifications to 70V261S55PF8.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Operating Temperature
    Packaging
    Part Status
    Moisture Sensitivity Level (MSL)
    Technology
    Voltage - Supply
    Base Part Number
    Memory Size
    Memory Type
    Memory Format
    Memory Interface
    Write Cycle Time - Word, Page
    RoHS Status
    Supplier Device Package
    Access Time
    View Compare
  • 70V261S55PF8
    70V261S55PF8
    IDT, Integrated Device Technology Inc
    Surface Mount
    100-LQFP
    0°C~70°C TA
    Tape & Reel (TR)
    Obsolete
    3 (168 Hours)
    SRAM - Dual Port, Asynchronous
    3V~3.6V
    IDT70V261
    256Kb 16K x 16
    Volatile
    SRAM
    Parallel
    55ns
    Non-RoHS Compliant
    -
    -
    -
  • 70V24L35PF
    70V24L35PF
    IDT, Integrated Device Technology Inc
    Surface Mount
    100-LQFP
    0°C~70°C TA
    Tray
    Obsolete
    3 (168 Hours)
    SRAM - Dual Port, Asynchronous
    3V~3.6V
    IDT70V24
    64Kb 4K x 16
    Volatile
    SRAM
    Parallel
    35ns
    Non-RoHS Compliant
    -
    -
    70V261S55PF8 vs 70V24L35PF
  • 70V24L25J
    70V24L25J
    IDT, Integrated Device Technology Inc
    Surface Mount
    84-LCC (J-Lead)
    0°C~70°C TA
    Tube
    Obsolete
    3 (168 Hours)
    SRAM - Dual Port, Asynchronous
    3V~3.6V
    IDT70V24
    64Kb 4K x 16
    Volatile
    SRAM
    Parallel
    25ns
    Non-RoHS Compliant
    84-PLCC (29.21x29.21)
    25ns
    70V261S55PF8 vs 70V24L25J
  • 70V24L15J
    70V24L15J
    IDT, Integrated Device Technology Inc
    Surface Mount
    84-LCC (J-Lead)
    0°C~70°C TA
    Tube
    Obsolete
    3 (168 Hours)
    SRAM - Dual Port, Asynchronous
    3V~3.6V
    IDT70V24
    64Kb 4K x 16
    Volatile
    SRAM
    Parallel
    15ns
    Non-RoHS Compliant
    84-PLCC (29.21x29.21)
    15ns
    70V261S55PF8 vs 70V24L15J

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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