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IDT, Integrated Device Technology Inc 7024S15J

Name: 7024S15J
Brand: IDT, Integrated Device Technology Inc
SKU: 3724244-7024S15J
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: 7024S15J

Manufacturer:: IDT, Integrated Device Technology Inc

Ventron No:: 3724244-7024S15J

Description:: IC SRAM 64KBIT 15NS 84PLCC

ECAD Model:

Datasheet:: 7024S15J

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Part Overview

Description
The IDT7024S/L is a high-speed 4K x 16 dual-port static RAM with true dual-ported memory cells that allow simultaneous reads of the same memory location. It features separate upper-byte and lower-byte control for multiplexed bus compatibility, making it easy to expand data bus width to 32 bits or more when cascading multiple devices. The IDT7024S/L also includes on-chip port arbitration logic for full hardware support of semaphore signaling between ports and fully asynchronous operation from either port.

Features
True dual-ported memory cells
High-speed access:
Commercial: 15/17/20/25/35/55ns (max.)
Industrial: 20ns (max.)
Military: 20/25/35/55/70ns (max.)
Low-power operation:
IDT7024S:
Active: 750mW (typ.)
Standby: 5mW (typ.)
IDT7024L:
Active: 750mW (typ.)
Standby: 1mW (typ.)
Separate upper-byte and lower-byte control for multiplexed bus compatibility
On-chip port arbitration logic
Full on-chip hardware support of semaphore signaling between ports
Fully asynchronous operation from either port
Battery backup operation (2V data retention)
TTL-compatible, single 5V (±10%) power supply
Available in 84-pin PGA, Flatpack, PLCC, and 100-pin Thin Quad Flatpack
Industrial temperature range (-40°C to 85°C) available for selected speeds
Green parts available

Applications
High-speed data buffering
Shared memory in multiprocessor systems
Cache memory
Graphics memory
Telecommunications
Industrial control

Specifications

IDT, Integrated Device Technology Inc 7024S15J technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc 7024S15J.

Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
84-LCC (J-Lead)
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
0°C~70°C TA
Packaging
Tube
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Obsolete
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
3 (168 Hours)
Technology
Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.
SRAM - Dual Port, Asynchronous
Voltage - Supply
4.5V~5.5V
Base Part Number
IDT7024
Memory Size
64Kb 4K x 16
Memory Type
Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.
Volatile
Memory Format
Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.
SRAM
Memory Interface
Parallel
Write Cycle Time - Word, Page
15ns
RoHS Status
Non-RoHS Compliant

Product Comparison

The three parts on the right have similar specifications to 7024S15J.

Image

Part Number

Manufacturer

Mounting Type

Package / Case

Operating Temperature

Packaging

Part Status

Moisture Sensitivity Level (MSL)

Technology

Voltage - Supply

Base Part Number

Memory Size

Memory Type

Memory Format

Memory Interface

Write Cycle Time - Word, Page

RoHS Status

Factory Lead Time

Supplier Device Package

Access Time

View Compare
7024S15J

IDT, Integrated Device Technology Inc

Surface Mount

84-LCC (J-Lead)

0°C~70°C TA

Tube

Obsolete

3 (168 Hours)

SRAM - Dual Port, Asynchronous

4.5V~5.5V

IDT7024

64Kb 4K x 16

Volatile

SRAM

Parallel

15ns

Non-RoHS Compliant

-

-

-

-
7024L17J8

IDT, Integrated Device Technology Inc

Surface Mount

84-LCC (J-Lead)

0°C~70°C TA

Tape & Reel (TR)

Obsolete

3 (168 Hours)

SRAM - Dual Port, Asynchronous

4.5V~5.5V

IDT7024

64Kb 4K x 16

Volatile

SRAM

Parallel

17ns

Non-RoHS Compliant

-

-

-

7024S15J vs 7024L17J8
7024L20FB

IDT, Integrated Device Technology Inc

Surface Mount

84-FlatPack

-55°C~125°C TA

Tray

Active

1 (Unlimited)

SRAM - Dual Port, Asynchronous

4.5V~5.5V

-

64Kb 4K x 16

Volatile

SRAM

Parallel

20ns

Non-RoHS Compliant

13 Weeks

84-FLATPAK

20ns

7024S15J vs 7024L20FB
7024L17PF

IDT, Integrated Device Technology Inc

Surface Mount

100-LQFP

0°C~70°C TA

Tray

Obsolete

3 (168 Hours)

SRAM - Dual Port, Asynchronous

4.5V~5.5V

IDT7024

64Kb 4K x 16

Volatile

SRAM

Parallel

17ns

Non-RoHS Compliant

-

-

-

7024S15J vs 7024L17PF