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IDT, Integrated Device Technology Inc 7015S17J

Name: 7015S17J
Brand: IDT, Integrated Device Technology Inc
SKU: 3724246-7015S17J
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: 7015S17J

Manufacturer:: IDT, Integrated Device Technology Inc

Ventron No:: 3724246-7015S17J

Description:: IC SRAM 72KBIT 17NS 68PLCC

ECAD Model:

Datasheet:: 7015S17J

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Part Overview

Description
The RENESAS HIGH-SPEED 8K x 9 DUAL-PORT STATIC RAM 7015L is a high-performance memory device featuring true dual-ported memory cells that enable simultaneous reads of the same memory location. It offers fast access speeds of 12ns (max.) and low power consumption, with active power consumption of 750mW (typ.) and standby power consumption of 1mW (typ.).

Features
True dual-ported memory cells
High-speed access: 12ns (max.)
Low-power operation: 750mW (typ.) active, 1mW (typ.) standby
Expandable data bus width to 18 bits or more using Master/Slave select
On-chip port arbitration logic
Full hardware support for semaphore signaling between ports
Fully asynchronous operation from either port
TTL-compatible, single 5V (±10%) power supply
Available in 68-pin PLCC
Green parts available

Applications
High-speed data buffering
Cache memory
Shared memory between multiple processors
Semaphore signaling
Interrupt handling

Specifications

IDT, Integrated Device Technology Inc 7015S17J technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc 7015S17J.

Mounting Type
Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.
Surface Mount
Package / Case
Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.
68-LCC (J-Lead)
Operating Temperature
Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.
0°C~70°C TA
Packaging
Tube
Part Status
Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.
Obsolete
Moisture Sensitivity Level (MSL)
Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.
3 (168 Hours)
Technology
Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.
SRAM - Dual Port, Asynchronous
Voltage - Supply
4.5V~5.5V
Base Part Number
IDT7015
Memory Size
72Kb 8K x 9
Memory Type
Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.
Volatile
Memory Format
Memory Format refers to the arrangement and organization of data within a memory device. It specifies the number of bits, bytes, or words stored in each memory location and how they are accessed.
SRAM
Memory Interface
Parallel
Write Cycle Time - Word, Page
17ns
RoHS Status
Non-RoHS Compliant